Patents by Inventor Yoshito Nishizawa

Yoshito Nishizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11185924
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: November 30, 2021
    Assignees: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Akira Okamoto, Masato Kikukawa, Hiroaki Okubo, Yoshito Nishizawa, Takeshi Maruyama, Motonori Nishida
  • Patent number: 10967431
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: April 6, 2021
    Assignees: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Akira Okamoto, Masato Kikukawa, Hiroaki Okubo, Yoshito Nishizawa, Takeshi Maruyama, Motonori Nishida
  • Publication number: 20200180024
    Abstract: In this invention, a copper powder to which phosphorus (P) is added is developed such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. This invention is a copper powder for lamination shaping in which a phosphorus element is added to pure copper. The copper powder desirably contains 0.01 wt % or more of the phosphorus element. The copper powder more desirably contains 0.04 wt % or more of the phosphorus element. The copper powder desirably contains 0.30 wt % or less of the phosphorus element. The copper powder more desirably contains 0.24 wt % or less of the phosphorus element. No element other than the phosphorus element is desirably added to the copper powder.
    Type: Application
    Filed: June 21, 2017
    Publication date: June 11, 2020
    Inventors: Yuji SUGITANI, Yoshito NISHIZAWA, Takeshi MARUYAMA, Hiroaki OKUBO OKUBO
  • Publication number: 20200147682
    Abstract: This invention provides a copper powder to which tin (Sn) is added such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. That is, this invention provides a copper powder for lamination shaping in which a tin element is added to pure copper. Desirably, the copper powder contains 0.5 wt % or more of the tin element. More desirably, the copper powder contains 5.0 wt % or more of the tin element. When the product has an electrical conductivity sufficient as a copper product, the copper powder desirably contains 6.0 wt % or less of the tin element. Furthermore, no element other than the tin element is desirably added to the copper powder.
    Type: Application
    Filed: July 18, 2017
    Publication date: May 14, 2020
    Applicants: FUKUDA METAL FOIL & POWDER CO., LTD., TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
    Inventors: Yuji SUGITANI, Yoshito NiSHIZAWA, Takeshi MARUYAMA, Hiroaki OKUBO
  • Publication number: 20190168302
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Application
    Filed: February 6, 2019
    Publication date: June 6, 2019
    Applicants: Daihen Corporation, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Akira Okamoto, Masato Kikukawa, Hiroaki Okubo, Yoshito Nishizawa, Takeshi Maruyama, Motonori Nishida
  • Publication number: 20190168303
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Application
    Filed: February 6, 2019
    Publication date: June 6, 2019
    Applicants: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke TSUBOTA, Junichi TANAKA, Yohei OKA, Akira OKAMOTO, Masato KIKUKAWA, Hiroaki OKUBO, Yoshito NISHIZAWA, Takeshi MARUYAMA, Motonori NISHIDA
  • Publication number: 20170182557
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 29, 2017
    Applicants: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke TSUBOTA, Junichi TANAKA, Yohei OKA, Akira OKAMOTO, Masato KIKUKAWA, Hiroaki OKUBO, Yoshito NISHIZAWA, Takeshi MARUYAMA, Motonori NISHIDA
  • Patent number: 4792044
    Abstract: A magnetic tape pancake package includes a plurality of pancakes respectively comprising a hub having a width slightly larger than the width of a magnetic tape, and the magnetic tape wound around the hub. A plurality of spacers are stacked together with the pancakes between the stacked pancakes and at the top and the bottom of the stack of the pancakes. Each spacer is formed into a disk-like shape having a diameter larger than the diameters of the pancakes and provided with a recess at a section contacting the hub for engagement with a hub end face section protruding from the magnetic tape wound around the hub. The pancakes and the spacers are wrapped in a lump with an expansible and/or contractible film.
    Type: Grant
    Filed: December 28, 1987
    Date of Patent: December 20, 1988
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Yoshito Nishizawa, Shigeo Kamata
  • Patent number: 4552975
    Abstract: The invention relates to manufacturing process for a halide or an organic sulfonate of N-carbobenzyl-L-glutamic acid-.alpha.-cholinester in high purification, which is useful as e.g. hypotensive drug. According to the prior art, undesired .gamma.-form byproduct is inevitably formed to be mingled with said .alpha.-form objective compound of which separation is difficult. It has been found that when using N-carbobenzyloxy-.gamma.-tert. butyl-L-glutamic acid-dicyclohexyl-ammonium salt readily available in high purification as starting material, reacting N, N-dimethyl-aminoethylchloride therewith to form N-carbobenzyloxy-.gamma.-tert. butyl-L-glutamic acid-.alpha.-dimethylaminoethyl ester which is quaternerized to form N-carbobenzyloxy-.gamma.-tert. butyl-L-glutamic acid-.alpha.-cholinester salt, which is subjected to mild salt treatment, the objective compound can be obtained in high purification.
    Type: Grant
    Filed: August 13, 1984
    Date of Patent: November 12, 1985
    Assignee: Moringa Milk Industry, Co., Ltd.
    Inventors: Yoshito Nishizawa, deceased, Matao Kanaoka