Patents by Inventor Young Seuck Yoo

Young Seuck Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11127517
    Abstract: A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Joong Won Park, Young Seuck Yoo
  • Patent number: 11107614
    Abstract: A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Jung Ho Cho, Jung Wook Seo, Young Seuck Yoo, Joong Won Park
  • Patent number: 11056275
    Abstract: A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: July 6, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Joong Won Park, Jung Wook Seo
  • Publication number: 20210193373
    Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.
    Type: Application
    Filed: June 24, 2020
    Publication date: June 24, 2021
    Inventors: Kwi Jong Lee, Jung Min Kim, Young Seuck Yoo, Sung Jin Huh, Jin Hyuck Yang, Tae Hyun Kim
  • Patent number: 10957475
    Abstract: A hybrid coil component in which a magnetic core generally included in a wire-wound type inductor and a core included in a multilayer type inductor are combined with each other. A winding coil may be wound around a magnetic core manufactured in advance and an encapsulant having a stacked structure of a plurality of magnetic sheets may encapsulate the winding coil wound around the magnetic core. In this case, a magnetic flux generated in the winding coil is arranged to be parallel to long axes of magnetic particles contained in the magnetic core and the encapsulant.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: March 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
  • Patent number: 10878988
    Abstract: A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: December 29, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Ho Kim, Yong Suk Kim, Gun Se Chang, Young Seuck Yoo
  • Patent number: 10643785
    Abstract: A thin film type coil component that includes a body having a coil embedded therein and including a composite of magnetic powder particles and a polymer, and external electrodes disposed on at least portions of external surfaces of the body. The body includes an upper body portion disposed on an upper surface of the coil, a lower body portion disposed on a lower surface of the coil, and a central body portion disposed between the upper body portion and the lower body portion and including a central portion of the coil. The upper body portion and the lower body portion include a stacked structure of a plurality of magnetic sheets, each magnetic sheet including the composite of the magnetic powder particles and the polymer.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Young Seuck Yoo, Seok Il Hong
  • Patent number: 10580566
    Abstract: A winding-type inductor includes a body including a winding-type coil and first and second external electrodes disposed on external surfaces of the body. The body includes the winding-type coil, and first and second connection reinforcing portions are additionally arranged on first and second ends of the winding-type coil and directly connected to the first and second external electrodes.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Yong Sam Lee, Young Seuck Yoo
  • Patent number: 10559414
    Abstract: A wire-wound type inductor includes a core containing magnetic powder flakes and including a central portion and an outside portion, and a winding coil disposed in the core and wound around the central portion of the core, wherein the core has a coupling structure including first and second bodies, and the first and second bodies contain magnetic powder flakes having shape magnetic anisotropy, and long axes of the magnetic powder flakes are arranged in parallel with a direction in which a magnetic field of the winding coil is formed.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
  • Publication number: 20200020475
    Abstract: A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Inventors: Hyung Ho KIM, Yong Suk KIM, Gun Se CHANG, Young Seuck YOO
  • Patent number: 10468176
    Abstract: A multilayer common mode filter includes: a body including a coil part having a plurality of spiral coils, wherein the coil part has one lead portion connected to one of external electrodes disposed on the body and one or more dummy lead portions each connected to the other external electrodes, and the lead portion is connected to dummy lead portions of other coil layers stacked in a thickness direction in series. Therefore, even though the common mode filter is miniaturized, the common mode filter may secure predetermined levels or more of performance and reliability.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Chul Sim, Young Seuck Yoo, Hye Won Bang
  • Patent number: 10417550
    Abstract: An antenna device includes: an antenna wiring including a spiral wiring having a ring shape, wherein the spiral wiring includes a linear part formed as a straight line or a curved line, and a bent part formed as a meandering line.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: September 17, 2019
    Assignee: WITS Co., Ltd.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
  • Publication number: 20190259519
    Abstract: A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.
    Type: Application
    Filed: August 30, 2018
    Publication date: August 22, 2019
    Inventors: Soon Kwang KWON, Jung Ho CHO, Jung Wook SEO, Young Seuck YOO, Joong Won PARK
  • Publication number: 20190198211
    Abstract: A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.
    Type: Application
    Filed: August 9, 2018
    Publication date: June 27, 2019
    Inventors: Soon Kwang KWON, Joong Won PARK, Young Seuck YOO
  • Publication number: 20190198235
    Abstract: There are provided a wire wound inductor and a manufacturing method thereof according to an exemplary embodiment in the present disclosure. The wire wound inductor according to an exemplary embodiment in the present disclosure includes a winding coil, a magnetic core embedding the winding coil, and an adhesive portion disposed between the magnetic core and the winding coil and enclosing the winding coil.
    Type: Application
    Filed: June 8, 2018
    Publication date: June 27, 2019
    Inventors: Ju Hwan YANG, Young Seuck YOO, Hwi Dae KIM
  • Publication number: 20190198236
    Abstract: A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.
    Type: Application
    Filed: June 11, 2018
    Publication date: June 27, 2019
    Inventors: Soon Kwang KWON, Young Seuck YOO, Joong Won PARK, Jung Wook SEO
  • Publication number: 20190180911
    Abstract: A winding-type inductor includes a body including a winding-type coil and first and second external electrodes disposed on external surfaces of the body. The body includes the winding-type coil, and first and second connection reinforcing portions are additionally arranged on first and second ends of the winding-type coil and directly connected to the first and second external electrodes.
    Type: Application
    Filed: April 24, 2018
    Publication date: June 13, 2019
    Inventors: Ju Hwan YANG, Yong Sam LEE, Young Seuck YOO
  • Publication number: 20190122810
    Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.
    Type: Application
    Filed: July 10, 2018
    Publication date: April 25, 2019
    Inventors: Seon Woo OH, Hyung Jin JEON, Jung Wook SEO, Young Seuck YOO, Byoung Hwa LEE, Kwang Sun CHOI, Kun Ho KOO
  • Patent number: 10210985
    Abstract: A coil component includes a body including coil patterns and a plurality of trenches; and external electrodes electrically connected to the coil patterns. The plurality of trenches include a magnetic material, and at least one edge of a trench disposed outside of an outermost coil pattern among the coil patterns has a same shape as an outside boundary portion of the outermost coil pattern adjacent thereto.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: February 19, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hwan Yang, Seok Il Hong, Young Seuck Yoo
  • Patent number: 10026539
    Abstract: A thin film type coil component including coil patterns in a cross section shape having an undercut in lower portions thereof is provided. The coil patterns may reduce parasitic capacitance between the coil patterns, thereby minimizing electrical loss. The volume of the coil patterns may be increased, thereby improving inductance and resistance characteristics.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: July 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Young Seuck Yoo, Jae Yeol Choi, Jong Bong Lim