Patents by Inventor Young-Moon Yu

Young-Moon Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200107739
    Abstract: Provided is a biometric information measurement method. The method includes providing a bio-material including at least one of cells and tissues, contacting a first electrode and a second electrode with the bio-material and applying a first electrical signal and a second electrical signal to the bio-material, sensing a third electrical signal from the bio-material, and analyzing an oxygen concentration in the bio-material from the third electrical signal.
    Type: Application
    Filed: September 10, 2019
    Publication date: April 9, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: YOUNG SAM PARK, Jaehyun MOON, Seongdeok AHN, Byoung Gon YU, JEONG IK LEE, Nam Sung CHO, Doo-Hee CHO
  • Patent number: 10211382
    Abstract: The present invention relates to a light emitting diode (LED) chip, in which a hybrid sensor is formed in a nitride-based LED structure. A chip structure embedded with such a hybrid sensor functions as an LED light emitting sensor which can monitor environmental pollution while functioning as a lighting element at the same time and has an effect of being used as a variety of environment pollution sensors according to the type of an electrode material.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: February 19, 2019
    Assignee: PUKYONG NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
    Inventors: Hyung Soo Ahn, Sam Nyung Yi, Min Yang, Kee Sam Shin, Young Moon Yu
  • Patent number: 9831405
    Abstract: The present invention relates to a light emitting diode (LED) chip, in which a hybrid sensor is formed in a nitride-based LED structure. A chip structure embedded with such a hybrid sensor functions as an LED light emitting sensor which can monitor environmental pollution while functioning as a lighting element at the same time and has an effect of being used as a variety of environment pollution sensors according to the type of an electrode material.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: November 28, 2017
    Assignee: PUKYONG NATIONAL UNIVERSITY INDUSTRY—UNIVERSITY COOPERATION FOUNDATION
    Inventors: Hyung Soo Ahn, Sam Nyung Yi, Min Yang, Kee Sam Shin, Young Moon Yu
  • Publication number: 20170317254
    Abstract: The present invention relates to a light emitting diode (LED) chip, in which a hybrid sensor is formed in a nitride-based LED structure. A chip structure embedded with such a hybrid sensor functions as an LED light emitting sensor which can monitor environmental pollution while functioning as a lighting element at the same time and has an effect of being used as a variety of environment pollution sensors according to the type of an electrode material.
    Type: Application
    Filed: July 13, 2017
    Publication date: November 2, 2017
    Inventors: Hyung Soo Ahn, Sam Nyung Yi, Min Yang, Kee Sam Shin, Young Moon Yu
  • Publication number: 20160284956
    Abstract: The present invention relates to a light emitting diode (LED) chip, in which a hybrid sensor is formed in a nitride-based LED structure. A chip structure embedded with such a hybrid sensor functions as an LED light emitting sensor which can monitor environmental pollution while functioning as a lighting element at the same time and has an effect of being used as a variety of environment pollution sensors according to the type of an electrode material.
    Type: Application
    Filed: March 23, 2015
    Publication date: September 29, 2016
    Inventors: Hyung Soo Ahn, Sam Nyung Yi, Min Yang, Kee Sam Shin, Young Moon Yu
  • Patent number: 8847267
    Abstract: The present invention relates to a light emitting diode with metal piles and one or more passivation layers and a method for making the diode including a first steps of performing mesa etching respectively on a first semiconductor layer and a second semiconductor layer belonging to stacked layers formed on a substrate in sequence! a second step of forming a reflector layer on the mesa-etched upper and side face! a third step of contacting one or more first electrodes with the first semiconductor layer and one or more second electrodes through the reflector layer with the second semiconductor layer; a fourth step of forming a first passivation layer on the reflector layer and the contacted electrodes; and a fifth step of connecting the first electrodes to a first bonding pad through one or more first electrode lines, bring one ends of vertical extensions having the shape of a metal pile into contact with one or more second electrodes, and connecting the other ends of the vertical extensions to a second bonding
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: September 30, 2014
    Assignee: Korea Photonics Technology Institute
    Inventors: Sang Mook Kim, Jong Hyeob Baek, Gang Ho Kim, Jung-In Kang, Hong Seo Yom, Young Moon Yu
  • Patent number: 8294167
    Abstract: The present invention relates to a light emitting diode with high electrostatic discharge and a fabrication method thereof, and more specifically to a light emitting diode comprising a first electrode layer provided over a upper surface of a first semiconductor layer and a upper surface of a second semiconductor layer; a transparent electrode layer formed on the upper surface of the second semiconductor layer, spaced from the first electrode layer; and a second electrode layer provided on a upper surface of the transparent electrode layer. With the present invention, there is provided a light emitting diode element with resistance against electrostatic discharge and with high reliability being strong against electrical impact, by selecting a structure arranging a form of an electrode differently from a conventional electrode.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: October 23, 2012
