Abstract: A display may have an array of pixels. Display driver circuitry may supply data and control signals to the pixels. Each pixel may have seven transistors, a capacitor, and a light-emitting diode such as an organic light-emitting diode. The seven transistors may receive control signals using horizontal control lines. Each pixel may have first and second emission enable transistors that are coupled in series with a drive transistor and the light-emitting diode of that pixel. The first and second emission enable transistors may be coupled to a common control line or may be separately controlled so that on-bias stress can be effectively applied to the drive transistor. The display driver circuitry may have gate driver circuits that provide different gate line signals to different rows of pixels within the display. Different rows may also have different gate driver strengths and different supplemental gate line loading structures.

Abstract: The present invention provides a palladium precatalyst for cross-coupling reaction, the palladium precatalyst comprising a structure represented by following formula 1: wherein, R1 and R2 are the same, and R1 and R2 are substituted or unsubstituted phenyl; R3 and R4 are the same, and R3 and R4 are substituted or unsubstituted phenyl or cyclohexyl.

Abstract: The present application discloses a method for fabricating a semiconductor device. The method includes forming a first dielectric layer on a substrate; forming an expanded hole in the first dielectric layer; conformally forming an adhesive layer in the expanded hole by a first chemical vapor deposition process; conformally forming a first conductive layer on the adhesive layer by a second chemical vapor deposition process; and forming a first conductive structure on the first conductive layer by a third chemical vapor deposition process. The adhesive layer, the first conductive layer, and the first conductive structure together configure a composite contact structure.

Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a first dielectric layer positioned on the substrate; a first conductive structure positioned in the first dielectric layer and including a bottle-shaped cross-sectional profile; a first conductive layer positioned between the first conductive structure and the first dielectric layer and between the first conductive structure and the substrate; an adhesive layer positioned between the first conductive layer and the first dielectric layer and between the first conductive layer and the substrate. The adhesive layer, the first conductive layer, and the first conductive structure together configure a composite contact structure. An aspect ratio of the composite contact structure is greater than 7.

Abstract: The present application discloses method for fabricating a conductive feature and a method for fabricating a semiconductor device. The method includes providing a substrate; forming a recess in the substrate; conformally forming a first nucleation layer in the recess; performing a post-treatment to the first nucleation layer; and forming a first bulk layer on the first nucleation layer to fill the recess. The first nucleation layer and the first bulk layer configure the conductive feature. The first nucleation layer and the first bulk layer include tungsten. The post-treatment includes a borane-containing reducing agent.

Abstract: The present application discloses method for fabricating a conductive feature and a method for fabricating a semiconductor device. The method includes providing a substrate; forming a recess in the substrate; conformally forming a first nucleation layer in the recess; performing a post-treatment to the first nucleation layer; and forming a first bulk layer on the first nucleation layer to fill the recess. The first nucleation layer and the first bulk layer configure the conductive feature. The first nucleation layer and the first bulk layer include tungsten. The post-treatment includes a borane-containing reducing agent.

Abstract: The present application discloses method for fabricating a semiconductor device. The method includes providing a substrate; forming a word line trench in the substrate; conformally forming a first insulating layer in the word line trench and conformity forming a first barrier layer on the first insulating layer; conformally forming a first nucleation layer on the first barrier layer; performing a post-treatment to the first nucleation layer, wherein the post-treatment comprises a reducing agent comprising diborane and a tungsten-containing precursor; forming a first bulk layer on the first nucleation layer, wherein the first nucleation layer and the first bulk layer configure a first conductive layer; and performing a planarization process to turn the first insulating layer, the first barrier layer, and the first conductive layer into a word line insulating layer, a word line barrier layer, and a word line conductive layer, respectively and correspondingly.

Abstract: A method of forming semiconductor structure includes forming a bit line structure on a substrate, forming a first landing pad material lower than the bit line structure between two adjacent bit line structures, shaping a top surface of the bit line structure to form an edge area of the top surface lower than a center area of the top surface, forming a second landing pad material on the bit line structure and the first landing pad material, and removing at least a portion of the second landing pad material to form a landing pad.

Abstract: A projector includes an optical engine module, a projection lens module, a heat dissipation module, and a laser module. The laser module includes a positioning member and a laser unit fixed to the positioning member, wherein a positioning member includes a main plate portion and two shoulder portions, the main plate portion includes a first upper surface and a first lower surface opposite to each other, a first front surface and a first rear surface opposite to each other, and a first left side surface and a first right side surface opposite to each other, and the two shoulder portions extend on a plane of the first upper surface from the first left side surface and the first right side surface of the main plate portion, respectively. A laser module is also provided.

Abstract: A projector includes an optical engine module, a projection lens module, a heat dissipation module, and a laser module. The laser module includes a positioning member and a laser unit fixed to the positioning member, wherein a positioning member includes a main plate portion and two shoulder portions, the main plate portion includes a first upper surface and a first lower surface opposite to each other, a first front surface and a first rear surface opposite to each other, and a first left side surface and a first right side surface opposite to each other, and the two shoulder portions extend on a plane of the first upper surface from the first left side surface and the first right side surface of the main board portion, respectively. A laser module is also provided.

