Abstract: The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3?-(3?-aminophenoxy)phenyl)amino-1-(3?-(3?-aminophenoxy)phenoxy)benzene and 3,3?-bis(3?-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion fi

Abstract: The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3?-(3?-aminophenoxy)phenyl)amino-1-(3?-(3?-aminophenoxy)phenoxy)benzene and 3,3?-bis(3?-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion fi

Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

Abstract: A fuel-injection valve includes a fuel-injection hole, a valve element and a valve seat for opening and closing the fuel-injection hole, a force-applying member for applying force to the valve element in a direction of motion of the valve element, and a drive unit for applying force to the valve element in the direction opposite to that of the force applied by the force-applying member; wherein a secondary oscillation system, which interacts with a primary oscillation system including the valve element and the force-applying member, is added to the primary oscillation system, and the phase angle of force applied to the primary oscillation system by the secondary oscillation system is also staggered from that of force applied to the primary oscillation system, which is other than the force applied to the primary oscillation system by the secondary oscillation system, whereby the bouncing of the valve element during opening and closing of the valve is reduced, which in turn makes it possible to achieve very acc

Abstract: A fuel-injection valve includes a fuel-injection hole, a valve element and a valve seat for opening and closing the fuel-injection hole, a force-applying member for applying force to the valve element in a direction of motion of the valve element, and a drive unit for applying force to the valve element in the direction opposite to that of the force applied by the force-applying member; wherein a secondary oscillation system, which interacts with a primary oscillation system including the valve element and the force-applying member, is added to the primary oscillation system, and the phase angle of force applied to the primary oscillation system by the secondary oscillation system is also staggered from that of force applied to the primary oscillation system, which is other than the force applied to the primary oscillation system by the secondary oscillation system, whereby the bouncing of the valve element during opening and closing of the valve is reduced, which in turn makes it possible to achieve very acc

Abstract: In the fuel cylinder injection engine with the supercharging machine, the ignitability deteriorates because the density of the fuel at the spray center becomes excessive due to the shrinkage of the fuel spray under the supercharging. As a result, the density of the smoke and the hydrocarbon exhaust rate increase. The mixture of the fuel and the air under the supercharging is promoted by the control by TCV installed in the suction port which is a divided spray and air flow generation mechanism and the valve timing control of the suction and exhaust valve, etc.

Abstract: In order to provide a fuel injection method of an internal combustion engine having higher combustion stability which can direct a part of concentrated fuel spray toward an ignition plug according to a fuel injection atmosphere, a fuel injection valve thereof, and an internal combustion engine, the present invention provides a fuel injection method of an internal combustion engine for injecting fuel so as to generate a part of high spray concentration and a part of low spray concentration on the cross section of spray by giving swirling force to fuel from an injection hole at the front end of a fuel injection valve, comprising the step of setting a reference indicating the position of a axis of the fuel injection valve indicating the injection direction of the part of high spray concentration in the rotational direction when fuel is injected into an atmosphere under the atmospheric pressure.

Abstract: A fuel swirler positioned upstream of an injection orifice is disposed at the tip of a nozzle body in a fuel injector, in which the fixed core and the nozzle body are coupled to each other via a non-magnetic cylindrical seal ring press-fitted and welded to the outer circumference of one end on the nozzle body side of the fixed core and the inner circumference of one end of the nozzle body. The inner circumference of the fuel swirler and the inner circumference of the seal ring function serve as a guide for slidably guiding a stroke movement of the needle. The fuel swirler is held between the receiving surface of the nozzle body and the orifice plate, thus defining an annular fuel passage between the outer circumference of the fuel swirler and the inner circumference of the nozzle body, so that fuel flows into a passage groove formed at the lower end surface of the fuel swirler via the annular fuel passage.

