Abstract: A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, and silica. The content of the crystallized glass is 45 mass % to 85 mass %, the content of the alumina filler is 14.8 mass % to 50.1 mass % in terms of Al2O3, and the content of silica is 0.2 mass % to 4.9 mass % in terms of SiO2.

Abstract: A dust core including a metal magnetic powder and a resin, in which the metal magnetic powder shows a particle diameter of more than 0 ?m and 200 ?m or less, a number percentage of 5.0% or more of metal magnetic particles among the metal magnetic particles composing the metal magnetic powder are at least partially surface-coated with an inorganic compound including an alkaline earth metal, in a coating part coating the metal magnetic particles, an amount of the alkaline earth metal is 10.0 mass % or more, when a total amount of a metal element included in the coating part is 100 mass %, is provide. The dust core is superior in a corrosion-resistance.

Abstract: A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and stable characteristics against temperature variation and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, silica, and strontium titanate. The content of the crystallized glass is 50 mass % to 80 mass %, the content of the alumina filler is 15.6 mass % to 31.2 mass % in terms of Al2O3, the content of silica is 0.4 mass % to 4.8 mass % in terms of SiO2, and the content of the strontium titanate is 4 mass % to 14 mass % in terms of SrTiO3.

Abstract: A dust core includes a metal magnetic material, a resin, and an insulation film. The insulation film contacts with a surface of the metal magnetic material and covers the metal magnetic material. The insulation film includes a first film and a second film. The first film contacts with the surface of the metal magnetic material. The second film contacts with a surface of the first film. A density of the first film is higher than a density of the second film.

Abstract: A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, and silica. The content of the crystallized glass is 45 mass % to 85 mass %, the content of the alumina filler is 14.8 mass % to 50.1 mass % in terms of Al2O3, and the content of silica is 0.2 mass % to 4.9 mass % in terms of SiO2.

Abstract: A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and stable characteristics against temperature variation and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, silica, and strontium titanate. The content of the crystallized glass is 50 mass % to 80 mass %, the content of the alumina filler is 15.6 mass % to 31.2 mass % in terms of Al2O3, the content of silica is 0.4 mass % to 4.8 mass % in terms of SiO2, and the content of the strontium titanate is 4 mass % to 14 mass % in terms of SrTiO3.

Abstract: A dust core includes a metal magnetic material, a resin, an insulation film, and an intermediate layer. The insulation film covers the metal magnetic material. The intermediate layer exists between the insulation film and the metal magnetic material and contacts therebetween. The metal magnetic material includes 85 to 99.5 wt % of Fe, 0.5 to 10 wt % of Si, and 0 to 5 wt % of other elements, with respect to 100 wt % of the entire metal magnetic material. The intermediate layer includes a Fe—Si—O based oxide. The insulation film includes a Si—O based oxide.

Abstract: A dielectric filter includes a plurality of dielectric resonators. The dielectric filter also includes: a plurality of resonator body portions each formed of a first dielectric and respectively corresponding to the plurality of dielectric resonators, the first dielectric having a first relative permittivity; a peripheral dielectric portion formed of a second dielectric and lying around the plurality of resonator body portions, the second dielectric having a second relative permittivity lower than the first relative permittivity; and a shield portion formed of a conductor. Either one of a temperature coefficient of resonant frequency of the first dielectric at 25° C. to 85° C. and a temperature coefficient of resonant frequency of the second dielectric at 25° C. to 85° C. has a positive value and the other has a negative value.

Abstract: A dielectric filter includes a plurality of dielectric resonators. The dielectric filter also includes: a plurality of resonator body portions each formed of a first dielectric and respectively corresponding to the plurality of dielectric resonators, the first dielectric having a first relative permittivity; a peripheral dielectric portion formed of a second dielectric and lying around the plurality of resonator body portions, the second dielectric having a second relative permittivity lower than the first relative permittivity; and a shield portion formed of a conductor. Either one of a temperature coefficient of resonant frequency of the first dielectric at 25° C. to 85° C. and a temperature coefficient of resonant frequency of the second dielectric at 25° C. to 85° C. has a positive value and the other has a negative value.

Abstract: [Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate.

Abstract: A dust core includes a metal magnetic material, a resin, and an insulation film. The insulation film contacts with a surface of the metal magnetic material and covers the metal magnetic material. The insulation film includes a first film and a second film. The first film contacts with the surface of the metal magnetic material. The second film contacts with a surface of the first film. A density of the first film is higher than a density of the second film.

Abstract: A dust core includes a metal magnetic material, a resin, an insulation film, and an intermediate layer. The insulation film covers the metal magnetic material. The intermediate layer exists between the insulation film and the metal magnetic material and contacts therebetween. The metal magnetic material includes 85 to 99.5 wt % of Fe, 0.5 to 10 wt % of Si, and 0 to 5 wt % of other elements, with respect to 100 wt % of the entire metal magnetic material. The intermediate layer includes a Fe—Si—O based oxide. The insulation film includes a Si—O based oxide.

Abstract: [Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.

Abstract: [Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.

Abstract: A dust core including a metal magnetic powder and a resin, in which the metal magnetic powder shows a particle diameter of more than 0 ?m and 200 ?m or less, a number percentage of 5.0% or more of metal magnetic particles among the metal magnetic particles composing the metal magnetic powder are at least partially surface-coated with an inorganic compound including an alkaline earth metal, in a coating part coating the metal magnetic particles, an amount of the alkaline earth metal is 10.0 mass % or more, when a total amount of a metal element included in the coating part is 100 mass %, is provide. The dust core is superior in a corrosion-resistance.

Abstract: A multilayer glass ceramic substrate includes a number of insulating layers composed of glass ceramics. An embedded resistor is formed between the insulating layers. The resistor includes scattered microvoids and includes materials containing conductive powders and glass powders. First and second internal conductors are provided where a first end of the embedded resistor is connected to the first internal conductor and a second end of the embedded resistor is connected to the second internal conductor.

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract: A multilayer glass ceramic substrate includes a number of insulating layers composed of glass ceramics. An embedded resistor is formed between the insulating layers. The resistor includes scattered microvoids and includes materials containing conductive powders and glass powders. First and second internal conductors are provided where a first end of the embedded resistor is connected to the first internal conductor and a second end of the embedded resistor is connected to the second internal conductor.