Patents by Inventor Young Heon OH

Young Heon OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11342562
    Abstract: The present disclosure relates to a binder solution for all-solid-state batteries. The binder solution includes a polymer binder, a first solvent, and an ion-conductive additive, wherein the ion-conductive additive includes lithium salt and a second solvent, which is different from the first solvent.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: May 24, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
    Inventors: Sang Mo Kim, Yong Sub Yoon, Jae Min Lim, Jin Soo Kim, Sang Heon Lee, Yoon Seok Jung, Young Jin Nam, Sung Hoo Jung, Dae Yang Oh
  • Patent number: 10720278
    Abstract: A multilayer ceramic capacitor with decreased high voltage stress defects and a board having the same may include a body formed by stacking a plurality of dielectric layers and a plurality of first and second internal electrodes in a width direction, the first and second internal electrodes including body portions overlapping each other and lead portions exposed to a mounting surface of the body and disposed to be spaced apart from each other, respectively; and first to third external electrodes disposed on the mounting surface of the capacitor body to be connected to the lead portions, respectively, wherein the body portions of the first and second internal electrodes have different areas from each other.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Heon Oh, Se Hwan Bong, Young Ha Kim, Dong Gun Kim
  • Patent number: 10319520
    Abstract: A multilayer ceramic capacitor with decreased high voltage stress defects and a board having the same may include a body formed by stacking a plurality of dielectric layers and a plurality of first and second internal electrodes in a width direction, the first and second internal electrodes including body portions overlapping each other and lead portions exposed to a mounting surface of the body and disposed to be spaced apart from each other, respectively; and first to third external electrodes disposed on the mounting surface of the capacitor body to be connected to the lead portions, respectively, wherein the body portions of the first and second internal electrodes have different areas from each other.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: June 11, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Heon Oh, Se Hwan Bong, Young Ha Kim, Dong Gun Kim
  • Publication number: 20190164691
    Abstract: A multilayer ceramic capacitor with decreased high voltage stress defects and a board having the same may include a body formed by stacking a plurality of dielectric layers and a plurality of first and second internal electrodes in a width direction, the first and second internal electrodes including body portions overlapping each other and lead portions exposed to a mounting surface of the body and disposed to be spaced apart from each other, respectively; and first to third external electrodes disposed on the mounting surface of the capacitor body to be connected to the lead portions, respectively, wherein the body portions of the first and second internal electrodes have different areas from each other.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Inventors: Young Heon OH, Se Hwan BONG, Young Ha KIM, Dong Gun KIM
  • Publication number: 20170194097
    Abstract: A multilayer ceramic capacitor with decreased high voltage stress defects and a board having the same may include a body formed by stacking a plurality of dielectric layers and a plurality of first and second internal electrodes in a width direction, the first and second internal electrodes including body portions overlapping each other and lead portions exposed to a mounting surface of the body and disposed to be spaced apart from each other, respectively; and first to third external electrodes disposed on the mounting surface of the capacitor body to be connected to the lead portions, respectively, wherein the body portions of the first and second internal electrodes have different areas from each other.
    Type: Application
    Filed: September 7, 2016
    Publication date: July 6, 2017
    Inventors: Young Heon OH, Se Hwan BONG, Young Ha KIM, Dong Gun KIM
  • Publication number: 20160233024
    Abstract: A multilayer ceramic component includes a ceramic body in which a plurality of insulating layers and internal electrodes are alternately stacked. The internal electrodes include first and second internal electrodes respectively exposed to first and second end surfaces of the ceramic body with insulating layers interposed between the first and second internal electrodes. First dummy electrodes and second dummy electrodes are disposed on the insulating layers, spaced apart from the internal electrodes by a predetermined interval and exposed to the first end surface of the ceramic body. The multilayer ceramic component satisfies 0.273?•/D?0.636, where D is a distance between an end of the first internal electrode and the second end surface of the ceramic body, and ? is a width of the first dummy electrode.
    Type: Application
    Filed: November 5, 2015
    Publication date: August 11, 2016
    Inventors: Dong Gun KIM, Young Ha KIM, Jae Yeol CHOI, Se Hwan BONG, Young Heon OH, In Ho LEE