Abstract: A fixing apparatus includes a fixing belt, a slide member, an opposing member, and a retaining member. The retaining member includes, in a groove portion, a bottom surface portion that is in contact with an opposite surface of the slide member from a slide surface, a side surface portion that is formed on a downstream side of the groove portion in a conveyance direction and intersecting the bottom surface portion, and a continuous portion that is formed between the bottom surface portion and the side surface portion. The slide member includes an abutment portion configured to abut against the side surface portion at a position downstream from a downstream edge of the opposite surface when the slide member is slidden against the fixing belt such that the downstream edge of the opposite surface is positioned upstream from the continuous portion in the conveyance direction.

Abstract: A rotatable buffer turret apparatus on which plural pairs of punches and dies to be set on a turret of a turret punch press are set, includes an upper buffer turret on which punch attachment holes in which the punches can be set are arranged circularly, and a lower buffer turret on which die attachment holes that is associated with the punch attachment holes and in which the dies can be set are arranged circularly. The upper and lower buffer turrets are rotatably attached to a single rotary shaft. A diameter of the lower buffer turret is made larger than a diameter of the upper buffer turret. The die attachment holes are formed in a circular die attachment area having a diameter larger than the diameter of the upper buffer turret. According to the apparatus, a tool exchange manually operated by an operator can be done easily and efficiently.

Abstract: A rotatable buffer turret apparatus on which plural pairs of punches and dies to be set on a turret of a turret punch press are set, includes an upper buffer turret on which punch attachment holes in which the punches can be set are arranged circularly, and a lower buffer turret on which die attachment holes that is associated with the punch attachment holes and in which the dies can be set are arranged circularly. The upper and lower buffer turrets are rotatably attached to a single rotary shaft. A diameter of the lower buffer turret is made larger than a diameter of the upper buffer turret. The die attachment holes are formed in a circular die attachment area having a diameter larger than the diameter of the upper buffer turret. According to the apparatus, a tool exchange manually operated by an operator can be done easily and efficiently.

Abstract: A rotatable buffer turret apparatus on which plural pairs of punches and dies to be set on a turret of a turret punch press are set, includes an upper buffer turret on which punch attachment holes in which the punches can be set are arranged circularly, and a lower buffer turret on which die attachment holes that is associated with the punch attachment holes and in which the dies can be set are arranged circularly. The upper and lower buffer turrets are rotatably attached to a single rotary shaft. A diameter of the lower buffer turret is made larger than a diameter of the upper buffer turret. The die attachment holes are formed in a circular die attachment area having a diameter larger than the diameter of the upper buffer turret. According to the apparatus, a tool exchange manually operated by an operator can be done easily and efficiently.

Abstract: A rotatable buffer turret apparatus on which plural pairs of punches and dies to be set on a turret of a turret punch press are set, includes an upper buffer turret on which punch attachment holes in which the punches can be set are arranged circularly, and a lower buffer turret on which die attachment holes that is associated with the punch attachment holes and in which the dies can be set are arranged circularly. The upper and lower buffer turrets are rotatably attached to a single rotary shaft. A diameter of the lower buffer turret is made larger than a diameter of the upper buffer turret. The die attachment holes are formed in a circular die attachment area having a diameter larger than the diameter of the upper buffer turret. According to the apparatus, a tool exchange manually operated by an operator can be done easily and efficiently.

Abstract: The present invention provides a high-tensile steel material having a tensile strength of the 550 MPa class or more which can simultaneously raise the strength and toughness of the heat affected zone of weld to equal those of the matrix and a method of production of the same, that is, a high-tensile steel material with excellent weldability and toughness and with tensile strength of the 550 MPa class or more containing, by mass %, C: 0.005 to 0.10%, W: 0.10 to 3.0%, Nb: 0.010 to 0.080%, and V: 0.010 to 0.50%, limiting the Ti to less than 0.005%, satisfying equation; EC=2[C]?[Nb]/9?[V]/12>0.020, having an amount of precipitation of W contained in the steel material, in terms of analytical value obtained by quantitative analysis of potential electrolysis extraction residue by fluorescent X-ray analysis, of 0.0050% or less, and having 60% or more of its structural composition in a cross-section of the steel as a bainite structure.

