Yosuke Omori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.
Abstract: A rotating electrical machine is provided in which, even when torque from a water turbine is reduced and reverse torque is applied due to load cut off, a rotor core is not eccentric to spider arms. The rotor of a rotating machine includes a vertical rotating shaft, spider arms extending radially from the vertical rotating shaft, and a rotor core component provided to the outer circumference of the spider arms. A T key and cotters are inserted into and secured to a key way provided to an abutment surface of the inner circumference of the rotor core component and the top end of the spider arm. A plate spring is mounted to a surface of the spider arm, the surface facing a rotational direction for electrical generation. The plate spring has one side engaging the spider arm, the other side engaging the rotor core component, and a middle portion bolted from an opposite surface of the spider arm.