Patents by Inventor Yu-Chun Chen

Yu-Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12107482
    Abstract: A voice coil motor assembly including a base, a frame, an elastic sheet, a housing, and a plurality of shock-absorbing components is provided. The frame is disposed on the base. The frame includes a bottom surface, a top surface, a plurality of side walls and a support frame. One side of the elastic sheet is disposed on the top surface of the frame and the other is disposed on the support frame. The housing is disposed above the base to receive the frame and the elastic sheet. The housing includes a housing top wall and a plurality of housing side walls surrounding the housing top wall. The shock-absorbing components are disposed on the frame and are sandwiched between the frame and the housing side walls of the housing, and/or between the support frame and the housing top wall of the housing.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: October 1, 2024
    Assignee: LANTO ELECTRONIC LIMITED
    Inventors: Fu-Yuan Wu, Yu-Cheng Lin, Shang-Yu Hsu, Tao-Chun Chen
  • Publication number: 20240321780
    Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.
    Type: Application
    Filed: June 4, 2024
    Publication date: September 26, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen, Chia-Hung Liu, Hao-Yi Tsai, Chung-Shi Liu
  • Publication number: 20240322827
    Abstract: A main board, a hot plug control signal generator, and a control signal generating method thereof are provided. The hot plug control signal generator includes a controller and a latch. The controller provides a control signal. The latch is operated based on an operation power to generate a hot plug control signal. The latch sets the hot plug control signal to a disabled first logic value, and latches the hot plug control signal at the first logic value.
    Type: Application
    Filed: May 29, 2024
    Publication date: September 26, 2024
    Applicant: Wiwynn Corporation
    Inventors: Wei-Fang Chang, Yu-Chun Chen, Nan-Huan Lin, Chung-Hui Yen, Shi-Rui Chen
  • Publication number: 20240321626
    Abstract: A semiconductor structure includes a ceramic substrate, a first bonding layer, a second bonding layer, a cavity, and a semiconductor layer. The ceramic substrate includes holes on its surface. The first bonding layer is disposed on the surface of the ceramic substrate, and the second bonding layer is bonded to the first bonding layer. The cavity is disposed above the hole and enclosed by the first bonding layer and the second bonding layer. The semiconductor layer extends over the cavity and is disposed along the surface of the second bonding layer.
    Type: Application
    Filed: May 29, 2024
    Publication date: September 26, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Yang Du, Yung-Fong Lin, Tsung-Hsiang Lin, Yu-Chieh Chou, Cheng-Tao Chou, Yi-Chun Lu, Chun-Hsu Chen
  • Publication number: 20240321572
    Abstract: Provided are semiconductor devices and methods for manufacturing semiconductor devices. A method deposits conformal material to form a conformal liner in the trench and modifies the conformal liner such an upper liner portion is modified more than a lower liner portion. The deposition and modifying steps are repeated while a rate of deposition of the conformal material over a non-modified surface of the conformal liner is faster than a rate of deposition of the conformal material over a modified surface of the conformal liner to form a remaining unfilled gap with a V-shape. The method further includes depositing a conformal material in the remaining unfilled gap.
    Type: Application
    Filed: March 20, 2023
    Publication date: September 26, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Fong Lin, Yen-Chun Huang, Zhen-Cheng Wu, Chi On Chui, Chih-Tang Peng, Yu Ying Chen
  • Patent number: 12100789
    Abstract: A display device, including a circuit substrate, a light-emitting layer, a quarter-wave plate, and a band-pass polarizing layer, is provided. The light-emitting layer is disposed on the circuit substrate and has light-emitting structures, which are electrically connected to the circuit substrate and include first light-emitting structures, which have a first main light-emitting wavelength. The quarter-wave plate is disposed in overlap with the light-emitting structures and is located between the band-pass polarizing layer and the light-emitting layer. The band-pass polarizing layer includes at least one first band-pass polarizing pattern, which have a first absorption axis. The first wavelength range is the first main light-emitting wavelength±10 nm. An average transmittance of the first band-pass polarizing patterns to light with a wavelength outside the first wavelength range and a polarization direction parallel to the first absorption axis is less than 20%.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: September 24, 2024
    Assignee: Coretronic Corporation
    Inventors: Ping-Yen Chen, Wen-Chun Wang, Chung-Yang Fang, Yu-Fan Chen
  • Publication number: 20240312014
    Abstract: In an automated detection system for acute ischemic stroke, a preprocessor performs registration on a whole-brain image and a standard-brain spatial template to extract individual brain region masks from the whole-brain image. A deep learning encoder performs feature extraction on the whole-brain image and the individual brain region masks, thereby converting the whole-brain image into 2D whole-brain slice images. A first processor maps the individual brain masks onto the whole-brain slice images for registration, thereby generating sets of brain region slice images. A second processor computes the stroke-related weight values of the slice images of each of the sets of brain region slice images and sums the weight values to obtain the characteristic value of each brain region. A disparity-aware classifier determines whether any brain region has acute ischemic stroke according to the characteristic value of each brain region.
