Abstract: Two phase heat transfer systems including integrated fluid transfer paths for exchange of a working fluid between an evaporator and condenser. Separate fluid transfer paths may be defined for communication of working fluid between the evaporator and condenser, wherein at least one of the fluid transfer paths is integrated with the evaporator and/or condenser. In one embodiment, both first and second fluid transfer paths are integrally provided to establish direct fluid communication between the evaporator and condenser to facilitate flow of vaporized and condensed working fluid respectively.

Abstract: A dental illumination apparatus includes a lamp system mounted on a support structure. The lamp system includes a light source. A control system is provided for controlling the activation of the lamp system. A light guide shields soft tissues local to teeth of a subject from effects of ultraviolet radiation. The light guide includes a lamp attachment formation coupled to the lamp system, and a recording device in communication with the control system, the recording device including memory which stores the amount of time that the light source has been on since the beginning of a treatment procedure. A lip retractor, coupled to the light guide, is adapted to receive the lips of a patient.

Abstract: A dental illumination apparatus includes a lamp system mounted on a support structure. The lamp system includes a light source. A control system is provided for controlling the activation of the lamp system. A light guide shields soft tissues local to teeth of a subject from effects of ultraviolet radiation. The light guide includes a lamp attachment formation coupled to the lamp system, and a recording device in communication with the control system, the recording device including memory which stores the amount of time that the light source has been on since the beginning of a treatment procedure. A lip retractor, coupled to the light guide, is adapted to receive the lips of a patient.

Abstract: A dental illumination system includes an adjustable self-supporting frame and a lamp head coupled to the frame. The lamp head includes a housing and a spacer having formations that is adapted to removably mechanically couple the lamp head to a reference device, again having formations, for facilitating illumination of a tooth by a light source contained within the lamp head. The spacer and lamp head may be formed integrally. If formed separately, both the lamp head and the spacer may include formations.

Abstract: A folded system-in-package (SiP) assembly is provided for minimizing the footprint of two corresponding circuit board modules in a handheld electronic device. The assembly includes top and bottom circuit board modules that are electrically interconnected through a flex circuit. Either a plate or wrapped heat spreader may be thermally coupled to the top circuit board module to conduct heat from the heat-generating components mounted to the top circuit board module and to a case of the electronic device.

Abstract: Two phase heat transfer systems including integrated fluid transfer paths for exchange of a working fluid between an evaporator and condenser. Separate fluid transfer paths may be defined for communication of working fluid between the evaporator and condenser, wherein at least one of the fluid transfer paths is integrated with the evaporator and/or condenser. In one embodiment, both first and second fluid transfer paths are integrally provided to establish direct fluid communication between the evaporator and condenser to facilitate flow of vaporized and condensed working fluid respectively.

Abstract: Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.

Abstract: A planar transformer comprises a laminate substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding, a core configured to fit inside the opening to enclose the laminate substrate. At least one heat sink fin is integrally formed with the top, bottom or both sides of the core. A method of forming a planar transformer comprises laminating a substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding, fitting a core inside the opening, and enclosing the laminate substrate. One of the top, bottom or both sides of the core include one or more heat sink fins.

Abstract: A folded system-in-package (SiP) assembly is provided for minimizing the footprint of two corresponding circuit board modules in a handheld electronic device. The assembly includes top and bottom circuit board modules that are electrically interconnected through a flex circuit. Either a plate or wrapped heat spreader may be thermally coupled to the top circuit board module to conduct heat from the heat-generating components mounted to the top circuit board module and to a case of the electronic device.

Abstract: Provided herein are hybrid-cooled electronics chassis and boards. Such boards may be plugged in a chassis and connected to a common liquid-cooling loop shared by two or more of the boards inside that chassis. Liquid cooling conduits between the electronics board/module and the chassis are engaged and disengaged with little or no manual intervention. For instance, the connections between such cooling conduits may utilize quick coupling connectors that allow for automatic or near automatic engagement and disengagement upon the engagement of the electronics board/module with the electronics chassis. In one arrangement, a chassis includes a base portion that has a fan, liquid cooling system and heat exchanger mounted thereon. An electronics module is selectively engageable with the base portion in a manner to have air displaced across the electronics module when engaged as well establish liquid flow through the electronics module when engaged.

Abstract: The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compared to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.

Abstract: The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compare to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.

Abstract: A planar transformer comprises a laminate substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding, a core configured to fit inside the opening to enclose the laminate substrate. At least one heat sink fin is integrally formed with the top, bottom or both sides of the core. A method of forming a planar transformer comprises laminating a substrate having an opening with metal traces wound thereabout forming a primary and a secondary winding, fitting a core inside the opening, and enclosing the laminate substrate. One of the top, bottom or both sides of the core include one or more heat sink fins.

Abstract: An electronics chassis is provided that utilizes multiple fan units, each of which may incorporate multiple fans, to improve airflow through an internal enclosure of the chassis. Various combinations of multiple fan units are utilized to increase airflow and provide redundancy in the event of the failure of one or more fans. In one arrangement, combinations of horizontally mounted and vertically mounted fans are utilized to improve airflow. In further arrangements, multiple access openings are provided into the enclosure such that an individual fan unit or an individual fan may be accessed for servicing purposes without altering or discontinuing the operation of other fans or fan units.

Abstract: The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compare to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.

Abstract: A dental illumination system includes an adjustable self-supporting frame and a lamp head coupled to the frame. The lamp head includes a housing and a spacer having formations that is adapted to removably mechanically couple the lamp head to a reference device, again having formations, for facilitating illumination of a tooth by a light source contained within the lamp head. The spacer and lamp head may be formed integrally. If formed separately, both the lamp head and the spacer may include formations.

Abstract: Provided herein are hybrid-cooled electronics chassis and boards. Such boards may be plugged in a chassis and connected to a common liquid-cooling loop shared by two or more of the boards inside that chassis. Liquid cooling conduits between the electronics board/module and the chassis are engaged and disengaged with little or no manual intervention. For instance, the connections between such cooling conduits may utilize quick coupling connectors that allow for automatic or near automatic engagement and disengagement upon the engagement of the electronics board/module with the electronics chassis. In one arrangement, a chassis includes a base portion that has a fan, liquid cooling system and heat exchanger mounted thereon. An electronics module is selectively engageable with the base portion in a manner to have air displaced across the electronics module when engaged as well establish liquid flow through the electronics module when engaged.

Abstract: Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.

Abstract: An electronics chassis is provided that utilizes multiple fan units, each of which may incorporate multiple fans, to improve airflow through an internal enclosure of the chassis. Various combinations of multiple fan units are utilized to increase airflow and provide redundancy in the event of the failure of one or more fans. In one arrangement, combinations of horizontally mounted and vertically mounted fans are utilized to improve airflow. In further arrangements, multiple access openings are provided into the enclosure such that an individual fan unit or an individual fan may be accessed for servicing purposes without altering or discontinuing the operation of other fans or fan units.

Abstract: A dental illumination system includes an adjustable self-supporting frame and a lamp head coupled to the frame. The lamp head includes a housing and a spacer having formations that is adapted to removably mechanically couple the lamp head to a reference device, again having formations, for facilitating illumination of a tooth by a light source contained within the lamp head. The spacer and lamp head may be formed integrally. If formed separately, both the lamp head and the spacer may include formations.