Patents by Inventor Yousuke Kondo

Yousuke Kondo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200257193
    Abstract: An imprint apparatus that forms a pattern made of an imprint material on each of a plurality of shot regions of a substrate, includes a user interface configured to allow a user to perform editing for assigning each of the plurality of shot regions to any one of a plurality of groups such that each of the plurality of groups is formed by at least one shot region onto which the imprint material is continuously supplied from a dispenser.
    Type: Application
    Filed: January 29, 2020
    Publication date: August 13, 2020
    Inventor: Yousuke Kondo
  • Patent number: 10739674
    Abstract: An imprint apparatus, to perform an imprinting process for bringing a mold and an imprint material on a substrate into contact with each other and curing the imprint material, includes a substrate deforming mechanism and a controller. The substrate deforming mechanism deforms the substrate in such a manner that a surface geometry of at least part of the substrate protrudes toward the mold. The controller determines a condition for the imprinting process on a shot area of the substrate based on the surface geometry of the shot area when the mold is brought into contact with the imprint material on the shot area.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: August 11, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yousuke Kondo
  • Patent number: 10729006
    Abstract: [Objective] To provide a wiring substrate for electronic component inspection apparatus which includes a first laminate of resin layers with a plurality of pads for probe provided on its front surface and a second laminate of ceramic layers disposed on the back side of the first laminate and which, despite joining by brazing of a plurality of studs to the back surface of the second laminate, is free from deformation of resin of the first laminate caused by softening or the like and from accidental formation of a short circuit between brazing material layers used for the brazing and external connection terminals formed on the back surface of the second laminate.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: July 28, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takakuni Nasu, Yousuke Kondo, Kouta Kimata, Guangzhu Jin
  • Publication number: 20200146146
    Abstract: A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.
    Type: Application
    Filed: September 27, 2019
    Publication date: May 7, 2020
    Inventors: Takakuni NASU, Kengo TANIMORI, Yousuke KONDO, Masahiro KAMEGAI, Kouta KIMATA, Junya MATSURA, Fumio SHIRAKI, Guangzhu JIN
  • Publication number: 20190291309
    Abstract: An imprinting apparatus 100 includes a control unit 126 that controls movement of a stage 104. During a period after a pattern is formed in a first region of regions until a pattern is formed in a second region that differs from the first region of the regions, the control unit 126 does not allow the first region to pass through a facing portion that faces a discharge ports 122b. After a predetermined time has elapsed since the discharging unit 106 finally discharges a imprint material 127 to the substrate with an airstream generated along a substrate from the facing portion at the facing portion that faces the discharge ports 122b, the control unit 126 controls movement of the stage such that the regions in which the pattern is formed are allowed to pass through the facing portion.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 26, 2019
    Inventor: Yousuke Kondo
  • Publication number: 20190082531
    Abstract: [Objective] To provide a wiring substrate for electronic component inspection apparatus which includes a first laminate of resin layers with a plurality of pads for probe provided on its front surface and a second laminate of ceramic layers disposed on the back side of the first laminate and which, despite joining by brazing of a plurality of studs to the back surface of the second laminate, is free from deformation of resin of the first laminate caused by softening or the like and from accidental formation of a short circuit between brazing material layers used for the brazing and external connection terminals formed on the back surface of the second laminate.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 14, 2019
    Inventors: Takakuni NASU, Yousuke KONDO, Kouta KIMATA, Guangzhu JIN
  • Publication number: 20170157810
    Abstract: An imprint apparatus, to perform an imprinting process for bringing a mold and an imprint material on a substrate into contact with each other and curing the imprint material, includes a substrate deforming mechanism and a controller. The substrate deforming mechanism deforms the substrate in such a manner that a surface geometry of at least part of the substrate protrudes toward the mold. The controller determines a condition for the imprinting process on a shot area of the substrate based on the surface geometry of the shot area when the mold is brought into contact with the imprint material on the shot area.
    Type: Application
    Filed: November 28, 2016
    Publication date: June 8, 2017
    Inventor: Yousuke Kondo
  • Patent number: 9405193
    Abstract: An imprint apparatus include: a substrate stage; a dispense unit; an irradiation unit; a receiving unit configured to receive an imprint material that is dummy dispensed from the dispense unit; and a controller configured to cause the dummy dispensed imprint material to be irradiated by an energy beam from the irradiation unit without bringing the dummy dispensed imprint material into contact with the mold.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: August 2, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yousuke Kondo, Toshinori Kobashi
  • Publication number: 20160097975
    Abstract: An imprint apparatus include: a substrate stage; a dispense unit; an irradiation unit; a receiving unit configured to receive an imprint material that is dummy dispensed from the dispense unit; and a controller configured to cause the dummy dispensed imprint material to be irradiated by an energy beam from the irradiation unit without bringing the dummy dispensed imprint material into contact with the mold.
    Type: Application
    Filed: September 25, 2015
    Publication date: April 7, 2016
    Inventors: Yousuke Kondo, Toshinori Kobashi
  • Publication number: 20160023380
    Abstract: Provided is an imprint method comprising a step for determining whether or not a process for reducing adhesive strength between the imprint material and the pattern of the mold is required, wherein, if the determination step determines that the process for reducing adhesive strength is required, the process for reducing adhesive strength is performed by bringing the material for reducing adhesive strength on the substrate for reducing adhesive strength, which is different from a substrate to be patterned, into contact with the pattern of the mold, and then an imprint process is performed, whereas if the determination step determines that the process for reducing adhesive strength is not required, the process for reducing adhesive strength is not performed, and the imprint process is performed.
    Type: Application
    Filed: July 20, 2015
    Publication date: January 28, 2016
    Inventor: Yousuke Kondo