Abstract: An acoustic wave device is disclosed. The acoustic wave device includes a piezoelectric layer, an interdigital transducer electrode positioned over the piezoelectric layer, and an anti-refection layer over a conductive layer of the interdigital transducer electrode. The conductive layer can include aluminum, for example. The anti-reflection layer can include silicon. The anti-reflection layer can be free from a material of the interdigital transducer electrode. The acoustic wave device can further include a temperature compensation layer positioned over the anti-reflection layer in certain embodiments.

Abstract: Methods of manufacturing an acoustic wave device are disclosed. An anti-reflection layer can be formed over a conductive layer that is over a piezoelectric layer. The conductive layer can include aluminum, for example. The anti-reflection layer can remain distinct from the conductive layer after a heating process. A photolithography process can pattern an interdigital transducer of the acoustic wave device from one or more interdigital transducer electrode layers that include the conductive layer. The anti-reflection layer can reduce reflection from the conductive layer during the photolithography process.

Abstract: An acoustic wave device includes a piezoelectric substrate, a pair of interleaved interdigital transducer electrodes disposed on the piezoelectric substrate, and a dielectric film including silicon oxynitride covering the pair of interleaved interdigital transducer electrodes. The dielectric film exhibits a temperature coefficient of velocity of substantially zero throughout an operating temperature range of the acoustic wave device of between ?55° C. and 125° C.

Abstract: An acoustic wave device is disclosed. The acoustic wave device includes a piezoelectric layer, an interdigital transducer electrode positioned over the piezoelectric layer, and an anti-refection layer over a conductive layer of the interdigital transducer electrode. The conductive layer can include aluminum, for example. The anti-reflection layer can include silicon. The anti-reflection layer can be free from a material of the interdigital transducer electrode. The acoustic wave device can further include a temperature compensation layer positioned over the anti-reflection layer in certain embodiments.

Abstract: Methods of manufacturing an acoustic wave device are disclosed. An anti-reflection layer can be formed over a conductive layer that is over a piezoelectric layer. The conductive layer can include aluminum, for example. The anti-reflection layer can remain distinct from the conductive layer after a heating process. A photolithography process can pattern an interdigital transducer of the acoustic wave device from one or more interdigital transducer electrode layers that include the conductive layer. The anti-reflection layer can reduce reflection from the conductive layer during the photolithography process.

Abstract: In a spinning forming method, a plate including a peripheral portion at which a ring-shaped projection is provided is used, the projection projecting in a thickness direction of the plate. Further, while rotating the plate, a transform target portion of the plate is locally heated, and a processing tool is pressed against the transform target portion to transform the plate. According to this configuration, a heat capacity of the peripheral portion of the plate can be increased. With this, when heating the vicinity of the peripheral portion of the plate, the peripheral portion can be prevented from becoming high in temperature. As a result, deformation of the peripheral portion of the plate can be suppressed.

Abstract: An acoustic wave device is disclosed. The acoustic wave device includes a piezoelectric layer, an interdigital transducer electrode positioned over the piezoelectric layer, and an anti-refection layer over a conductive layer of the interdigital transducer electrode. The conductive layer can include aluminum, for example. The anti-reflection layer can include silicon. The anti-reflection layer can be free from a material of the interdigital transducer electrode. The acoustic wave device can further include a temperature compensation layer positioned over the anti-reflection layer in certain embodiments.

Abstract: A method of manufacturing a preliminary formed body includes an ironing step and a thickening step. In the ironing step, a predetermined range of a plate is formed into a tapered shape in such a manner that while rotating the plate, a transform target portion of the plate is locally heated by induction heating, and a processing tool is pressed against the transform target portion. In the thickening step, a peripheral portion that is a distal end of the tapered shape of the plate is expanded inward in such a manner that while rotating the plate, the peripheral portion is locally heated, and a forming roller is pressed against the peripheral portion to push the peripheral portion in a direction orthogonal to a thickness direction of the peripheral portion.

Abstract: First, an annular first layer including a plurality of beads and having a width that is not less than twice a width of the bead is formed by laser metal deposition on a peripheral surface of a base metal, the peripheral surface facing outward or inward in a radial direction. Next, a plurality of annular height raising layers each including a plurality of beads are stacked on the first layer by the laser metal deposition. According to this configuration, an axisymmetric body including a flange portion having a relatively wide width can be manufactured while making a heat affected zone in the base metal extremely small.

Abstract: According to a spinning forming device, while a plate is rotated by a rotating shaft, a transform target portion of the plate is pressed by a processing tool and locally heated by a heater that performs induction heating. The heater includes a coil portion having a doubled circular-arc shape and is inclined by an inclining device relative to a direction from the rotating shaft toward the processing tool. A measuring unit measures distances each from the coil portion to an outer peripheral original portion of the plate at a plurality of measurement points distributed in a circumferential direction of the rotating shaft. A controller controls the inclining device based on a measurement result of the measuring unit such that an angle difference between the coil portion and the outer peripheral original portion becomes not more than a predetermined angle.