Abstract: A method for providing identification information of an electronic device having a screen comprises demonstrating a plurality of selecting objects via the screen when a first button of the electronic device is detected to be activated for a predefined period, and displaying the identification information of the electronic device via the screen when a first selecting object of the plurality of selecting objects is triggered.

Abstract: A method for installation capacities of a hybrid energy generation system is disclosed. The hybrid energy generation system may include a plurality of power systems. According to the environment factors and practical requirements of the installation site, the mechanism of the present invention may find the golden ratio of the installation capacities among the different power systems. Furthermore, the present invention may obtain the combination of installation capacities associated with the minimum recovery period, thereby further decreasing the installation cost and the efficiency of the hybrid energy generation system.

Abstract: A method for installation capacities of a hybrid energy generation system is disclosed. The hybrid energy generation system may include a plurality of power systems. According to the environment factors and practical requirements of the installation site, the mechanism of the present invention may find the golden ratio of the installation capacities among the different power systems. Furthermore, the present invention may obtain the combination of installation capacities associated with the minimum recovery period, thereby further decreasing the installation cost and the efficiency of the hybrid energy generation system.

Abstract: An address-simulation device is disclosed. The address-simulation device includes an address-generating element, a header-filling element, a packet-generating element and a packet-transmitting element. The address-generating element generates a plurality of addresses, wherein each of the addresses is different from the others. The header-filling element fills the addresses respectively in a plurality of headers. The packet-generating element combines the headers with data respectively to form a plurality of packets. The packet-transmitting element transmits the packets to a server. An address-simulation method is also disclosed.

Abstract: A method, testing the network transmission, includes the step of providing a buffer of a scheduled size in a first storage unit, moving at least one transmission data from a second storage unit to the buffer in the first storage unit, and uploading the transmission data from the buffer in the first storage unit to an Internet.

Abstract: An automatic dialing method through a wireless headset is provided, which contains two modules: a headset module implemented in the wireless headset; and a master module implemented in a communication device. When the wireless headset and the communication device are idle, a user triggers the headset module by activating a combination of buttons on the wireless headset. The headset module in turn triggers the master module via a wireless connection between the wireless headset and the communication device. The master module then immediately retrieves records from a phone book pre-installed in the communication device, and then speaks out the “name” of each record to the user. When hearing the name of the desired call parted from the wireless headset, the user again triggers the headset module to instruct the master module to dial the number stored in the same phone record.

Abstract: A method and apparatus to obtain a substantially accurate digital color image of a subject at relatively low cost. A moveable enclosure containing a controlled lighting source provides a controlled lighting environment that costs considerably less than a traditional photo studio and is more convenient to use for many applications. A digital color image capture device captures an image of a subject in the enclosure. The captured image is sent to a computer where a stored color profile previously obtained from a calibration of the digital image capture device is used by a software program to automatically correct the color of the captured image. The color-corrected image can then be distributed to other computers for display.

Abstract: A method and apparatus to obtain a substantially accurate digital color image of a subject at relatively low cost. A moveable enclosure containing a controlled lighting source provides a controlled lighting environment that costs considerably less than a traditional photo studio and is more convenient to use for many applications. A digital color image capture device captures an image of a subject in the enclosure. The captured image is sent to a computer where a stored color profile previously obtained from a calibration of the digital image capture device is used by a software program to automatically correct the color of the captured image. The color-corrected image can then be distributed to other computers for display.

Abstract: A structure of light box assembly is disclosed in the invention, which includes an upper plastic frame and a lower plastic frame, and each of them can be formed by a plastic sheet or two same plastic sheets. Besides, at least four supporting columns are used to connect and support the two plastic frames. In addition, a plurality of side plate, an upper cover plate, and a lower cover plates are separately installed according to different planes formed by each of the plastic frames and each of the supporting columns so as to construct a box body. Also, an erect diffusion plate is provided at each corner of the box body corresponding to the position of its relative supporting column so that each of the four diffusion plates is to cover the outer field of each of the vertical light tubes. Thus, uniformly distributed light can be provided, and a solid and uniform light source can be provided as well.

Abstract: A method for uniformizing the output image colors of a printing device and the original colors is proposed. A computer system outputs a set of color patch print signals to a printing device for printing out a color patch diagram. Next, a digital still camera is used to photograph the color patch diagram and then output a color image signal. The computer system converts the color image signal into a CIE XYZ chrominance signal according to an ICC profile of the digital still camera and then processes the CIE XYZ chrominance signal with the set of color patch print signals to obtain an ICC profile of the printing device, or the color image signal and the set of color patch print signals are processed to obtain a relative ICC profile of the digital still camera and the printing device, thereby facilitating color management and calibration and accomplish the advantages of low cost, simple operation and high practicability.