Patents by Inventor Youzo Itagaki

Youzo Itagaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040188263
    Abstract: The object is to provide carrier foil-incorporated copper foil which permits drilling by a carbon dioxide laser when on the surface of outer-layer copper foil of a copper-clad laminate there is no nickel assist metal layer or an organic material film to increase the absorption of laser light. For this purpose, there is used, for example, carrier foil-incorporated copper foil in which copper foil for printed wiring board manufacturing having a nodular-treated surface on the side of one surface of a bulk copper layer and carrier foil are laminated via an adhesive interface layer on a side opposite to the nodular-treated surface of the bulk copper layer, the bulk copper layer being formed from a high-carbon copper with a carbon content of 0.03 wt % to 0.40 wt %.
    Type: Application
    Filed: December 11, 2003
    Publication date: September 30, 2004
    Inventors: Akiko Sugimoto, Junshi Yoshioka, Makoto Dobashi, Kenjirou Izutani, Youzo Itagaki, Osamu Nakano