    Assignee: Korea Photonics Technology Institute
    Inventors: Jong-Hyeob Baek, Sang-Mook Kim, Sang-Hern Lee, Seung-Jae Lee, Jung-Geun Jhin, Yoon-Seok Kim, Hong-Seo Yom, Young-Moon Yu
  • Patent number: 8035122
    Abstract: The present invention relates to light diffusion type light emitting diodes, more particularly, to a light emitting device having a large divergence angle by widely spreading an emitted light from a single color to a white color and a method thereof. The light emitting diode including the encapsulating layer according to the present invention is characterized by including at least two materials with different characteristics. According to the present invention, an encapsulating material for light emitting diode is mixed with at least two materials with a different polarity or a refractive index to easily form a light emitting diode. In addition, the light emitting diode die is bonded on the bottom surface of a cup, and an encapsulating material and microspheres are dispersed in the vicinity and upper portion of the light emitting diode and the entire light emitting diode, therefore the light emitting diode has a large and uniform divergence angle due to a light uniformly scattered and refracted.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: October 11, 2011
    Assignee: Korea Photonics Technology Institute
    Inventors: Jae-Pil Kim, Seung-Hyun Park, Tae-Hun Kim, Jae-Moon Lee, Young-Moon Yu
  • Publication number: 20110198635
    Abstract: The present invention relates to a light emitting diode with metal piles and one or more passivation layers and a method for making the diode including a first steps of performing mesa etching respectively on a first semiconductor layer and a second semiconductor layer belonging to stacked layers formed on a substrate in sequence! a second step of forming a reflector layer on the mesa-etched upper and side face! a third step of contacting one or more first electrodes with the first semiconductor layer and one or more second electrodes through the reflector layer with the second semiconductor layer; a fourth step of forming a first passivation layer on the reflector layer and the contacted electrodes; and a fifth step of connecting the first electrodes to a first bonding pad through one or more first electrode lines, bring one ends of vertical extensions having the shape of a metal pile into contact with one or more second electrodes, and connecting the other ends of the vertical extensions to a second bonding
    Type: Application
    Filed: August 7, 2008
    Publication date: August 18, 2011
    Inventors: Sang Mook Kim, Jong Hyeob Baek, Gang Ho Kim, Jung-In Kang, Hong Seo Yom, Young Moon Yu
  • Publication number: 20100295087
    Abstract: The present invention relates to a light emitting diode with high electrostatic discharge and a fabrication method thereof, and more specifically to a light emitting diode comprising a first electrode layer provided over a upper surface of a first semiconductor layer and a upper surface of a second semiconductor layer; a transparent electrode layer formed on the upper surface of the second semiconductor layer, spaced from the first electrode layer; and a second electrode layer provided on a upper surface of the transparent electrode layer. With the present invention, there is provided a light emitting diode element with resistance against electrostatic discharge and with high reliability being strong against electrical impact, by selecting a structure arranging a form of an electrode differently from a conventional electrode.
    Type: Application
    Filed: January 15, 2008
    Publication date: November 25, 2010
    Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE
    Inventors: Jong-Hyeob Baek, Sang-Mook Kim, Sang-Hern Lee, Seung-Jae Lee, Jung-Geun Jhin, Yoon-Seok Kim, Hong-Seo Yom, Young-Moon Yu
  • Patent number: 7612385
    Abstract: Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: November 3, 2009
    Assignee: Korea Photonics Technology Institute
    Inventors: Young-Woo Kim, Tae-Hoon Kim, Young-Moon Yu
  • Publication number: 20090116216
    Abstract: The present invention relates to light diffusion type light emitting diodes, more particularly, to a light emitting device having a large divergence angle by widely spreading an emitted light from a single color to a white color and a method thereof. The light emitting diode including the encapsulating layer according to the present invention is characterized by including at least two materials with different characteristics. According to the present invention, an encapsulating material for light emitting diode is mixed with at least two materials with a different polarity or a refractive index to easily form a light emitting diode. In addition, the light emitting diode die is bonded on the bottom surface of a cup, and an encapsulating material and microspheres are dispersed in the vicinity and upper portion of the light emitting diode and the entire light emitting diode, therefore the light emitting diode has a large and uniform divergence angle due to a light uniformly scattered and refracted.
    Type: Application
    Filed: October 20, 2006
    Publication date: May 7, 2009
    Inventors: Jae-Pil Kim, Seung-Hyun Park, Tae-Hun Kim, Jae-Moon Lee, Young-Moon Yu
  • Publication number: 20080019133
    Abstract: Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability.
    Type: Application
    Filed: December 30, 2005
    Publication date: January 24, 2008
    Inventors: Young-Woo Kim, Tae-Hoon Kim, Young-Moon Yu