Abstract: Disclosed are: an adhesive composition including an epoxy resin (A), an epoxy resin curing agent (B), a polyurethane resin (C), and an inorganic filler (D), in which the polyurethane resin (C) has a storage elastic modulus at 25° C., in a dynamic viscoelastic analysis, of 8.0 MPa or higher, a proportion of the polyurethane resin (C) based on a total content of the epoxy resin (A) and the polyurethane resin (C) is from 2.0 to 50.0 mass %, and a maximum tensile stress in a stress-strain curve when a tensile strength is applied to a film adhesive formed using the adhesive composition is 7.0 MPa or higher; a film adhesive using the adhesive composition; a semiconductor package; and a producing method thereof.

Abstract: A dicing die attach film including a dicing film and a die attach film laminated on the dicing film, in which the die attach film has an arithmetic average roughness Ra1 of from 0.05 to 2.50 ?m at a surface in contact with the dicing film, and a value of ratio of Ra1 to an arithmetic average roughness Ra2 at a surface that is of the die attach film and is opposite to the surface in contact with the dicing film is from 1.05 to 28.00.

Abstract: A dicing die attach film containing a dicing film and a die attach film stacked on the dicing film, wherein the die attach film contains an organic solvent having a boiling point of 100° C. or more and less than 150° C. and a vapor pressure of 50 mmHg or less, and wherein an amount of the organic solvent in the die attach film satisfies the following (a): (a) when 1.0 g of the die attach film is immersed in 10.0 mL of acetone at 4° C. for 24 hours, an amount of the organic solvent extracted into the acetone is 800 ?g or less.