Abstract: A spinning forming device includes: a rotating shaft that rotates a plate to be formed; a processing tool that presses a front surface of the plate while being moved outward in a radial direction of the rotating shaft; and a heater that is moved so as to be located on the same circumference as the processing tool and locally heats the plate by induction heating. The spinning forming device further includes a cooling device that cools the front surface of the plate.

Abstract: An acoustic wave device includes a piezoelectric substrate, a pair of interleaved interdigital transducer electrodes disposed on the piezoelectric substrate, and a dielectric film including silicon oxynitride covering the pair of interleaved interdigital transducer electrodes. The dielectric film exhibits a temperature coefficient of velocity of substantially zero throughout an operating temperature range of the acoustic wave device of between ?55° C. and 125° C.

Abstract: A protection film for a surface acoustic wave element, the protection film being configured to prevent moisture absorption into a silicon dioxide film to improve the moisture resistance capability and configured to be unsusceptible to oxidation and stable such that the propagation characteristics of the surface acoustic wave are not adversely affected. The surface acoustic wave element includes a piezoelectric substrate having a top surface, an IDT electrode formed on the top surface of the piezoelectric substrate and including a plurality of electrode fingers configured to excite a surface acoustic wave, a first silicon dioxide film formed to cover the comb-shaped electrode on the top surface of the piezoelectric substrate, a silicon oxynitride film formed over and in contact with the first silicon dioxide film, and a second silicon dioxide film formed over and in contact with the silicon oxynitride film.

Abstract: A spinning forming method is a method of forming a formation target region of a plate into a tapered shape by using a processing tool while rotating the plate. The processing tool is moved from an inside edge of the formation target region to an outside edge of the formation target region while being pressed against the plate. The plate is rotated in a state where a position of the processing tool is fixed at the outside edge.

Abstract: A spinning forming device includes: a rotating shaft that rotates a plate to be formed; a processing tool that presses a front surface of the plate while being moved outward in a radial direction of the rotating shaft; and a heater that is moved so as to be located on the same circumference as the processing tool and locally heats the plate by induction heating. The spinning forming device further includes a cooling device that cools the front surface of the plate.

Abstract: First, an annular first layer including a plurality of beads and having a width that is not less than twice a width of the bead is formed by laser metal deposition on a peripheral surface of a base metal, the peripheral surface facing outward or inward in a radial direction. Next, a plurality of annular height raising layers each including a plurality of beads are stacked on the first layer by the laser metal deposition. According to this configuration, an axisymmetric body including a flange portion having a relatively wide width can be manufactured while making a heat affected zone in the base metal extremely small.

Abstract: A method of manufacturing a preliminary formed body includes an ironing step and a thickening step. In the ironing step, a predetermined range of a plate is formed into a tapered shape in such a manner that while rotating the plate, a transform target portion of the plate is locally heated by induction heating, and a processing tool is pressed against the transform target portion. In the thickening step, a peripheral portion that is a distal end of the tapered shape of the plate is expanded inward in such a manner that while rotating the plate, the peripheral portion is locally heated, and a forming roller is pressed against the peripheral portion to push the peripheral portion in a direction orthogonal to a thickness direction of the peripheral portion.

Abstract: According to a spinning forming device, while a plate is rotated by a rotating shaft, a transform target portion of the plate is pressed by a processing tool and locally heated by a heater that performs induction heating. The heater includes a coil portion having a doubled circular-arc shape and is inclined by an inclining device relative to a direction from the rotating shaft toward the processing tool. A measuring unit measures distances each from the coil portion to an outer peripheral original portion of the plate at a plurality of measurement points distributed in a circumferential direction of the rotating shaft. A controller controls the inclining device based on a measurement result of the measuring unit such that an angle difference between the coil portion and the outer peripheral original portion becomes not more than a predetermined angle.

Abstract: In a spinning forming method, a plate including a peripheral portion at which a ring-shaped projection is provided is used, the projection projecting in a thickness direction of the plate. Further, while rotating the plate, a transform target portion of the plate is locally heated, and a processing tool is pressed against the transform target portion to transform the plate. According to this configuration, a heat capacity of the peripheral portion of the plate can be increased. With this, when heating the vicinity of the peripheral portion of the plate, the peripheral portion can be prevented from becoming high in temperature. As a result, deformation of the peripheral portion of the plate can be suppressed.

Abstract: A microwave heating apparatus includes a processing chamber for accommodating a target, a support device for supporting the target in the processing chamber and a microwave introducing device for generating microwaves to introduce them into the processing chamber. The processing chamber further includes a top wall having a plurality of microwave introduction ports to introduce the microwaves generated in the microwave introducing device into the processing chamber. Each of the microwave introduction ports has a rectangular shape having long sides and short sides parallel to inner wall surfaces of four sidewalls of the processing chamber, and the support device includes a support member to support the target and a rotating mechanism for rotating the supported target.