Abstract: An electronic component mounting system formed by interlinking a plurality of electronic component mounting machines in series for enabling a machine operator to be prevented from mistaking the machine to which an operation section or a signal tower belongs for another. In each of the machines, an operation section placed to one direction side from a center in the board conveying direction of the machine on a machine side face is placed in an attitude in which the normal direction of an operation face is inclined toward the center line. A signal tower placed on one direction side from the center line on the top face of the machine is placed in an attitude in which at least one portion is inclined only at an angle ? toward the center line.

Abstract: To form a welded joint having a sufficiently high fracture toughness value ?c by butting welding high strength steel plates having a yield strength of the 355 MPa class or more and a plate thickness of over 50 mm by electron beam welding, the butt welded joint is made one where the hardness of the weld metal is 110% to 220% of the hardness of the base material and where the width of the weld metal is 20% A or less of the base material plate thickness.

Abstract: The present invention provides high strength thick-gauge steel plate superior in weldability and having a tensile strength of 780 MPa or more and provides a method of production of the high strength thick-gauge steel plate by omitting tempering heat treatment in the production. The high strength thick-gauge steel plate of the present invention is high strength thick-gauge steel plate containing, by mass %, C: 0.030 to 0.055%, Mn: 2.4 to 3.5%, P: 0.01% or less, S: 0.0010% or less, Al: 0.06 to 0.10%, B: 0.0005 to 0.0020%, and N: 0.0015 to 0.0060%, having a weld cracking susceptibility parameter Pcm of 0.18% to 0.24%, and comprised mainly of martensite. The method of production of high strength thick-gauge steel plate of the present invention comprises heating a steel slab or cast slab having a predetermined composition of ingredients to 950 to 1100° C., rolling it at 820° C. or more, then starting accelerated cooling from 700° C. or more by a cooling rate of 8 to 80° C.

Abstract: An object of the invention is to provide an electronic component mounting system formed by interlinking a plurality of electronic component mounting machines in series for enabling a machine operator to be prevented from mistaking the machine to which an operation section or a signal tower belongs for another. In each of machines M1 to M5 making up an electronic component mounting system formed by interlinking a plurality of machines in series, an operation section 4 placed to one direction side from a center in the board conveying direction of the machine on a machine side face MS is placed in an attitude in which the normal direction of an operation face 4a is inclined toward the center line CL side. A signal tower 22 placed to one direction side from a center line CL on the top face of the machine is placed in an attitude in which at least one portion is inclined only at an angle ? toward the center line CL side.

Abstract: The present invention provides a high-tensile steel material having a tensile strength of the 550 MPa class or more which can simultaneously raise the strength and toughness of the heat affected zone of weld to equal those of the matrix and a method of production of the same, that is, a high-tensile steel material with excellent weldability and toughness and with tensile strength of the 550 MPa class or more containing, by mass %, C: 0.005 to 0.10%, W: 0.10 to 3.0%, Nb: 0.010 to 0.080%, and V: 0.010 to 0.50%, limiting the Ti to less than 0.005%, satisfying equation; EC=2[C]?[Nb]/9?[V]/12>0.020, having an amount of precipitation of W contained in the steel material, in terms of analytical value obtained by quantitative analysis of potential electrolysis extraction residue by fluorescent X-ray analysis, of 0.0050% or less, and having 60% or more of its structural composition in a cross-section of the steel as a bainite structure.

Abstract: The present invention provides high strength thick-gauge steel plate superior in weldability and having a tensile strength of 780 MPa or more and provides a method of production of the high strength thick-gauge steel plate by omitting tempering heat treatment in the production. The high strength thick-gauge steel plate of the present invention is high strength thick-gauge steel plate containing, by mass %, C: 0.030 to 0.055%, Mn: 2.4 to 3.5%, P: 0.01% or less, S: 0.0010% or less, Al: 0.06 to 0.10%, B: 0.0005 to 0.0020%, and N: 0.0015 to 0.0060%, having a weld cracking susceptibility parameter Pcm of 0.18% to 0.24%, and comprised mainly of martensite. The method of production of high strength thick-gauge steel plate of the present invention comprises heating a steel slab or cast slab having a predetermined composition of ingredients to 950 to 1100° C., rolling it at 820° C. or more, then starting accelerated cooling from 700° C. or more by a cooling rate of 8 to 80° C.

