Abstract: As antibody variants and isoforms having reduced FVIII mimetic activity than Emicizumab, the antibody variants having some specific amino acid residues in the variable region cleaved out and missing (Q-CDR-Clipped Variants) and the antibody isoforms having inter-heavy chain disulfide bonds less susceptible to reduction under mild reducing conditions (Protected Disulfide Isoforms) are provided.

Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.

Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.

Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.

Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.

Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.

Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.

Abstract: To safely stop a system even when an abnormality occurs in a power supply for a control circuit, a semiconductor device includes a control circuit, a first power supply that outputs a first voltage to be supplied to the control circuit as a power-supply voltage, a first voltage monitoring circuit that determines whether the first voltage is abnormal, a first switch that is coupled to the first power supply and the control circuit, and cuts off supply of the first voltage to the control circuit when it is determined that the first voltage is abnormal, and a power-supply switching circuit that is coupled to the control circuit and a second power supply, which outputs a second voltage to be supplied to a circuit to which power supply is supplied other than the control circuit as a power-supply voltage, and supplies the second voltage to the control circuit in a state where the supply of the first voltage to the control circuit is cut off.

Abstract: A switching circuit includes a printed circuit board that supports a switching element, a positive power supply circuit, a negative power supply circuit and a driving circuit thereon. The positive power supply circuit generates a positive voltage relative to a GND potential. The negative power supply circuit generates a negative voltage relative to the GND potential. The driving circuit supplies the gate electrode with the positive voltage and the negative voltage when turn on and off the switching element, respectively. The printed circuit board includes wiring as a conducting path extended from the negative power supply circuit to the gate electrode via the driving circuit. The conducting path includes a negative power supply wiring between the negative power supply circuit and the driving circuit. The negative power supply wiring at least partially includes a negative power supply solid pattern.

Abstract: A switching circuit includes a printed circuit board that supports a switching element, a positive power supply circuit, a negative power supply circuit and a driving circuit thereon. The positive power supply circuit generates a positive voltage relative to a GND potential. The negative power supply circuit generates a negative voltage relative to the GND potential. The driving circuit supplies the gate electrode with the positive voltage and the negative voltage when turn on and off the switching element, respectively. The printed circuit board includes wiring as a conducting path extended from the negative power supply circuit to the gate electrode via the driving circuit. The conducting path includes a negative power supply wiring between the negative power supply circuit and the driving circuit. The negative power supply wiring at least partially includes a negative power supply solid pattern.

Abstract: It was found that bringing a substance into contact with a plant cell after the plant cell is treated with plasma makes it possible to easily and highly efficiently introduce the substance into the cell without causing a damae regardless of the types of the plant and tissue from which the plant cell is derived.

Abstract: Technical problems of this invention is to create an injection molding device and an injection molding process for a test tube shaped preform, that can laminate a colored layer at certain positions of a wall of the reform with a certain thickness in a manner of a high degree of accuracy.

Abstract: A processing method includes processing a metal wire rod using an emulsion lubricant that includes an oil and a nonionic surfactant at an oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio). The method may include purifying the emulsion lubricant after being used for processing the metal wire rod while maintaining the oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio) and then reusing the purified emulsion lubricant to process the metal wire rod.

Abstract: To safely stop a system even when an abnormality occurs in a power supply for a control circuit, a semiconductor device includes a control circuit, a first power supply that outputs a first voltage to be supplied to the control circuit as a power-supply voltage, a first voltage monitoring circuit that determines whether the first voltage is abnormal, a first switch that is coupled to the first power supply and the control circuit, and cuts off supply of the first voltage to the control circuit when it is determined that the first voltage is abnormal, and a power-supply switching circuit that is coupled to the control circuit and a second power supply, which outputs a second voltage to be supplied to a circuit to which power supply is supplied other than the control circuit as a power-supply voltage, and supplies the second voltage to the control circuit in a state where the supply of the first voltage to the control circuit is cut off.

Abstract: A toner circulation and a toner reservoir are formed in the vicinity of a developing roller. A member to form a toner reservoir is movable and is stopped during at least an image-forming period.

Abstract: Technical problems of this invention is to create an injection molding device and an injection molding process for a test tube shaped preform, that can laminate a colored layer at certain positions of a wall of the reform with a certain thickness in a manner of a high degree of accuracy.

Abstract: Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).

Abstract: Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).

Abstract: In conventional moisture curable compositions, it has been difficult to control changes in the physical characteristics of the cured products to a low level when the cured products are left in a high temperature atmosphere of 80° C. or more as a reliability test. The present invention is characterized by being able to control changes to a low level and having a slight change in elongation rate required to follow the expansion of an adherend under a high temperature atmosphere. The moisture curable composition contains components (A) to (D); component (A): an oligomer, in which a main skeleton is a (meth)acrylic polymer, having a hydrolyzable silyl group in the molecule component (B): a polydialkylsiloxane; component (C): a titanium catalyst; and component (D): a silane-based coupling agent having an isocyanurate skeleton.

Abstract: There is provided a method of growing a gallium nitride-based crystal, including: forming an interlayer including aluminum nitride or aluminum oxide on a silicon substrate at a film forming temperature of 350 to 700 degrees C.; heating the silicon substrate and the interlayer in an atmosphere containing ammonia or oxygen such that crystal nuclei of the aluminum nitride or the aluminum oxide included in the interlayer are distributed on the silicon substrate; and growing gallium nitride-based crystals on the silicon substrate from the crystal nuclei distributed on the silicon substrate.