Patents by Inventor Young-Gon Kim

Young-Gon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140290982
    Abstract: Disclosed herein is a printed circuit board including: an insulating layer having first and second surfaces; a first circuit layer formed on the first surface of the insulating layer and including at least one first circuit pattern; a second circuit layer formed on the first circuit layer and including at least one second circuit pattern; and an insulating film formed in an insulating region of the first and second circuit layers.
    Type: Application
    Filed: March 13, 2014
    Publication date: October 2, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Uk Lee, Young Gon Kim, Seung Hyun Noh
  • Patent number: 8818282
    Abstract: An integrated circuit is described. The integrated circuit includes a global positioning system core that generates a GPS clock signal using an inductor-capacitor voltage controlled oscillator. The integrated circuit also includes a transceiver core configured to use the GPS clock signal. The transceiver core may not include a voltage controlled oscillator.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: August 26, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Beomsup Kim, Tzu-Wang Pan, Young Gon Kim
  • Publication number: 20140174810
    Abstract: Disclosed herein are a printed circuit board (PCB) and a method of manufacturing the same. The PCB includes a core layer, metal bumps embedded in the core layer, one surface of the metal bumps being opened to the outside, and a solder resist layer including an opening is manufactured by a separating substrate manufacture method. In the PCB, empty space between the bumps is filled with an insulating material instead of solder resist, and thus, a problem in terms of an empty space between bumps is addressed without requiring a new solder resist process.
    Type: Application
    Filed: September 18, 2013
    Publication date: June 26, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Hyun Noh, Dong Uk Lee, Young Gon Kim
  • Patent number: 8742880
    Abstract: An integrated circuit is disclosed. The integrated circuit includes a primary coil. The integrated circuit also includes a first secondary coil that acts as a first transformer with the primary coil. The integrated circuit further includes a second secondary coil that acts as a second transformer with the primary coil. The primary coil, the first secondary coil and the second secondary coil have a layout on the integrated circuit to minimize coupling between the first secondary coil and the second secondary coil.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: June 3, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Young Gon Kim, Hong Sun Kim
  • Publication number: 20130229213
    Abstract: An output portion of a charge pump receives control signals from a phase frequency detector and in response outputs positive current pulses and negative current pulses to a loop filter. A current control portion of the charge pump controls the output portion such that the magnitudes of the positive and negative current pulses are the same. Within the current control portion there is a “Charge Pump Output Voltage Replica Node” (CPOVRN). The voltage on this CPOVRN is maintained to be the same as a voltage on the charge pump output node. A capacitor leakage compensation circuit indirectly senses the voltage across a leaking capacitor of the loop filter by sensing the voltage on the CPOVRN. The compensation circuit imposes the sensed voltage across a replica capacitor, mirrors a current leaking through the replica, and supplies the mirrored current in the form of a compensation current to the leaking capacitor.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 5, 2013
    Applicant: QUALCOMM Incorporated
    Inventors: Sunghyun Park, Shen Wang, Young Gon Kim
  • Patent number: 8445998
    Abstract: A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issue associated therewith.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: May 21, 2013
    Assignee: Intersil Americas Inc.
    Inventors: Young-Gon Kim, Nikhil Vishwanath Kelkar, Louis Elliott Pflughaupt
  • Publication number: 20130106553
    Abstract: An integrated circuit is disclosed. The integrated circuit includes a primary coil. The integrated circuit also includes a first secondary coil that acts as a first transformer with the primary coil. The integrated circuit further includes a second secondary coil that acts as a second transformer with the primary coil. The primary coil, the first secondary coil and the second secondary coil have a layout on the integrated circuit to minimize coupling between the first secondary coil and the second secondary coil.
    Type: Application
    Filed: January 23, 2012
    Publication date: May 2, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Young Gon Kim, Hong Sun Kim
  • Patent number: 8386696
    Abstract: A method of writing partial page data in a non-volatile memory device includes, reading data from a second block when the size of a last page of data to be written in a page of a first block is smaller than a size of the page of the first block, wherein a size of the read data is given by the size of the page of the first block minus the size of the last page of data; storing together data of the last page and the data read from the second block in a buffer; and writing the data stored in the buffer in the first block.
    Type: Grant
    Filed: February 13, 2008
    Date of Patent: February 26, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-hyuk Kim, Chang-eun Choi, Young-gon Kim
  • Publication number: 20130040583
    Abstract: An integrated circuit is described. The integrated circuit includes a global positioning system core that generates a GPS clock signal using an inductor-capacitor voltage controlled oscillator. The integrated circuit also includes a transceiver core configured to use the GPS clock signal. The transceiver core may not include a voltage controlled oscillator.