Abstract: To form a welded joint having a sufficiently high fracture toughness value ?c by butting welding high strength steel plates having a yield strength of the 355 MPa class or more and a plate thickness of over 50 mm by electron beam welding, the butt welded joint is made one where the hardness of the weld metal is 110% to 220% of the hardness of the base material and where the width of the weld metal is 20%A or less of the base material plate thickness. More preferably, the amount of O in the weld metal of the welded joint is made 20 ppm or more and the amount of oxides of a grain size of 2.0 ?m or more is made 10/mm2 or less; the weld metal of the welded joint is made to contain Ni in an amount of 1 to 4 mass % and contain it in more than an amount of 0.2 mass % or more of the content of the base material; or, when using as the base material a steel material containing as Ni in an amount of 2.5 mass % or more, making the content of Ni contained in the weld metal of the welded joint, by mass %, over 4% to 8%.

Abstract: A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component from a direction generally orthogonal to the central axes of the component holding members, the images of the component are captured by the first component image-pickup unit and the second component image-pickup unit from the two directions generally orthogonal to each other, and holding postures of the components are recognized on the basis of the images.

Abstract: An illumination apparatus includes a through-hole for detection formed at a center portion, and irradiates diffused light and directional light to an object to be detected. The apparatus includes an annular diffusion plate which diffuses light, a light source disposed annularly, and an annular reflection plate which reflects light from the light source to the side of said object to be detected. The diffusion plate, light source, and reflection plate are disposed in the order from the side of said object to be detected. The diffused light is generated by irradiating light from said light source to the object to be detected through said diffusion plate. Light from said light source is reflected by said reflection plate and then irradiated to the object to be detected.

Abstract: The present invention provides a device and a method for determining whether or not a component holder is good, which enable detecting component holders that are to affect correct component recognition and further enable preventing interferences between constituent devices, a component mounting apparatus with the determining device, and a component mounting method. The determining device has an illuminating device, a CCD camera and a controller to determine whether or not a suction nozzle is good based on luminance at a component hold face of the suction nozzle. The suction nozzle having light reflectance of the component hold face increased to a level whereat a correct recognition of an electronic component held by the suction nozzle is affected, can be detected accordingly. An interference preventing device is also provided, so that interference between the CCD camera and the suction nozzle can be prevented.

Abstract: In component mounting for executing a component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operational program for executing the component holding and pickup operation is received in a head unit, and the component holding and pickup operation is executed on the basis of the recipe. In addition, a timing signal based on this execution is transmitted from the head unit to a component feed unit, a recipe for the component feed operation for executing the component feed operation is received in the component feed unit, and the component feed operation is completed on the basis of this recipe and the timing signal transmitted from the head unit.

Abstract: In component mounting for executing component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operation program for executing the component holding and pickup operation is received in a head unit, and the component holding and pickup operation is executed on the basis of the recipe. In addition, a timing signal based on the execution is transmitted to a component feed unit, the recipe for the component feed operation for executing the component feed operation is received in the component feed unit, and the component feed operation is completed on the basis of the recipe and the timing signal transmitted from the head unit.

Abstract: The present invention provides a device and a method for determining whether or not component holder is good, which enable detecting component holders that are to affect correct component recognition and further enable preventing interferences between constituent devices, a component mounting apparatus with the determining device, and a component mounting method. The determining device has an illuminating device, a CCD camera and a controller to determine whether or not a suction nozzle is good based on a luminance at a component hold face of the suction nozzle. The suction nozzle having the light reflectance of the component hold face increased to a level whereat the correct recognition of an electronic component held by the suction nozzle is affected can be detected accordingly. An interference preventing device is also provided, so that the interference between the CCD camera and the suction nozzle can be prevented.

Abstract: A component placing head has a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component from a direction generally orthogonal to the central axes of the component holding members, the images of the component are captured by the first component image-pickup unit and the second component image-pickup unit from the two directions generally orthogonal to each other, and holding postures of the components are recognized on basis of the images.