Patents by Inventor Yoshitomo Teraoka

Yoshitomo Teraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180236582
    Abstract: A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.
    Type: Application
    Filed: January 16, 2018
    Publication date: August 23, 2018
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA, Tomoo TAKAHARA
  • Publication number: 20180200819
    Abstract: A soldering apparatus and method involves capturing an image of a soldering operation, and storing image data in association with that particular soldering operation. A soldering tool that is used to perform the soldering operation has a position during the soldering operation, and the image data could also be stored in association with data for that particular position. The position data could be for an operation start point and/or an operation endpoint. Associating the image data in this way could help a manufacturer investigate soldering abnormalities that might be reported after a product is shipped to a customer.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 19, 2018
    Inventor: Yoshitomo TERAOKA
  • Publication number: 20180193937
    Abstract: A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.
    Type: Application
    Filed: December 22, 2016
    Publication date: July 12, 2018
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hitoshi Takeuchi, Yasumasa Igi, Kenta Nakamura
  • Publication number: 20180161903
    Abstract: The present invention defines a tool including a heating device including a method and apparatus to allow the user to check whether, or be notified when, the soldered electronic component is completely removed from a substrate after the solder is sufficiently melted.
    Type: Application
    Filed: December 13, 2016
    Publication date: June 14, 2018
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 9981332
    Abstract: A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 29, 2018
    Assignee: Hakko Corp
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Publication number: 20170336098
    Abstract: The invention is directed to a nozzle for a hot air device used in the electronic assembly industry to melt solder or heat shrink-wrap insulators. The nozzle provides a uniform temperature environment and suppresses the occurrence of local excess heating.
    Type: Application
    Filed: May 18, 2016
    Publication date: November 23, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Publication number: 20170182576
    Abstract: A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.
    Type: Application
    Filed: September 12, 2016
    Publication date: June 29, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo TERAOKA, Hisao Nemoto
  • Publication number: 20170165771
    Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
    Type: Application
    Filed: June 2, 2016
    Publication date: June 15, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 9314863
    Abstract: A solder handling assembly comprises a heating portion, a casing, a variable resistor, a connecting member coupled to the variable resistor, and an elastic-resilient member movable from a first state to a second state. The connecting member is rotatable relative to the casing and is configured to adjust a resistor value of the variable resistor when the connecting member is rotated relative to casing. When the elastic-resilient member is in the first state, the connecting member is prevented from rotating relative to the casing. When the elastic-resilient member is in the second state, the connecting member can be rotated relative to the casing.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: April 19, 2016
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Publication number: 20150246404
    Abstract: The present invention is intended to ease the control and management of soldering devices, and enhance convenience. In accordance with the intention of the invention, a system includes a power supply unit having a connecting cable to be connected to soldering devices, a power supply portion supplying power to the soldering devices through the connecting cable, a power supply control portion to control the power supply from the power supply portion based on a temperature setting signal T(s) set in advance and a control unit that may be physically separated from the power supply unit but which inputs the temperature setting signal T(s) to the power supply control portion of the power supply unit.
    Type: Application
    Filed: August 1, 2014
    Publication date: September 3, 2015
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Kenta Nakamura, Yasumasa Igi
  • Patent number: 8309877
    Abstract: A heat transferring member comprises a heat transfer body for melting solder, and a pipe inserted into a hole formed in the heat transfer body, wherein heat from a heating member is conducted to the heat transfer body. The pipe includes a tubular-shaped substrate made of copper or copper alloy, and an aluminum oxide film formed at least on a peripheral surface of the tubular-shaped substrate. The pipe may be press-fitted in the hole.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: November 13, 2012
    Assignee: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Takashi Nagase
  • Patent number: 8276855
    Abstract: A soldering iron stand comprises a stand base, and a soldering iron holder provided on an upper portion of the stand base and formed to have a curved surface for receiving thereon a soldering iron to be held by the stand base. The soldering iron holder has a plurality of recesses formed therein and arranged in a circumferential direction of the curved surface. Each of the recesses is provided with a heat-resistant elastic member.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: October 2, 2012
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Patent number: 7860378
    Abstract: In a baffle device 20 fixedly provided in an air passage of a mechanism for blowing out hot air to a solder treatment portion, vanes inclined with a predetermined inclination angle with respect to an air flow are provided substantially radially with a predetermined interval. Also, in a nozzle to be attached to the hot air blower for solder treatment, the baffle device 20 is fixedly provided in an in-nozzle air passage. Moreover, in the hot air blower for solder treatment which blows out hot air to the solder treatment portion, the baffle device 20 is fixedly provided in an in-blower air passage.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: December 28, 2010
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Publication number: 20100108647
    Abstract: A heat transferring member comprises a heat transfer body for melting solder, and a pipe inserted into a hole formed in the heat transfer body, wherein heat from a heating member is conducted to the heat transfer body. The pipe includes a tubular-shaped substrate made of copper or copper alloy, and an aluminum oxide film formed at least on a peripheral surface of the tubular-shaped substrate. The pipe may be press-fitted in the hole.
    Type: Application
    Filed: October 30, 2009
    Publication date: May 6, 2010
    Inventors: Yoshitomo Teraoka, Takashi Nagase
  • Publication number: 20100108827
    Abstract: A soldering iron stand comprises a stand base, and a soldering iron holder provided on an upper portion of the stand base and formed to have a curved surface for receiving thereon a soldering iron to be held by the stand base. The soldering iron holder has a plurality of recesses formed therein and arranged in a circumferential direction of the curved surface. Each of the recesses is provided with a heat-resistant elastic member.
    Type: Application
    Filed: November 2, 2009
    Publication date: May 6, 2010
    Inventor: Yoshitomo Teraoka
  • Patent number: D630235
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: January 4, 2011
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Patent number: D660669
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: May 29, 2012
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Patent number: D740339
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: October 6, 2015
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Patent number: D743764
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: November 24, 2015
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Patent number: D780241
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: February 28, 2017
    Assignee: HAKKO CORPORATION
    Inventor: Yoshitomo Teraoka