Patents by Inventor Youichi Yanai

Youichi Yanai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method component on a circuit board
    Patent number: 7213332
    Abstract: A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the component is situated on the electrodes. The printing positions of the solders are stored. Mounting position data for where the component is to be mounted on the solders is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: May 8, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masafumi Inoue, Yusuke Yamamoto, Hikaru Onizaki, Youichi Yanai, Yasuhiro Morimitsu
  • Method of mounting component on a circuit board
    Patent number: 6983538
    Abstract: A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: January 10, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masafumi Inoue, Yusuke Yamamoto, Hikaru Onizaki, Youichi Yanai, Yasuhiro Morimitsu
  • Method and mounting component on a circuit board
    Publication number: 20050015975
    Abstract: A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.
    Type: Application
    Filed: August 20, 2004
    Publication date: January 27, 2005
    Inventors: Masafumi Inoue, Yusuke Yamamoto, Hikaru Onizaki, Youichi Yanai, Yasuhiro Morimitsu
  • Method of mounting component on a circuit board
    Publication number: 20040085701
    Abstract: A component mounter for picking up a component and mounting it on a board using a transfer head. A position of solder paste printed on an electrode on a board is previously measured and a measurement result is stored. Mounting coordinates for mounting the component using the transfer head is calculated based on this measurement result. In the mounting operation, the transfer head is controlled using mounting coordinates determined based on the solder printing position so as to mount the component on each electrode on the board. This prevents the occurrence of positional deviation between the mounted component and printed solder paste. Defective mounting, which may occur in a reflow process due to positional deviation, is thus preventable.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 6, 2004
    Inventors: Masafumi Inoue, Yusuke Yamamoto, Hikaru Onizaki, Youichi Yanai, Yasuhiro Morimitsu
  • Component mounter and mounting method
    Publication number: 20020046462
    Abstract: A component mounter for picking up a component and mounting it on a board using a transfer head. A position of solder paste printed on an electrode on a board is previously measured and a measurement result is stored. Mounting coordinates for mounting the component using the transfer head is calculated based on this measurement result. In the mounting operation, the transfer head is controlled using mounting coordinates determined based on the solder printing position so as to mount the component on each electrode on the board. This prevents the occurrence of positional deviation between the mounted component and printed solder paste. Defective mounting, which may occur in a reflow process due to positional deviation, is thus preventable.
    Type: Application
    Filed: September 5, 2001
    Publication date: April 25, 2002
    Inventors: Masafumi Inoue, Yusuke Yamamoto, Hikaru Onizaki, Youichi Yanai, Yasuhiro Morimitsu