    Type: Application
    Filed: June 14, 2023
    Publication date: September 19, 2024
    Applicants: National Yang Ming Chiao Tung University, Kaohsiung Chang Gung Memorial Hospital
    Inventors: Yong-Sheng CHEN, Wei-Che Lin, Shih-Yen Lin, Hsiang-Chun Yang, YU-LIN YEH, Evelyne Calista, Pi-Ling Chiang
  • Patent number: 12094938
    Abstract: In an exemplary aspect, the present disclosure is directed to a device. The device includes a semiconductor substrate, a stack of semiconductor layers over the semiconductor substrate, a gate structure over and between the stack of semiconductor layers, where the gate structure engages with the stack of semiconductor layers. Moreover, the device also includes a silicide layer extending along sidewall surfaces of the stack of semiconductor layers, and a source/drain feature on a sidewall surface of the silicide layer.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: September 17, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Xuan Huang, Wang-Chun Huang, Yi-Bo Liao, Cheng-Ting Chung, Hou-Yu Chen, Kuan-Lun Cheng, Wei Ju Lee
  • Publication number: 20240306078
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; and a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data. When the audio broadcasting device receives an alert signal, or when a specific ambient sound occurs in the surrounding environment of the audio broadcasting device, the audio broadcasting device utilizes a target control command to instruct the first and second Bluetooth member devices to synchronously reduce their volume to be lower than a predetermined threshold.
    Type: Application
    Filed: May 3, 2024
    Publication date: September 12, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Bi WEI, Yu Hsuan LIU, Chia Chun HUNG
  • Publication number: 20240304511
    Abstract: A semiconductor package and a method of forming the same are provided. The semiconductor package includes a semiconductor die and a redistribution structure disposed on the semiconductor die. The redistribution structure includes an alignment auxiliary layer, a plurality of dielectric layers and a plurality of conductive patterns. The alignment auxiliary layer has a light transmittance for a light with a wavelength range of about 350-550 nm lower than that of one of the plurality of dielectric layers.
    Type: Application
    Filed: March 10, 2023
    Publication date: September 12, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo, Po-Han Wang, Hung-Chun Cho
  • Publication number: 20240304535
    Abstract: A device includes: a first integrated circuit (IC) die; a first dielectric material around first sidewalls of the first IC die; a second IC die over and electrically coupled to the first IC die; and a second dielectric material over the first dielectric material and around second sidewalls of the second IC die, where in a top view, the second sidewalls of the second IC die are disposed within, and are spaced apart from, the first sidewalls of the first IC die.
    Type: Application
    Filed: June 14, 2023
    Publication date: September 12, 2024
    Inventors: Chen-Shien Chen, Ting Hao Kuo, Hui-Chun Chiang, Yu-Chia Lai
  • Publication number: 20240305948
    Abstract: A control method is provided. The method is used in a system and executed by a processor of the system. The method includes storing motion sensor measurements produced before a movement event is identified, wherein the motion sensor measurements is produced by motion sensors. The method includes marking the motion sensor measurements lower than a sensitivity threshold as valid when the motion sensor measurements match a change trend. The method includes generating orientation data based on the valid motion sensor measurements.
    Type: Application
    Filed: September 18, 2023
    Publication date: September 12, 2024
    Inventors: Yu-Chun CHEN, Huan CHANG, Shun-Nan LIOU
  • Publication number: 20240304657
    Abstract: A semiconductor device includes a substrate, a first gate, a plurality of second gates and a resistor. The substrate is defined with an active region and a resistor region. The first gate is disposed in the active region. The first gate has a first length extending along a first direction and a second length extending along a second direction. The plurality of second gates are disposed in the resistor region. Each of the second gates has a third length extending along the first direction and a fourth length extending along the second direction. The first length is equal to the third length, and the second length is equal to the fourth length. The resistor is disposed on the plurality of second gates.
