Patents by Inventor Young Jin No

Young Jin No has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting package
    Patent number: 10388841
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: August 20, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • LIGHT EMITTING PACKAGE
    Publication number: 20180130934
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 10, 2018
    Inventors: Byung Mok KIM, Hiroshi KODAIRA, Su Jung JUNG, Bo Hee KANG, Young Jin NO, Yuichiro TANDA, Satoshi OZEKI
  • Light emitting package
    Patent number: 9893259
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: February 13, 2018
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • Light emitting device package
    Patent number: 9437791
    Abstract: Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: September 6, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byung Mok Kim, Young Jin No, Bo Hee Kang, Hiroshi Kodaira
  • LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20140167095
    Abstract: Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 19, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Byung Mok KIM, Young Jin NO, Bo Hee KANG, Hiroshi KODAIRA
  • LIGHT EMITTING PACKAGE
    Publication number: 20140042482
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Application
    Filed: June 21, 2013
    Publication date: February 13, 2014
    Inventors: Byung Mok KIM, Kodaira Hiroshi, Su Jung Jung, Bo Hee Kang, Young Jin No