Patents by Inventor Yoshiro Kumatani

Yoshiro Kumatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6577016
    Abstract: A semiconductor device includes a print wiring board having a element mounting section, a wire connecting section and a wiring section for connecting the element mounting section with the wire connecting section, all of which are provided at least one by one on a same surface of the printing wiring board, wherein a semiconductor element is fixed to be mounted on the element mounting section with an adhesive, and is wire-bonded to the wire connecting section, and the wiring section is provided with inflow preventing means for preventing the adhesive or a component contained in the adhesive from flowing into the wire connecting section via the wiring section.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: June 10, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Yoshiro Kumatani
  • Publication number: 20020149119
    Abstract: A semiconductor device includes a print wiring board having a element mounting section, a wire connecting section and a wiring section for connecting the element mounting section with the wire connecting section, all of which are provided at least one by one on a same surface of the printing wiring board, wherein a semiconductor element is fixed to be mounted on the element mounting section with an adhesive, and is wire-bonded to the wire connecting section, and the wiring section is provided with inflow preventing means for preventing the adhesive or a component contained in the adhesive from flowing into the wire connecting section via the wiring section.
    Type: Application
    Filed: April 11, 2002
    Publication date: October 17, 2002
    Inventor: Yoshiro Kumatani