Patents by Inventor Young-Hoo Kim

Young-Hoo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220189765
    Abstract: A substrate drying apparatus includes; a drying chamber configured to load a substrate and including a lower chamber and an upper chamber above the lower chamber, a supply port configured to supply a supercritical fluid into the drying chamber and including a main supply port and a sub-supply port horizontally spaced apart from the main supply port, wherein the main supply port penetrates a center portion of the upper chamber, and a first buffer member coupled to the upper chamber, vertically separated from the sub-supply port, and vertically overlapping the sub-supply port, such that supercritical fluid vertically introduced into the drying chamber through the sub-supply port is impeded by the first buffer member to change a flow direction for the supercritical fluid.
    Type: Application
    Filed: June 24, 2021
    Publication date: June 16, 2022
    Inventors: JI HOON JEONG, SEO HYUN KIM, SANG JINE PARK, YOUNG-HOO KIM, KUN TACK LEE
  • Publication number: 20220084812
    Abstract: A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.
    Type: Application
    Filed: May 12, 2021
    Publication date: March 17, 2022
    Inventors: Sung Hyun Park, Seo Hyun Kim, Seung Ho Kim, Young Chan Kim, Young-Hoo Kim, Tae-Hong Kim, Hyun Woo Nho, Seung Min Shin, Kun Tack Lee, Hun Jae Jang
  • Patent number: 11189503
    Abstract: Disclosed are substrate drying methods, photoresist developing methods, and/or photolithography methods. The substrate drying method including providing a drying liquid on a substrate, increasing a pressure of the drying liquid to produce a supercritical fluid, and removing the supercritical fluid to dry the substrate may be provided.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: November 30, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Hoo Kim, Kuntack Lee, Yong-Jhin Cho, Chawon Koh, Sunghyun Park, Hyosan Lee, Ji Hoon Cha, Soo Young Choi
  • Publication number: 20210343552
    Abstract: A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.
    Type: Application
    Filed: July 15, 2021
    Publication date: November 4, 2021
    Inventors: Seung-Min SHIN, Seok-Hoon KIM, Young-Hoo KIM, In-Gi KIM, Tae-Hong KIM, Sung-Hyun PARK, Jin-Woo LEE, Ji-Hoon CHA, Yong-Jun CHOI
  • Patent number: 11149234
    Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: October 19, 2021
    Assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.
    Inventors: Mi Hyun Park, Jung-Min Oh, Young-Hoo Kim, Hyo San Lee, Tae Keun Kim, Ye Rim Yeon, Hae Rim Oh, Ji Soo Jeong, Min Hee Cho
  • Patent number: 11087996
    Abstract: A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: August 10, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-Min Shin, Seok-Hoon Kim, Young-Hoo Kim, In-Gi Kim, Tae-Hong Kim, Sung-Hyun Park, Jin-Woo Lee, Ji-Hoon Cha, Yong-Jun Choi
  • Publication number: 20210217635
    Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Inventors: Young-hoo Kim, Sang-jine PARK, Yong-jhin CHO, Yeon-jin GIL, Ji-hoon JEONG, Byung-kwon CHO, Yong-sun KO, Kun-tack LEE
  • Publication number: 20210217636
    Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.
    Type: Application
    Filed: March 30, 2021
    Publication date: July 15, 2021
    Inventors: Yong-Jhin Cho, Young-Hoo Kim, Jihoon Jeong, Yungjun Kim, Jung-Min Oh, Kuntack Lee, Hyosan Lee
  • Patent number: 10991600
    Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 27, 2021
    Inventors: Yong-Jhin Cho, Young-Hoo Kim, Jihoon Jeong, Yungjun Kim, Jung-Min Oh, Kuntack Lee, Hyosan Lee
  • Patent number: 10985036
    Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: April 20, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo Kim, Sang-Jine Park, Yong-Jhin Cho, Yeon-Jin Gil, Ji-Hoon Jeong, Byung-Kwon Cho, Yong-Sun Ko, Kun-Tack Lee
  • Publication number: 20210060625
    Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
    Type: Application
    Filed: June 2, 2020
    Publication date: March 4, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung Min SHIN, Hun Jae JANG, Seok Hoon KIM, Young-Hoo KIM, In Gi KIM, Tae-Hong KIM, Kun Tack LEE, Ji Hoon CHA, Yong Jun CHOI
  • Patent number: 10825698
    Abstract: Disclosed are a substrate drying apparatus, a facility of manufacturing a semiconductor device, and a method of drying a substrate. The substrate drying apparatus includes a chamber that is configured to dry a substrate at a first temperature, a first reservoir that is configured to store a first supercritical fluid at a second temperature that is less than the first temperature, a second reservoir that is configured to store a second supercritical fluid at a third temperature that is greater than the first temperature, and a supply unit connected between the chamber and the first reservoir and/or second reservoir. The supply unit is configured to supply the chamber with the first supercritical fluid and second supercritical fluid.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-Jhin Cho, Young-Hoo Kim, Jihoon Jeong, Yungjun Kim, Kuntack Lee
  • Publication number: 20200343113
    Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.
