Patents by Inventor Youhei Hayashi

Youhei Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9708510
    Abstract: A pressure-sensitive adhesive composition includes 100 parts by mass of a rubber component containing 40 to 93 mass % of a butyl rubber and 7 to 60 mass % of a polyisobutylene and 82 to 128 parts by mass of a softener having a kinetic viscosity at 40° C. of 100 to 9,000 mm2/s.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: July 18, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Youhei Hayashi, Hiroki Fujii, Tetsuro Taga, Shinichiro Kose, Yoshiaki Mitsuoka, Akihiro Kiriyama
  • Publication number: 20150056442
    Abstract: A pressure-sensitive adhesive composition contains a butyl rubber. The pressure-sensitive adhesive composition has a shear storage elastic modulus G? at ?10° C. of 1.0×106 Pa or less and a shear storage elastic modulus G? at 60° C. of 2.0×104 Pa or more obtained by dynamic viscoelasticity measurement of the pressure-sensitive adhesive composition under the conditions of a frequency of 1 Hz, a temperature rising rate of 5° C./min, and a temperature range of ?60 to 70° C.
    Type: Application
    Filed: August 21, 2014
    Publication date: February 26, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventor: Youhei HAYASHI
  • Publication number: 20150024196
    Abstract: A pressure-sensitive adhesive composition includes 100 parts by mass of a rubber component containing 40 to 93 mass % of a butyl rubber and 7 to 60 mass % of a polyisobutylene and 82 to 128 parts by mass of a softener having a kinetic viscosity at 40° C. of 100 to 9000 mm2/s.
    Type: Application
    Filed: March 5, 2013
    Publication date: January 22, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Youhei Hayashi, Hiroki Fujii, Tetsuro Taga, Shinichiro Kose, Yoshiaki Mitsuoka, Akihiro Kiriyama
  • Publication number: 20140299188
    Abstract: A solar cell panel end-sealing composition contains a butyl rubber, a polyolefin resin having a silyl group, and a catalyst. The catalyst is at least one of a metal oxide, a metal hydroxide, and a metal complex of a transition element and the solar cell panel end-sealing composition has a flow viscosity at 140° C. of 500 Pa·s or more and 8000 Pa·s or less.
    Type: Application
    Filed: April 2, 2014
    Publication date: October 9, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Youhei HAYASHI, Akihiro KIRIYAMA, Kazumasa ASANO, Shinichiro KOSE, Masato SHIRAI, Toru ISEKI
  • Publication number: 20140142208
    Abstract: A foaming composition for filling contains a polymer, an organic peroxide, and azodicarbonamide, and a viscosity thereof measured at a temperature of 120° C. and under a pressure of 500 MPa with a flow tester is in a range of 1050 to 4950 Pa·s.
    Type: Application
    Filed: January 22, 2014
    Publication date: May 22, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takehiro UI, Youhei HAYASHI
  • Publication number: 20140088211
    Abstract: A thermally foamable resin composition includes a base resin, foamable resin particles, and a cross-linking agent, wherein each of the foamable resin particles contains a solid resin and a thermally expandable substance contained in the solid resin.
    Type: Application
    Filed: April 3, 2012
    Publication date: March 27, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Youhei Hayashi, Yoshiaki Mitsuoka, Takehiro Ui
  • Patent number: 8673423
    Abstract: A foaming composition for filling contains a polymer, an organic peroxide, and azodicarbonamide, and a viscosity thereof measured at a temperature of 120° C. and under a pressure of 500 MPa with a flow tester is in a range of 1050 to 4950 Pa·s.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: March 18, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Takehiro Ui, Youhei Hayashi
  • Publication number: 20140030539
    Abstract: A foaming composition for filling and sealing contains a vinyl copolymer having an ester bond in a side chain thereof, an organic peroxide, a foaming agent, a hydrophobic resin, and a hydrophilic resin. A content ratio of the hydrophobic resin is in a range of 5 to 25 parts by mass based on 100 parts by mass of the vinyl copolymer. A content ratio of the hydrophilic resin is in a range of 1 to 20 parts by mass based on 100 parts by mass of the vinyl copolymer.
    Type: Application
    Filed: April 13, 2012
    Publication date: January 30, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takehiro Ui, Youhei Hayashi
  • Publication number: 20120328889
    Abstract: A thermally foamable resin composition contains foamable resin particles and a resin composition. Each of the foamable resin particles contains a solid resin and a thermally expandable substance contained in the solid resin.
    Type: Application
    Filed: February 25, 2011
    Publication date: December 27, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Youhei Hayashi, Yoshiaki Mitsuoka, Takehiro Ul
  • Publication number: 20110244212
    Abstract: A foaming composition for filling contains a polymer, an organic peroxide, and azodicarbonamide, and a viscosity thereof measured at a temperature of 120° C. and under a pressure of 500 MPa with a flow tester is in a range of 1050 to 4950 Pa·s.
    Type: Application
    Filed: March 22, 2011
    Publication date: October 6, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Takehiro Ui, Youhei Hayashi