Patents by Inventor You Pil Jung

You Pil Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package and manufacturing method
    Patent number: 7656047
    Abstract: A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The electromagnetic interference shielding layer is a plated metal layer in contact with the package body, and the plated metal layer is connected to a ground trace extending on the upper surface of the substrate.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: February 2, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Jun Young Yang, You Ock Joo, You Pil Jung
  • Semiconductor device package and manufacturing method
    Publication number: 20080042301
    Abstract: A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The electromagnetic interference shielding layer is a plated metal layer in contact with the package body, and the plated metal layer is connected to a ground trace extending on the upper surface of the substrate.
    Type: Application
    Filed: September 7, 2007
    Publication date: February 21, 2008
    Applicants: ENGINEERING, INC.
    Inventors: Jun Young Yang, You Joo, You Pil Jung