    Type: Application
    Filed: January 25, 2012
    Publication date: February 14, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Beomsup Kim, Tzu-Wang Pan, Young Gon Kim
  • Patent number: 8267319
    Abstract: A radio frequency identifying device minimizes a null point area within a radiation pattern by horizontally or vertically vibrating an antenna plate radiating a radio frequency beam by using at least one vibration motor.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: September 18, 2012
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Hoon Young Koo, Jae Gwan Song, Young Gon Kim, Hong Suk Hu, Jong Heung Park
  • Patent number: 8240552
    Abstract: Provided is a method and system for measuring traffic quality in distribution using test mail into which a radio frequency identity tag is inserted. The system accepts at least one test distribution piece including a tag, and collects information of test distribution by sensing a tag included with the test distribution piece at measuring points for measuring a time from acceptance to delivery of a general distribution piece. The system generates a processing rate and a delivery rate of distribution based on information of the test distribution pieces collected from the measuring points.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: August 14, 2012
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Young Gon Kim, Jong Heung Park
  • Patent number: 8174336
    Abstract: A first transmission line is formed on a first surface of a substrate. A first end of the first transmission line is connected to a transmission line of an unbalanced line. A second end is connected to a first transmission line of a balanced line. A second transmission line extends from a first end of the unbalanced line, alongside the first transmission line and spaced therefrom, and is connected to a second of the transmission lines of the balanced line. A ground plane is formed on a second surface of the substrate, extends from a first end of the balanced line, and is formed along the second transmission line to which the ground plane is connected through one or more vias. A width of a portion of the ground plane adjacent to the unbalanced line is greater than a portion thereof adjacent to the balanced line.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: May 8, 2012
    Assignee: EM-Wise Communications Company
    Inventors: Young Gon Kim, Hyun Park
  • Patent number: 8161320
    Abstract: An apparatus, memory device controller and method of controlling a memory device are provided. The example apparatus may include a bad block bitmap referencing unit configured to obtain bad block information from a bad block bitmap based on a given memory address, the given memory address being one of a logical memory address and a physical memory address corresponding to the logical memory address, the bad block information indicating whether a given memory block corresponding to the given memory address is a bad block and a memory mapping unit configured to obtain the physical memory address corresponding to the logical memory address, and configured to obtain a reserved physical memory address corresponding to the physical memory address if the bad block information indicates that the given memory block is a bad block. In an example, the apparatus may be embodied as a memory device controller including a flash translation layer (FTL).
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: April 17, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-Hyuk Kim, Yang-Sup Lee, Young-Gon Kim
  • Patent number: 7935569
    Abstract: A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: May 3, 2011
    Assignee: Tessera, Inc.
    Inventors: Kyong-Mo Bang, David Gibson, Young-Gon Kim, John B. Riley, III
  • Publication number: 20110057038
    Abstract: A radio frequency identifying device minimizes a null point area within a radiation pattern by horizontally or vertically vibrating an antenna plate radiating a radio frequency beam by using at least one vibration motor.
    Type: Application
    Filed: January 15, 2010
    Publication date: March 10, 2011
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hoon Young KOO, Jae Gwan Song, Young Gon Kim, Hong Suk Hu, Jong Heung Park
  • Patent number: 7816251
    Abstract: A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: October 19, 2010
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Masud Beroz, Young-Gon Kim, David B. Tuckerman
  • Publication number: 20100182096
    Abstract: A first transmission line is formed on a first surface of a substrate. A first end of the first transmission line is connected to a transmission line of an unbalanced line. A second end is connected to a first transmission line of a balanced line. A second transmission line extends from a first end of the unbalanced line, alongside the first transmission line and spaced therefrom, and is connected to a second of the transmission lines of the balanced line. A ground plane is formed on a second surface of the substrate, extends from a first end of the balanced line, and is formed along the second transmission line to which the ground plane is connected through one or more vias. A width of a portion of the ground plane adjacent to the unbalanced line is greater than a portion thereof adjacent to the balanced line.
    Type: Application
    Filed: March 18, 2008
    Publication date: July 22, 2010
    Applicant: EM-WISE COMMUNICATIONS COMPANY
    Inventors: Young Gon Kim, Hyun Park
  • Patent number: 7714415
    Abstract: A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issuse associated therewith.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: May 11, 2010
    Assignee: Intersil Americas, Inc.
    Inventors: Young-Gon Kim, Nikhil Vishwanath Kelkar, Louis Elliott Pflughaupt
  • Publication number: 20090255157
    Abstract: Provided is a signboard for use in a vehicle, which is installed in the rear portion of the inside of the vehicle to thus deliver a message to a driver or passengers in other vehicles which follow. The vehicle signboard includes a support member having a support plate which is adhered on one side of the inner surface of a rear glass window in the vehicle and a support bar supported by the support plate; a display unit connected to the support member; a motor unit which is fixed to the support member and makes the display unit connected with a rotating member rotate; and a power supply unit which supplies electric power to the motor unit. Accordingly, the vehicle signboard provides an effect of conveying the proper expressions such as thanks and sorry to the drivers and passengers in the other vehicles which follow without obstructing the driver's rear field of view during running.
    Type: Application
    Filed: August 4, 2006
    Publication date: October 15, 2009
    Inventor: Young Gon Kim
  • Patent number: 7564882
    Abstract: An integrated circuit for providing burn-in current to a laser diode. The integrated circuit includes a laser driver having an output for connection to the laser diode. Burn-in circuitry is formed on the integrated circuit and generates a burn-in current. A switch is formed on the integrated circuit and couples the burn-in current to the laser diode in response to an enable signal.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: July 21, 2009
    Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.
    Inventors: Young Gon Kim, Myunghee Lee