    Type: Application
    Filed: November 21, 2019
    Publication date: October 29, 2020
    Inventors: Yong Jun CHOI, Seok Hoon KIM, Young-Hoo KIM, In Gi KIM, Sung Hyun PARK, Seung Min SHIN, Kun Tack LEE, Jinwoo LEE, Hun Jae JANG, Ji Hoon CHA
  • Publication number: 20200152486
    Abstract: Disclosed are substrate drying methods, photoresist developing methods, and/or photolithography methods. The substrate drying method including providing a drying liquid on a substrate, increasing a pressure of the drying liquid to produce a supercritical fluid, and removing the supercritical fluid to dry the substrate may be provided.
    Type: Application
    Filed: May 23, 2019
    Publication date: May 14, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young-Hoo KIM, Kuntack LEE, Yong-Jhin CHO, Chawon KOH, Sunghyun PARK, Hyosan LEE, Ji Hoon CHA, Soo Young CHOI
  • Publication number: 20200083063
    Abstract: A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.
    Type: Application
    Filed: April 1, 2019
    Publication date: March 12, 2020
    Inventors: Seung-Min SHIN, Seok-Hoon KIM, Young-Hoo KIM, In-Gi KIM, Tae-Hong KIM, Sung-Hyun PARK, Jin-Woo LEE, Ji-Hoon CHA, Yong-Jun CHOI
  • Patent number: 10576582
    Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hoo Kim, Il-Sang Lee, Yong-sun Ko, Chang-Gil Ryu, Kun-Tack Lee, Hyo-San Lee
  • Publication number: 20190259641
    Abstract: A liquid chemical recycle system includes a buffer tank receiving a first liquid chemical from outside; a vacuum tank having a vacuum pump connected thereto and receiving the first liquid chemical from the buffer tank using the vacuum pump; and a recycle tank receiving the first liquid chemical from the vacuum tank and providing a second liquid chemical, which is a recycled first liquid chemical, to the outside, wherein the buffer tank includes a first injection portion, to which the first liquid chemical is provided, and a first supply portion, which provides the first liquid chemical to the vacuum tank, and a bottom of the buffer tank is downwardly inclined toward the first supply portion to prevent a material contained in the first liquid chemical from being accumulated in the buffer tank.
    Type: Application
    Filed: August 29, 2018
    Publication date: August 22, 2019
    Inventors: Young-Hoo KIM, Sung Hyun PARK, Hyun Woo NHO, Ji Hoon CHA, Yong Jun CHOI
  • Publication number: 20190241844
    Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035.
    Type: Application
    Filed: January 17, 2019
    Publication date: August 8, 2019
    Inventors: Mi Hyun PARK, Jung-Min OH, Young-Hoo KIM, Hyo San LEE, Tae Keun KIM, Ye Rim YEON, Hae Rim OH, Ji Soo JEONG, Min Hee CHO
  • Patent number: 10332762
    Abstract: A chemical liquid supply apparatus includes a nozzle unit including a nozzle arm and an injection nozzle mounted in an end of the nozzle arm, a chemical liquid supply unit including a first chemical liquid tank accommodating a first chemical liquid and a second chemical liquid tank accommodating a second chemical liquid, and supplying the first chemical liquid and the second chemical liquid to the nozzle unit, and a mixer unit provided in the nozzle unit and discharging a process fluid by mixing the first chemical liquid and the second chemical liquid, wherein the mixer unit includes an in-line mixer mixing the first chemical liquid and the second chemical liquid that are continually injected from the chemical liquid supply unit, and a mixer pipe extending from the in-line mixer to the injection nozzle.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: June 25, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-hoo Kim, Il-sang Lee, In-gi Kim, Kyoung-hwan Kim, Hyo-san Lee, Sang-won Bae, Tae-hong Kim, Yong-jun Choi
  • Patent number: 10186427
    Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyoung Hwan Kim, Ingi Kim, Mihyun Park, Young-Hoo Kim, Ui-soon Park, Jung-Min Oh, Kuntack Lee, Hyosan Lee