Patents by Inventor Yoshitaka Ishibashi

Yoshitaka Ishibashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200402820
    Abstract: A cover for a swing member of a substrate processing apparatus includes an upper surface including a first groove, and a first side edge and a second side edge located respectively at both ends of the upper surface in the short-length direction of the cover, where a bottom portion of the first groove is located lower than the first side edge and the second side edge.
    Type: Application
    Filed: June 22, 2020
    Publication date: December 24, 2020
    Inventors: Yoshitaka KITAGAWA, Hisajiro NAKANO, Tomoatsu ISHIBASHI
  • Patent number: 10851199
    Abstract: An epoxy (meth)acrylate compound represented by general formula (1): where at least one of R1 to R5 has a structure represented by formula (2): * denotes the bonding position to a carbon atom that constitutes the benzene ring to which R1 to R5 are bonded in formula (1), R7 denotes a hydrogen atom or a methyl group, the remainder of R1 to R5 are each independently selected from the group consisting of hydrogen atoms, alkyl groups and alkoxy groups having 1-6 carbon atoms, and R6 denotes a hydrogen atom or a methyl group. In the epoxy (meth)acrylate compound, the content of halogen atoms is 100 ppm by mass or less. A curable composition for forming a protective film for an electrically conductive pattern obtained by mixing the epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: December 1, 2020
    Assignee: SHOWA DENKO K. K.
    Inventors: Masahiko Toba, Jun Dou, Chika Yamashita, Yoshitaka Ishibashi, Hiroshi Uchida
  • Patent number: 10743769
    Abstract: A skin evaluation apparatus includes a shape information acquisition unit 22 that acquires information on a surface unevenness shape of the skin; an optical feature information acquisition unit 23 that acquires information on an optical feature of the skin; and an evaluation unit 24 that evaluates gloss of the skin on the basis of the information on the surface unevenness shape and the information on the optical feature.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: August 18, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Naoko Yoshida, Yoshitaka Yamaguchi, Hideyasu Ishibashi, Eriko Ikeda, Takeharu Tani
  • Patent number: 10689493
    Abstract: A thermosetting resin composition includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). Polyalkenyl phenol resin (A) has at least one aromatic ring unit (a1) which may have a 2-alkenyl group bonded thereto and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group and which may have a 2-alkenyl group bonded thereto. At least one of aromatic ring units (a1, a2) has a 2-alkenyl group. Each aromatic ring unit is bonded by a linking group. When m represents the number of aromatic ring units (a1), and n represents the number of aromatic ring units (a2), n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 23, 2020
    Assignee: SHOWA DENKO K.K.
    Inventors: Hiromi Otake, Aoi Nakano, Chika Yamashita, Yoshitaka Ishibashi, Hiroshi Uchida
  • Publication number: 20200181365
    Abstract: A curing accelerator can exhibit good curing acceleration performance and is excellent in storage stability, while maintaining sufficient pot life in a curing reaction of radical-polymerizable resins, and a radical-polymerizable resin composition uses the curing accelerator. The curing accelerator for radical-polymerizable resins includes a metal-containing compound (A), a thiol compound (B) and an aprotic solvent (C) having a dielectric constant of 10 or less, wherein the metal-containing compound (A) is one or more compounds selected from a metal soap (A1) and a ?-diketone skeleton-having metal complex (A2), the thiol compound (B) is one or more compounds selected from a mono-functional primary thiol compound (B1), a secondary thiol compound (B2) and a tertiary thiol compound (B3), and the content of the aprotic solvent (C) is 10 to 1,000 parts by mass relative to 100 parts by mass of the total of the metal-containing compound (A) and the thiol compound (B).
    Type: Application
    Filed: September 4, 2017
    Publication date: June 11, 2020
    Applicant: SHOWA DENKO K.K.
    Inventors: Yoichiro SAKAGUCHI, Takuya MINAMI, Yoshishige OKUNO, Atsushi UMINO, Yoshitaka ISHIBASHI
  • Publication number: 20200031966
    Abstract: A curable resin composition provides a cured resin product having excellent heat resistance and flame retardancy by curing. The curable resin composition includes a polyalkenyl phenol compound (A) and a polymaleimide compound (B), wherein the polyalkenyl phenol compound (A) is a compound containing at least two structural units represented by the following formula (1a): where R1 to R7 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, a C2-6 alkenyl group, or a hydroxy group, Y1 is an alkenyl group.
