Patents by Inventor Yosuke Omori

Yosuke Omori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10982833
    Abstract: The vehicle lamp of the present invention includes: a first light source that emits light for low-beam light distribution; a lens arranged in a front side of the first light source; a shade that is arranged between the first light source and the lens and forms a cut-off line of a low-beam light distribution pattern; a reflector that reflects light from the first light source towards the lens; and a second light source that is arranged between the first light source and the lens and emits light for high-beam additional light distribution. A rear focal point of the lens is located more to a front side than a second focal point which is a focal point on a front side of the reflector, and a lens optical axis of the lens is inclined forward and obliquely downward with respect to a lamp optical axis of the lamp.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: April 20, 2021
    Assignee: Ichikoh Industries, Ltd.
    Inventors: Kazunori Iwasaki, Yasuhiro Okubo, Takanori Hamamoto, Yosuke Omori
  • Patent number: 10985132
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 20, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20210035827
    Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.
    Type: Application
    Filed: January 11, 2019
    Publication date: February 4, 2021
    Inventors: Kimio Motoda, Norifumi Kohama, Norio Wada, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20200365442
    Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including, as multiple regions in which attracting pressures for attracting the substrate are controlled independently, a first region having a circular shape and a second region having an annular shape and disposed at an outside of the first region in a diametrical direction; multiple attracting pressure generators configured to independently generate the attracting pressures respectively in the multiple regions forming the attraction surface; multiple attracting pressure adjusters configured to independently adjust the attracting pressures respectively generated by the attracting pressure generators; and a controller configured to control the multiple attracting pressure generators and the multiple attracting pressure adjusters. The controller generates different attracting pressures in at least a part of the first region and in at least a part of the second region.
    Type: Application
    Filed: January 9, 2019
    Publication date: November 19, 2020
    Inventors: Kenji Sugakawa, Yosuke Omori
  • Publication number: 20200343216
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: July 14, 2020
    Publication date: October 29, 2020
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Patent number: 10756046
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: August 25, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20200248884
    Abstract: The vehicle lamp of the present invention includes: a first light source that emits light for low-beam light distribution; a lens arranged in a front side of the first light source; a shade that is arranged between the first light source and the lens and forms a cut-off line of a low-beam light distribution pattern; a reflector that reflects light from the first light source towards the lens; and a second light source that is arranged between the first light source and the lens and emits light for high-beam additional light distribution. A rear focal point of the lens is located more to a front side than a second focal point which is a focal point on a front side of the reflector, and a lens optical axis of the lens is inclined forward and obliquely downward with respect to a lamp optical axis of the lamp.
    Type: Application
    Filed: October 11, 2018
    Publication date: August 6, 2020
    Applicant: Ichikoh Industries, Ltd.
    Inventors: Kazunori IWASAKI, Yasuhiro OKUBO, Takanori HAMAMOTO, Yosuke OMORI
  • Publication number: 20190385971
    Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded faster.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Inventors: Yosuke Omori, Kenji Sugakawa
  • Publication number: 20190385973
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Patent number: 10438920
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: October 8, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Patent number: 10438918
    Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded fastest.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: October 8, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yosuke Omori, Kenji Sugakawa
  • Publication number: 20190273063
    Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.
    Type: Application
    Filed: October 11, 2017
    Publication date: September 5, 2019
    Inventors: Takashi Nakamitsu, Shuhei Matsumoto, Yosuke Omori
  • Publication number: 20180158796
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: November 27, 2017
    Publication date: June 7, 2018
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Publication number: 20180047699
    Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded fastest.
    Type: Application
    Filed: August 7, 2017
    Publication date: February 15, 2018
    Inventors: Yosuke Omori, Kenji Sugakawa
  • Patent number: 9263312
    Abstract: A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: February 16, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Michikazu Nakamura, Masahiko Sugiyama, Hajime Furuya, Naoki Akiyama, Yosuke Omori
  • Publication number: 20160001543
    Abstract: A bonding device for bonding substrates together, includes: a processing vessel configured to accommodate and bond first and second substrates; a first holding unit fixed within the processing vessel and configured to hold the first substrate on a lower surface thereof; a second holding unit located below the first holding unit within the processing vessel and configured to hold the second substrate on an upper surface thereof; a moving mechanism configured to move the second holding unit in a horizontal direction and a vertical direction; a first image pickup unit located in the first holding unit and configured to pick up an image of a front surface of the second substrate held in the second holding unit; and a second image pickup unit located in the second holding unit and configured to pick up an image of a front surface of the first substrate held in the first holding unit.
    Type: Application
    Filed: July 7, 2014
    Publication date: January 7, 2016
    Inventors: Naoki AKIYAMA, Masahiko SUGIYAMA, Yosuke OMORI, Shinji AKAIKE, Hideaki TANAKA
  • Publication number: 20150017782
    Abstract: A bonding device for bonding substrates together, includes: a first holding unit configured to hold a first substrate on a lower surface thereof; a second holding unit located below the first holding unit and configured to hold a second substrate on an upper surface thereof; a moving mechanism configured to move the first holding unit or the second holding unit in a horizontal direction and a vertical direction; a first image pickup unit located in the first holding unit and configured to pick up an image of the second substrate held in the second holding unit; and a second image pickup unit located in the second holding unit and configured to pick up an image of the first substrate held in the first holding unit, at least one of the first image pickup unit and the second image pickup unit including an infrared camera.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Inventors: Naoki AKIYAMA, Masahiko SUGIYAMA, Yosuke OMORI, Shinji AKAIKE, Hideaki TANAKA, Masahiro YAMAMOTO
  • Publication number: 20140311653
    Abstract: A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.
    Type: Application
    Filed: September 13, 2012
    Publication date: October 23, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Michikazu Nakamura, Masahiko Sugiyama, Hajime Furuya, Naoki Akiyama, Yosuke Omori
  • Patent number: 8434538
    Abstract: A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: May 7, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Naoki Akiyama, Masahiko Sugiyama, Yosuke Omori
  • Patent number: 8421318
    Abstract: A rotating electrical machine is provided in which, even when torque from a water turbine is reduced and reverse torque is applied due to load cut off, a rotor core is not eccentric to spider arms. The rotor of a rotating machine includes a vertical rotating shaft, spider arms extending radially from the vertical rotating shaft, and a rotor core component provided to the outer circumference of the spider arms. A T key and cotters are inserted into and secured to a key way provided to an abutment surface of the inner circumference of the rotor core component and the top end of the spider arm. A plate spring is mounted to a surface of the spider arm, the surface facing a rotational direction for electrical generation. The plate spring has one side engaging the spider arm, the other side engaging the rotor core component, and a middle portion bolted from an opposite surface of the spider arm.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: April 16, 2013
    Assignee: Hitachi Mitsubishi Hydro Corporation
    Inventors: Takeshi Kuwahara, Yukiyoshi Yanagisawa, Koshu Hagiya, Masayuki Okada, Yosuke Omori, Shigeki Akanuma