Patents by Inventor Young Kyum Ahn

Young Kyum Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro cantilever style contact pin structure for wafer probing
    Patent number: 6414501
    Abstract: The present invention is to provide a micro cantilever-type probe disposed on a probe card, having such appropriate elasticity and mechanical strength that the probe would recover its unforced shape after deformation during an inspection and maintain its original shape even after three hundred thousand uses. The present invention provides a probe card which has an electrically insulated substrate fixed on a circuit board; a plurality of elastic probes with a sharpened end fixed on the insulated substrate; and wiring formed on the probe, the insulated substrate and the circuit board. The inventive probe is manufactured by patterning a substrate using photolithography and etching a portion except a pattern-defined portion. The probe is coated by metal layer(s).
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: July 2, 2002
    Assignee: AMST Co., Ltd.
    Inventors: Dong Il Kim, Young Kyum Ahn, Sam Won Chung, Byung Chang Song, Ha Poong Jeong
  • Micro cantilever style contact pin structure for wafer probing
    Publication number: 20020008530
    Abstract: The present invention is to provide a micro cantilever-type probe disposed on a probe card, having such appropriate elasticity and mechanical strength that the probe would recover its unforced shape after deformation during an inspection and maintain its original shape even after three hundred thousand uses. The present invention provides a probe card comprising an electrically insulated substrate fixed on a circuit board; a plurality of elastic probes with a sharpened end fixed on the insulated substrate; and wiring formed on the probe, the insulated substrate and the circuit board. The inventive probe is manufactured by patterning a substrate using photolithography and etching a portion except a pattern-defined portion. The probe is coated by metal layer(s).
    Type: Application
    Filed: September 27, 2001
    Publication date: January 24, 2002
    Applicant: AMST Co., Ltd.
    Inventors: Dong II Kim, Young Kyum Ahn, Sam Won Chung, Byung Chang Song, Ha Poong Jeong