    Type: Application
    Filed: April 4, 2018
    Publication date: January 30, 2020
    Applicant: SHOWA DENKO K.K.
    Inventors: Aoi HASEGAWA, Yoshitaka ISHIBASHI
  • Patent number: 10388581
    Abstract: A semiconductor device includes an insulating substrate, a semiconductor element provided on the insulating substrate, a case frame, a press-fit terminal, and a sealing member provided on an inner side of an inner wall part on the insulating substrate to seal the semiconductor element. The case frame is made of an insulating material and includes an outer wall part, an inner wall part, a recess bottom surface forming a recess together with the outer wall part and the inner wall part. The press-fit terminal includes a base part, a body part, and a press-in portion. The base part is embedded in the recess bottom surface and the body part stands upright from the recess bottom surface such that the body part extends between the inner wall part and the outer wall part, and the press-in portion protrudes up out of the recess.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: August 20, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hidetoshi Ishibashi, Shinsuke Asada, Yoshitaka Kimura, Minoru Egusa
  • Publication number: 20190225566
    Abstract: Provided is a method with which it is possible to produce a polyalkenylphenol compound having a narrow molecular weight distribution and low viscosity at high purity and high yield. A poly 2-alkenyl aromatic ether compound having two or more phenol skeletons is subjected to Claisen rearrangement in the presence of a phenol or naphthol compound.
    Type: Application
    Filed: August 9, 2017
    Publication date: July 25, 2019
    Applicant: SHOWA DENKO K.K.
    Inventors: Aoi HASEGAWA, Yoshitaka ISHIBASHI
  • Publication number: 20190180782
    Abstract: A magnetic recording medium includes a substrate, an underlayer provided on the substrate, and a magnetic layer provided on the underlayer and having a L10 structure and a (001) orientation. The magnetic layer has a granular structure in which an organic compound having a methylene skeleton or a methine skeleton is arranged at grain boundaries of magnetic grains.
    Type: Application
    Filed: October 24, 2018
    Publication date: June 13, 2019
    Inventors: Katsumi MUROFUSHI, Yoshitaka ISHIBASHI, Takayuki FUKUSHIMA, Kazuya NIWA, Lei ZHANG, Yuji MURAKAMI, Hisato SHIBATA, Takehiro YAMAGUCHI, Chen XU, Tetsuya KANBE, Tomoo SHIGE
  • Publication number: 20190153149
    Abstract: [Problem] To provide an epoxy (meth)acrylate compound that serves as a material for a protective film that is unlikely to cause migration to an electrically conductive pattern, and a curable composition containing the epoxy (meth)acrylate compound. [Solution] Provided is an epoxy (meth)acrylate compound which is characterized by being represented by general formula (1) and in which the content of halogen atoms, which are impurities, is 100 ppm by mass or less. In addition, provided is a curable composition for forming a protective film for an electrically conductive pattern, the curable composition being obtained by mixing this epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group.
    Type: Application
    Filed: July 24, 2017
    Publication date: May 23, 2019
    Applicant: SHOWA DENKO K. K.
    Inventors: Masahiko TOBA, Jun DOU, Chika YAMASHITA, Yoshitaka ISHIBASHI, Hiroshi UCHIDA
  • Patent number: 10160737
    Abstract: A polyvalent glycidyl compound is produced from a compound having one or more 2-alkenyl ether groups and two or more 2-alkenyl groups using a hydrogen peroxide aqueous solution as an oxidizing agent to oxidize the 2-alkenyl ether groups and the 2-alkenyl groups. A 2-alkenyl ether compound having two or more (un)substituted 2-alkenyl groups and one or more (un)substituted 2-alkenyl ether groups is oxidized using a hydrogen peroxide aqueous solution as an oxidizing agent in the presence of a tungsten compound and a quaternary ammonium salt as catalysts and of phosphoric acid as a co-catalyst, while controlling the pH of the reaction solution to 1.0-4.0 using an acid other than phosphoric acid. During the oxidation, the step of adding the hydrogen peroxide aqueous solution to the reaction solution and the step of adding the acid other than phosphoric acid thereto are alternately repeated at intervals two or more times.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: December 25, 2018
    Assignee: SHOWA DENKO K.K.
    Inventors: Chika Yamashita, Yoshitaka Ishibashi
  • Patent number: 10160856
    Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: December 25, 2018
    Assignee: SHOWA DENKO K.K.
    Inventors: Hiromi Otake, Aoi Nakano, Chika Yamashita, Yoshitaka Ishibashi, Hiroshi Uchida
  • Publication number: 20180282494
    Abstract: Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m+n) is 10-60%.
    Type: Application
    Filed: December 11, 2015
    Publication date: October 4, 2018
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiromi OTAKE, Aoi NAKANO, Chika YAMASHITA, Yoshitaka ISHIBASHI, Hiroshi UCHIDA
  • Publication number: 20170349743
    Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%.
    Type: Application
    Filed: December 11, 2015
    Publication date: December 7, 2017
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiromi OTAKE, Aoi NAKANO, Chika YAMASHITA, Yoshitaka ISHIBASHI, Hiroshi UCHIDA
  • Publication number: 20170342042
    Abstract: A polyvalent glycidyl compound is produced from a compound having one or more 2-alkenyl ether groups and two or more 2-alkenyl groups using a hydrogen peroxide aqueous solution as an oxidizing agent to oxidize the 2-alkenyl ether groups and the 2-alkenyl groups. A 2-alkenyl ether compound having two or more (un)substituted 2-alkenyl groups and one or more (un)substituted 2-alkenyl ether groups is oxidized using a hydrogen peroxide aqueous solution as an oxidizing agent in the presence of a tungsten compound and a quaternary ammonium salt as catalysts and of phosphoric acid as a co-catalyst, while controlling the pH of the reaction solution to 1.0-4.0 using an acid other than phosphoric acid. During the oxidation, the step of adding the hydrogen peroxide aqueous solution to the reaction solution and the step of adding the acid other than phosphoric acid thereto are alternately repeated at intervals two or more times.
    Type: Application
    Filed: October 28, 2015
    Publication date: November 30, 2017
    Applicant: SHOWA DENKO K.K.
    Inventors: Chika YAMASHITA, Yoshitaka ISHIBASHI
  • Patent number: 9701874
    Abstract: [Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, preferably 50 mass ppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: July 11, 2017
    Assignee: SHOWA DENKO K.K.
    Inventors: Hiroshi Uchida, Yoshitaka Ishibashi
  • Patent number: 9440907
    Abstract: Provided is a method for producing a 2-alkenylamine compound efficiently and at low cost, using a primary or secondary amine compound and a 2-alkenyl compound as the starting materials therefor. The 2-alkenylamine compound is produced by adding Bronsted acid when 2-alkenylating by reacting the primary or secondary amine compound with the 2-alkenyl compound, and 2-alkenylating in the presence of a catalyst comprising a complexing agent and a transition metal precursor stabilized by a monovalent anionic five-membered conjugated diene.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: September 13, 2016
    Assignees: SHOWA DENKO K.K., NATIONAL UINVERSITY CORPORATION NAGOYA UNIVERSITY
    Inventors: Yoshitaka Ishibashi, Naoya Fukumoto, Masato Kitamura
  • Patent number: 9346740
    Abstract: Provided is a method for producing a 2-alkenylamine compound efficiently and at low cost, using a primary or secondary amine compound and a 2-alkenyl compound as the starting materials therefor. The 2-alkenyleamine compound is produced by 2-alkenylating a primary or secondary amine compound, using a specified 2-alkenylating agent and in the presence of a catalyst comprising a complexing agent and a transition metal precursor stabilized by a monovalent anionic five-membered conjugated diene.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: May 24, 2016
    Assignees: SHOWA DENKO K.K., NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY
    Inventors: Yoshitaka Ishibashi, Naoya Fukumoto, Masato Kitamura
  • Publication number: 20160060490
    Abstract: [Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 massppm or less, preferably 50 massppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin.
    Type: Application
    Filed: March 27, 2014
    Publication date: March 3, 2016
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiroshi UCHIDA, Yoshitaka ISHIBASHI
  • Publication number: 20140200345
    Abstract: Provided is a method for producing a 2-alkenylamine compound efficiently and at low cost, using a primary or secondary amine compound and a 2-alkenyl compound as the starting materials therefor. The 2-alkenyleamine compound is produced by 2-alkenylating a primary or secondary amine compound, using a specified 2-alkenylating agent and in the presence of a catalyst comprising a complexing agent and a transition metal precursor stabilized by a monovalent anionic five-membered conjugated diene.
    Type: Application
    Filed: August 29, 2012
    Publication date: July 17, 2014
    Applicants: NATIONAL UNIV. CORP. NAGOYA UNIVERSITY, SHOWA DENKO K.K.
    Inventors: Yoshitaka Ishibashi, Naoya Fukumoto, Masato Kitamura