Abstract: This organic EL device (100) has a substrate (1), a drive circuit layer (2), a first inorganic protective layer (2Pa), an organic planarizing layer (2Pb), an organic EL element layer (3), and a TFE structure (10). The TFE structure has a first inorganic barrier layer (12), an organic barrier layer (14), and a second inorganic barrier layer (16). When viewed from a normal line of the substrate, the organic planarizing layer is formed within a region where the first inorganic protective layer is formed, while an organic EL element is disposed within a region where the organic planarizing layer is formed. The TFE structure has an exterior edge which intersects with a lead-out line (32) and which is situated between an exterior edge of the organic planarizing layer and an exterior edge of the first inorganic protective layer.

Abstract: An organic EL device has a substrate, a drive circuit layer, a first inorganic protective layer, an organic planarizing layer, an organic EL element layer, and a TFE structure including a first inorganic barrier layer. When viewed from a normal line of the substrate, the organic planarizing layer is formed within a region where the first inorganic protective layer is formed, while an organic EL element is disposed within a region where the organic planarizing layer is formed. In a portion where the first inorganic protective layer and the first inorganic barrier layer are in direct contact with each other on a lead-out line of the drive circuit layer, the first inorganic barrier layer includes, in a cross-section parallel to a line width direction of the lead-out line, a lateral face having a taper angle of less than 90°.

Abstract: This organic EL device (100) has a substrate (1), a drive circuit layer (2), a first inorganic protective layer (2Pa), an organic planarizing layer (2Pb), an organic EL element layer (3), a second inorganic protective layer (2Pa2), and a TFE structure (10). The TFE structure has a first inorganic barrier layer (12), an organic barrier layer (14), and a second inorganic barrier layer (16). When viewed from a normal line of the substrate, the organic planarizing layer is formed within a region where the first inorganic protective layer is formed, while an organic EL element is disposed within a region where the organic planarizing layer is formed. The TFE structure has an exterior edge which intersects with a lead-out line (32) and which is situated between an exterior edge of the organic planarizing layer and an exterior edge of the first inorganic protective layer.

Abstract: An organic EL device (100D) according to an embodiment of the present invention has: a substrate (1); a drive circuit layer (2) having a plurality of TFTs formed on the substrate; interlayer insulation layers (2Pa, 2Pb) formed on the drive circuit layer; an organic EL element layer (3) formed on the interlayer insulation layers; and a thin-film sealing structure (10DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH1, CH2). Contact parts (C1, C2) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (2Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

Abstract: According to an embodiment of the invention, the organic EL device (100) comprises: an element substrate (20) having a substrate (1) and a plurality of organic EL elements (3) supported by the substrate; a thin film encapsulation structure (10) formed above the plurality of organic EL elements and having at least one compound layered body (10S) constituted by a first inorganic barrier layer (12), an organic barrier layer (14) in contact with the upper surface of the first inorganic barrier layer and having a plurality of solid sections spread out discretely, and a second inorganic barrier layer (16) in contact with the upper surface of the first inorganic barrier layer and the upper surfaces of the plurality of solid sections of the organic barrier layer; an organic planarization layer (42) provided above the thin film encapsulation structure and formed from a photosensitive resin; and a touch sensor layer (50) disposed above the organic planarization layer.

Abstract: In the present embodiment, a sealing agent (50) sealing two substates contains a low melting-point glass material and is adhered to each of a first substrate (10) and a second substrate (20), a barrier rib (60), which is formed in such a manner as to surround the outer periphery of an electronic element (30), is disposed between the sealing agent (50) and the electronic element (30), and between the first substrate (10) and the second substrate (20), and the sealing agent (50) is spaced apart from the barrier rib (60). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two substrates is protected from moisture and oxygen.

Abstract: In the present embodiment, a sealing agent (50) sealing two substates contains a low melting-point glass material and is adhered to each of a first substrate (10) and a second substrate (20), a barrier rib (60), which is formed in such a manner as to surround the outer periphery of an electronic element (30), is disposed between the sealing agent (50) and the electronic element (30), and between the first substrate (10) and the second substrate (20), and the sealing agent (50) is spaced apart from the barrier rib (60). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two substrates is protected from moisture and oxygen.

Abstract: In the present embodiment, a sealing agent (50) sealing two substates contains a low melting-point glass material and is adhered to each of a first substrate (10) and a second substrate (20), a barrier rib (60), which is formed in such a manner as to surround the outer periphery of an electronic element (30), is disposed between the sealing agent (50) and the electronic element (30), and between the first substrate (10) and the second substrate (20), and the sealing agent (50) is spaced apart from the barrier rib (60). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two substrates is protected from moisture and oxygen.

Abstract: An organic EL device (100D) according to an embodiment of the present invention has: a substrate (1); a drive circuit layer (2) having a plurality of TFTs formed on the substrate; interlayer insulation layers (2Pa, 2Pb) formed on the drive circuit layer; an organic EL element layer (3) formed on the interlayer insulation layers; and a thin-film sealing structure (10DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH1, CH2). Contact parts (C1, C2) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (2Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

Abstract: The present invention has: a reflective liquid crystal display element (30) that is formed in a first region (R) on a TFT substrate (20) and having at least the upper surface thereof comprising an inorganic insulating film (25b), and that has a reflective electrode (31), a liquid crystal layer (32), and a counter electrode (33); and a light-emitting element (40) that is formed in a second region (T) above the insulating layer of the TFT substrate, and that has a first electrode (41), a light-emitting layer (43), and a second electrode (44). In addition, the light-emitting element has an encapsulating layer (45) formed of an inorganic insulating layer that covers the entirety of each light-emitting region, and an end portion of the encapsulating layer is bonded to the inorganic insulating film of the insulating layer.