Abstract: A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

Abstract: The present invention provides an adhesive film that combines low temperature adhesion with favorable wire bonding characteristics. The adhesive film used for bonding a semiconductor element to a target adherend comprises an adhesive layer formed on one surface, or both surfaces, of a heat resistant film, the adhesive layer comprises a resin A and a resin B, a glass transition temperature of the resin A is lower than a glass transition temperature of the resin B, and the adhesive layer has a sea-island structure, in which the resin A forms the sea, and the resin B forms the islands.

Abstract: An internal combustion engine which injects fuel directly into a cylinder 104 and ignites air-fuel mixture formed in the cylinder, wherein each fuel injection of said internal combustion engine comprises a lead spray 105 which moves faster and a main spray 106 which moves slower, the lead spray 105 is oriented towards an ignition plug 114, and the air-fuel mixture made by pre- and main sprays is ignited twice or more. This invention of the above configuration can provide a simple and inexpensive direct cylinder injection type internal combustion engine which reduces abrasion of electrodes and consumption of electric power while assuring stable fuel combustions even when ignition timing is retarded.

Abstract: In order to provide a fuel injection method of an internal combustion engine having higher combustion stability which can direct a part of concentrated fuel spray toward an ignition plug according to a fuel injection atmosphere, a fuel injection valve thereof, and an internal combustion engine, the present invention provides a fuel injection method of an internal combustion engine for injecting fuel so as to generate a part of high spray concentration and a part of low spray concentration on the cross section of spray by giving swirling force to fuel from an injection hole at the front end of a fuel injection valve, comprising the step of setting a reference indicating the position of a axis of the fuel injection valve indicating the injection direction of the part of high spray concentration in the rotational direction when fuel is injected into an atmosphere under the atmospheric pressure.

Abstract: In the fuel cylinder injection engine with the supercharging machine, the ignitability deteriorates because the density of the fuel at the spray center becomes excessive due to the shrinkage of the fuel spray under the supercharging. As a result, the density of the smoke and the hydrocarbon exhaust rate increase. The mixture of the fuel and the air under the supercharging is promoted by the control by TCV installed in the suction port which is a divided spray and air flow generation mechanism and the valve timing control of the suction and exhaust valve, etc.

Abstract: An internal combustion engine which injects fuel directly into a cylinder 104 and ignites air-fuel mixture formed in the cylinder, wherein

Abstract: In the fuel cylinder injection engine with the supercharging machine, the ignitability deteriorates because the density of the fuel at the spray center becomes excessive due to the shrinkage of the fuel spray under the supercharging. As a result, the density of the smoke and the hydrocarbon exhaust rate increase. The mixture of the fuel and the air under the supercharging is promoted by the control by TCV installed in the suction port which is a divided spray and air flow generation mechanism and the valve timing control of the suction and exhaust valve, etc.

Abstract: A control apparatus for a direct injection engine having an intake valve, an exhaust valve and a fuel injection valve for injecting fuel directly into a cylinder of the engine and in which fuel injection by the fuel injection valve is performed during intake stroke or during compression stroke of the engine, has combustion stabilizing device for stabilizing combustion in the cylinder. The combustion stabilizing device has next operation mode determination device for selecting either an operation mode of recovering the combustion stability by fuel injection during intake stroke or an operation mode of recovering the combustion stability by fuel injection during compression stroke when a deteriorated state of combustion is detected in fuel injection during compression stroke.

Abstract: An adhesive film for semiconductor comprises a support film, and adhesive layers formed on both surfaces of the support film, in which each adhesive layer comprises an adhesive having a glass transition temperature of 200° C. or less, a coefficient of linear expansion of 70 ppm or less, and a storage elastic modulus of 3 GPa or less, and the adhesive film has a total thickness of between 43 and 57 &mgr;m. A lead frame for semiconductor comprises a lead frame and an adhesive film for semiconductor according to the present invention. A semiconductor device comprises a lead frame and a semiconductor element, in which the lead frame and the semiconductor element are adhered to each other via an adhesive film for semiconductor according to the present invention.