Patents by Inventor Yousuke CHIBA

Yousuke CHIBA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932785
    Abstract: The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: March 19, 2024
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tasuku Yamada, Shiori Tateno, Yousuke Chiba, Takayuki Maeda, Yukio Ochitani, Hideaki Tanaka
  • Patent number: 11603456
    Abstract: The present invention provides an epoxy resin composition that is provided with flexibility to combine impact resistance and mechanical strength, while maintaining epoxy resin-specific high elastic modulus, that reduces an increase in viscosity due to mixing, and that is excellent in heat resistance, storage stability, and solvent resistance. Provided is an epoxy resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; a reactive diluent; and an epoxy resin, the epoxy resin composition having a sea-island phase separated structure after being cured.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: March 14, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Shiori Tateno, Tasuku Yamada, Yousuke Chiba
  • Publication number: 20210040304
    Abstract: The present invention provides an epoxy resin composition that is provided with flexibility to combine impact resistance and mechanical strength, while maintaining epoxy resin-specific high elastic modulus, that reduces an increase in viscosity due to mixing, and that is excellent in heat resistance, storage stability, and solvent resistance. Provided is an epoxy resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; a reactive diluent; and an epoxy resin, the epoxy resin composition having a sea-island phase separated structure after being cured.
    Type: Application
    Filed: March 26, 2019
    Publication date: February 11, 2021
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Shiori TATENO, Tasuku YAMADA, Yousuke CHIBA
  • Publication number: 20210002528
    Abstract: The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.
    Type: Application
    Filed: March 11, 2019
    Publication date: January 7, 2021
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tasuku YAMADA, Shiori TATENO, Yousuke CHIBA, Takayuki MAEDA, Yukio OCHITANI, Hideaki TANAKA