Abstract: An organic EL device (100D) according to an embodiment of the present invention has: a substrate (1); a drive circuit layer (2) having a plurality or TFTs formed on the substrate; interlayer insulation layers (2Pa, 2Pb) formed on the drive circuit layer; an organic EL element layer (3) formed on the interlayer insulation layers; and a thin-film sealing structure (10DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH1, CH2). Contact parts (C1, C2) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (2Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

Abstract: The present invention has: a reflective liquid crystal display element (30) that is formed in a first region (R) on a TFT substrate (20) and having at least the upper surface thereof comprising an inorganic insulating film (25b), and that has a reflective electrode (31), a liquid crystal layer (32), and a counter electrode (33); and a light-emitting element (40) that is formed in a second region (T) above the insulating layer of the TFT substrate, and that has a first electrode (41), a light-emitting layer (43), and a second electrode (44). In addition, the light-emitting element has an encapsulating layer (45) formed of an inorganic insulating layer that covers the entirety of each light-emitting region, and an end portion of the encapsulating layer is bonded to the inorganic insulating film of the insulating layer.

Abstract: A display device according to one embodiment of the present invention is provided with a plurality of pixels which are arranged as a matrix on a substrate, and each of which is provided with a liquid crystal display element and an organic EL display element. The organic EL display element is provided with a positive electrode and a negative electrode, which are formed so as to be electrically separated from a pixel electrode and a counter electrode of the liquid crystal display element.

Abstract: According to an embodiment of the invention, the organic EL device (100) comprises: an element substrate (20) having a substrate (1) and a plurality of organic EL elements (3) supported by the substrate; a thin film encapsulation structure (10) formed above the plurality of organic EL elements and having at least one compound layered body (10S) constituted by a first inorganic barrier layer (12), an organic barrier layer (14) in contact with the upper surface of the first inorganic barrier layer and having a plurality of solid sections spread out discretely, and a second inorganic barrier layer (16) in contact with the upper surface of the first inorganic barrier layer and the upper surfaces of the plurality of solid sections of the organic barrier layer; an organic planarization layer (42) provided above the thin film encapsulation structure and formed from a photosensitive resin; and a touch sensor layer (50) disposed above the organic planarization layer.

Abstract: This organic EL device (100) has a substrate (1), a drive circuit layer (2), a first inorganic protective layer (2Pa), an organic planarizing layer (2Pb), an organic EL element layer (3), a second inorganic protective layer (2Pa2), and a TFE structure (10). The TFE structure has a first inorganic barrier layer (12), an organic barrier layer (14), and a second inorganic barrier layer (16). When viewed from a normal line of the substrate, the organic planarizing layer is formed within a region where the first inorganic protective layer is formed, while an organic EL element is disposed within a region where the organic planarizing layer is formed. The TFE structure has an exterior edge which intersects with a lead-out line (32) and which is situated between an exterior edge of the organic planarizing layer and an exterior edge of the first inorganic protective layer.

Abstract: This organic EL device (100) has a substrate (1), a drive circuit layer (2), a first inorganic protective layer (2Pa), an organic planarizing layer (2Pb), an organic EL element layer (3), and a TFE structure (10). The TFE structure has a first inorganic barrier layer (12), an organic barrier layer (14), and a second inorganic barrier layer (16). When viewed from a normal line of the substrate, the organic planarizing layer is formed within a region where the first inorganic protective layer is formed, while an organic EL element is disposed within a region where the organic planarizing layer is formed. The TFE structure has an exterior edge which intersects with a lead-out line (32) and which is situated between an exterior edge of the organic planarizing layer and an exterior edge of the first inorganic protective layer.

Abstract: A display device includes a first substrate including a light-emitting element that is an upward light emission type and a transistor in a lower layer than the light-emitting element, a second substrate facing the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a sealing film formed in an island shape and covering the light-emitting element and a pixel electrode that is transparent. The pixel electrode includes a first portion not overlapping the sealing film and a second portion overlapping the sealing film.

Abstract: An organic EL device (100D) according to an embodiment of the present invention has: a substrate (1); a drive circuit layer (2) having a plurality or TFTs formed on the substrate; interlayer insulation layers (2Pa, 2Pb) formed on the drive circuit layer; an organic EL element layer (3) formed on the interlayer insulation layers; and a thin-film sealing structure (10DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH1, CH2). Contact parts (C1, C2) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (2Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

Abstract: A reflective liquid crystal display device (30) including a reflection electrode (31), a liquid crystal layer (32), and a counter electrode (33) is formed above an insulating layer (25) in a first region (R) of a TFT substrate (20). An organic EL display device (40) including a first electrode (41), an organic layer (43), and a second electrode (44) is formed on the insulating layer (25) of the TFT substrate (20) in a second region (T). A coating layer (45) is formed at least on a surface of the organic EL display device (40) so as to wrap the second electrode (44) and the organic layer (43) of the organic EL display device (40). A part of the coating layer (45) is in contact with the insulating layer (25). As a result, a complex display apparatus capable of preventing the organic layer from deteriorating and excellent in reliability can be obtained.

Abstract: A display device includes a first substrate including a light-emitting element that is an upward light emission type and a transistor in a lower layer than the light-emitting element, a second substrate facing the first substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a sealing film formed in an island shape and covering the light-emitting element, a pixel electrode including a first portion not overlapping the sealing film, and a light reflective film overlapping the first portion and including a recessed and protruded surface.