Patents by Inventor Yosihiro Tomita

Yosihiro Tomita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040020046
    Abstract: The present invention provides a method for manufacturing a conductive paste. The method includes deforming conductive particles so that a deformation degree is 1.01 to 1.5 by application of a stress to the conductive particles and mixing the deformed conductive particles with a binder that includes a thermosetting resin as the main component. The deformation degree is determined by dividing an average diameter of the conductive particles after deformation by an average diameter of the conductive particles before deformation, where the average diameter is measured by a laser diffraction method. The use of this conductive paste for a prepreg sheet having limited compressibility can suppress a short circuit between via holes and the degradation of insulation properties.
    Type: Application
    Filed: June 6, 2003
    Publication date: February 5, 2004
    Inventors: Takeshi Suzuki, Satoru Tomekawa, Yosihiro Tomita, Yuichiro Sugita, Shigeru Yamane
  • Patent number: 6513915
    Abstract: A variable dot ink-jet printer having an ejection flow passage with a decrease in sectional area from an ejection port toward the interior of the flow passage and up to a boundary. A draw-in part draws an ink front position in the interior of the flow passage. A push-out part pushes out the ink front position outside the flow passage. When ejecting a small ink drop, the ink front position is drawn at a place having an increase in sectional area by the draw-in part. The ink is pushed outward by the push-out part at such a speed as to exit from an edge of an area of the boundary on the ejection port side.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: February 4, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Atsushi Komatsu, Akihiko Namba, Masayuki Okano, Yosihiro Tomita, Osamu Kawasaki
  • Patent number: 6497476
    Abstract: A liquid injection device has a liquid pressurizing chamber having one or a plurality of apertures, a liquid injection port provided at a part of the liquid pressurizing chamber, a liquid pressurizing member arranged adjacent to the liquid pressurizing chamber, a liquid passage arranged adjacent to the liquid pressurizing chamber; wherein within the aperture(s), a peripheral edge portion of the aperture(s) located at a position opposite to the liquid pressurizing member and the liquid pressurizing member are arranged to be apart from each other at a gap with a predetermined size; further wherein liquid is injected through the liquid injection port by driving the liquid pressurizing member to thereby pressurize the liquid supplied from the liquid passage into the liquid pressurizing chamber.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: December 24, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiko Namba, Masayuki Okano, Atsushi Komatsu, Yosihiro Tomita, Osamu Kawasaki
  • Patent number: 6236141
    Abstract: Disclosed is a SAW element with a propagation substrate that is a piezoelectric substrate. An auxiliary substrate is laminated on one surface of the propagation substrate by way of direct bonding, and a comb-shaped electrode is formed on another surface of the propagation substrate that is opposite the surface with the auxiliary substrate. The electrode excites an acoustic wave. The propagation substrate and the auxiliary substrate are not bonded to each other in at least a region immediately below a region where the comb-shaped electrode is formed. A coefficient of thermal expansion in a propagation direction of the acoustic wave of the auxiliary substrate is smaller than a coefficient of thermal expansion in a propagation direction of the acoustic wave of the propagation substrate.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: May 22, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroki Sato, Keiji Onishi, Akihiko Namba, Yutaka Taguchi, Yosihiro Tomita
  • Patent number: 5998907
    Abstract: A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: December 7, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yutaka Taguchi, Kazuo Eda, Osamu Kawasaki, Yosihiro Tomita, Keiji Onishi, Shun-ichi Seki, Akihiko Namba, Hiroki Sato, Tetsuyosi Ogura