    Type: Application
    Filed: March 29, 2023
    Publication date: September 12, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Chun Teng, Ming-Che Tsai, Ping-Chia Shih, Yi-Chang Huang, Wen-Lin Wang, Yu-Fan Hu, Ssu-Yin Liu, Yu-Nong Chen, Pei-Tsen Shiu, Cheng-Tzung Tsai
  • Patent number: 12080604
    Abstract: A method includes providing a substrate, a dummy fin, and a stack of semiconductor channel layers; forming an interfacial layer wrapping around each of the semiconductor channel layers; depositing a high-k dielectric layer, wherein a first portion of the high-k dielectric layer over the interfacial layer is spaced away from a second portion of the high-k dielectric layer on sidewalls of the dummy fin by a first distance; depositing a first dielectric layer over the dummy fin and over the semiconductor channel layers, wherein a merge-critical-dimension of the first dielectric layer is greater than the first distance thereby causing the first dielectric layer to be deposited in a space between the dummy fin and a topmost layer of the stack of semiconductor channel layers, thereby providing air gaps between adjacent layers of the stack of semiconductor channel layers and between the dummy fin and the stack of semiconductor channel layers.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: September 3, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Hao Pao, Chih-Chuan Yang, Shih-Hao Lin, Kian-Long Lim, Chih-Wei Lee, Chien-Yuan Chen, Jo-Chun Hung, Yung-Hsiang Chan, Yu-Kuan Lin, Lien-Jung Hung
  • Publication number: 20240292319
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; and a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data. When the first or second Bluetooth member device receives an alert signal, or when a specific ambient sound occurs in the surrounding environment of the first or second Bluetooth member device, the audio broadcasting device utilizes a target control command to instruct the first and second Bluetooth member devices to synchronously reduce their volume to be lower than a predetermined threshold.
    Type: Application
    Filed: May 3, 2024
    Publication date: August 29, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Bi WEI, Yu Hsuan LIU, Chia Chun HUNG
  • Publication number: 20240290072
    Abstract: A method for training a cross-domain classifier includes the following steps: (a) obtaining training samples from a first database and test samples from a second database; (b) performing an inference procedure to the test samples by the classifier to generate corresponding predicted labels; (c) for a certain category, obtaining the training samples and the test samples belonging to this category, and training an generative adversarial network (GAN) according to the obtained training samples and test samples; (d) performing a style conversion to the obtained training samples by the GAN to obtain synthetic samples; (e) merging the synthetic samples with the training samples to train the classifier; and repeating the above steps (b) to (e). The classifier will be suitable for cross-domain databases based on this iterative procedure.
    Type: Application
    Filed: June 12, 2023
    Publication date: August 29, 2024
    Inventors: Yen-Ming CHEN, Hao-Liang WEN, Yu-Xiang CHEN, Kuo-Chun LIN
  • Publication number: 20240284306
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data; and a host device arranged to operably generate and transmit a target control command to the first and second Bluetooth member devices when the first or second Bluetooth member device receives an alert signal, or when a specific ambient sound occurs in the surrounding environment of the first or second Bluetooth member device.
    Type: Application
    Filed: May 3, 2024
    Publication date: August 22, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Bi WEI, Yu Hsuan LIU, Chia Chun HUNG
  • Publication number: 20240284307
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data; and a host device arranged to operably generate and transmit a target control command to the first and second Bluetooth member devices when the host device receives an alert signal, or when a specific ambient sound occurs in the surrounding environment of the host device.
    Type: Application
    Filed: May 3, 2024
    Publication date: August 22, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Bi WEI, Yu Hsuan LIU, Chia Chun HUNG
  • Publication number: 20240284308
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; and a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data. The audio broadcasting device is further arranged to operably utilize a target control command to instruct the first and second Bluetooth member devices to synchronously reduce their volume to be lower than a predetermined threshold.
    Type: Application
    Filed: May 3, 2024
    Publication date: August 22, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Bi WEI, Yu Hsuan LIU, Chia Chun HUNG
  • Publication number: 20240284309
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; an audio source device arranged to operably capture a user's voice to generate and transmit corresponding audio signals to the audio broadcasting device; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; and a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data. The audio broadcasting device is further arranged to operably utilize a target control command to instruct the first and second Bluetooth member devices to synchronously reduce their volume to be lower than a predetermined threshold.
    Type: Application
    Filed: May 3, 2024
    Publication date: August 22, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Bi WEI, Yu Hsuan LIU, Chia Chun HUNG