Patents by Inventor Yoshitaka Mukaiyama

Yoshitaka Mukaiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210277534
    Abstract: Provided is a substrate holder including a first holding member and a second holding member configured to sandwich and fix a substrate, wherein the first holding member includes a first holding member body, and a clamp provided on the first holding member body, the clamp being rotatable about a shaft extending parallel to a surface of the first holding member body, or being reciprocable in a direction intersecting with the surface of the first holding member body, the second holding member includes a second holding member body, and the clamp is capable of engaging with the second holding member in a state where the first holding member body and the second holding member body are brought into contact with each other, to fix the second holding member to the first holding member.
    Type: Application
    Filed: September 7, 2017
    Publication date: September 9, 2021
    Inventors: Matsutaro MIYAMOTO, Yoshitaka MUKAIYAMA
  • Publication number: 20210262111
    Abstract: A paddle capable of reducing an influence of blocking the electric field and capable of improving its mechanical strength is disclosed. The paddle, which is configured to agitate a processing liquid in a processing tank by moving in the processing tank, includes a plurality of agitating beams that form a honeycomb structure. The honeycomb structure has a plurality of hexagonal through-holes formed by the plurality of agitating beams.
    Type: Application
    Filed: February 17, 2021
    Publication date: August 26, 2021
    Inventors: Yasuyuki Masuda, Shao Hua Chang, Yoshitaka Mukaiyama, Masashi Shimoyama, Jumpei Fujikata
  • Patent number: 11047063
    Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: June 29, 2021
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Yoichi Nakagawa, Yoshitaka Mukaiyama, Yoshio Minami
  • Patent number: 11015261
    Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: May 25, 2021
    Assignee: EBARA CORPORATION
    Inventors: Yoshitaka Mukaiyama, Toshio Yokoyama, Junitsu Yamakawa, Takuya Tsushima, Tomonori Hirao, Sho Tamura, Hirotaka Ohashi
  • Publication number: 20200255968
    Abstract: An inspection apparatus, a plating apparatus, and an appearance inspection apparatus that are capable of automatically inspecting a substrate holder are provided. An inspection apparatus that includes an electric contact configured to contact a substrate to allow current flow to the substrate and a sealing member configured to seal a surface of the substrate and that inspects a substrate holder holding the substrate is provided. The inspection apparatus includes a stocker installation part in which a stocker configured to house the substrate holder is installed, a cleaning device configured to cleanse the substrate holder, a substrate attaching/detaching device configured to open and close the substrate holder, an appearance inspection apparatus configured to acquire image data or shape data of appearance of at least one of the sealing member and the electric contact, and a conveyer configured to convey the substrate holder among the stocker, the cleaning device, and the appearance inspection apparatus.
    Type: Application
    Filed: June 7, 2017
    Publication date: August 13, 2020
    Inventors: Yoshitaka MUKAIYAMA, Toshio YOKOYAMA, Kunio OISHI, Masaaki KIMURA, Jumpei FUJIKATA
  • Patent number: 10665495
    Abstract: A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: May 26, 2020
    Assignee: EBARA CORPORATION
    Inventors: Toshio Yokoyama, Yoshitaka Mukaiyama, Takuya Tsushima
  • Patent number: 10577714
    Abstract: There are provided a plating apparatus and a plating method enabling continuous operation even while a stocker is taken out of the plating apparatus. The plating apparatus includes a plating treatment section performing plating on a substrate and a plurality of stockers configured to be able to store a holder configured to hold a substrate or an anode. At least one of the plurality of stockers is configured to be movable into and out of the plating apparatus.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: March 3, 2020
    Assignee: EBARA CORPORATION
    Inventors: Yoshitaka Mukaiyama, Jumpei Fujikata, Hideharu Aoyama
  • Publication number: 20190226114
    Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Inventors: Jumpei FUJIKATA, Masashi SHIMOYAMA, Yoichi NAKAGAWA, Yoshitaka MUKAIYAMA, Yoshio MINAMI
  • Patent number: 10294578
    Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: May 21, 2019
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Yoichi Nakagawa, Yoshitaka Mukaiyama, Yoshio Minami
  • Publication number: 20190084777
    Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.
    Type: Application
    Filed: March 7, 2017
    Publication date: March 21, 2019
    Inventors: Yoshitaka MUKAIYAMA, Toshio YOKOYAMA, Junitsu YAMAKAWA, Takuya TSUSHIMA, Tomonori HIRAO, Sho TAMURA, Hirotaka OHASHI
  • Publication number: 20180182659
    Abstract: A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.
    Type: Application
    Filed: December 21, 2017
    Publication date: June 28, 2018
    Inventors: Toshio YOKOYAMA, Yoshitaka MUKAIYAMA, Takuya TSUSHIMA
  • Publication number: 20170298531
    Abstract: There are provided a plating apparatus and a plating method enabling continuous operation even while a stocker is taken out of the plating apparatus. The plating apparatus includes a plating treatment section performing plating on a substrate and a plurality of stockers configured to be able to store a holder configured to hold a substrate or an anode. At least one of the plurality of stockers is configured to be movable into and out of the plating apparatus.
    Type: Application
    Filed: April 13, 2017
    Publication date: October 19, 2017
    Inventors: Yoshitaka MUKAIYAMA, Jumpei FUJIKATA, Hideharu AOYAMA
  • Publication number: 20170226656
    Abstract: An improved apparatus for adding powder comprising at least a metal, such as copper, to a plating solution, and supplying the plating solution to a plating tank is disclosed. The apparatus includes a hopper having an inlet which is connectable to a powder conduit of a powder container holding the powder therein, a feeder which communicates with a bottom opening of the hopper, a motor coupled to the feeder, and a plating-solution tank coupled to an outlet of the feeder and configured to dissolve the powder in the plating solution.
    Type: Application
    Filed: February 7, 2017
    Publication date: August 10, 2017
    Inventors: Chunhui DOU, Yoshitaka MUKAIYAMA, Yuji ARAKI, Masashi SHIMOYAMA, Jumpei FUJIKATA
  • Patent number: 9714476
    Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: July 25, 2017
    Assignee: EBARA CORPORATION
    Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
  • Publication number: 20160145760
    Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
    Type: Application
    Filed: October 21, 2015
    Publication date: May 26, 2016
    Inventors: Jumpei FUJIKATA, Masashi SHIMOYAMA, Yoichi NAKAGAWA, Yoshitaka MUKAIYAMA, Yoshio MINAMI
  • Publication number: 20160130702
    Abstract: A method of operating an electroless plating apparatus is disclosed. The operating method includes: storing in the electroless plating apparatus an order of priority of the plurality of processes which has been predetermined based on a stability of a processed substrate with respect to pure water; supplying pure water into the holder storage bath when any of the plurality of processing baths malfunctions; determining whether or not a relieving process can be performed, the relieving process being a process of performing a higher-priority process on a substrate; if the relieving process can be performed, performing the relieving process and then immersing the substrate holder holding the substrate in the pure water in the holder storage bath; and if the relieving process cannot be performed, immersing the substrate holder, holding the substrate, in the pure water held in the holder storage bath without performing the relieving process.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 12, 2016
    Applicant: EBARA CORPORATION
    Inventors: Yoichi NAKAGAWA, Yoshitaka MUKAIYAMA, Akira SUSAKI, Kunio OISHI
  • Publication number: 20150122635
    Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
    Type: Application
    Filed: January 14, 2015
    Publication date: May 7, 2015
    Inventors: Junichiro YOSHIOKA, Yoshitaka MUKAIYAMA
  • Patent number: 8961755
    Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: February 24, 2015
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
  • Publication number: 20150013905
    Abstract: A wet processing apparatus, such as a plating apparatus, and an etching apparatus, is disclosed. A wet processing apparatus includes a substrate-holder advancing mechanism configured to elevate a movable support to raise a substrate holder until the substrate holder is separated from a fixed support, move the movable support together with the substrate holder by a predetermined distance toward a holder takeout position, lower the movable support until the substrate holder is supported on the fixed support and the movable support is separated from the substrate holder, and move the movable support by the predetermined distance toward a holder put-in position.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Inventors: Yoichi NAKAGAWA, Yoshitaka MUKAIYAMA, Junitsu YAMAKAWA
  • Publication number: 20120048727
    Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
    Type: Application
    Filed: November 7, 2011
    Publication date: March 1, 2012
    Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama