Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: A terminal includes one or more processors, and memory storing one or more computer programs configured to be executed by the one or more processors. The one or more computer programs include instructions for: displaying an analysis screen of a livestream associated with a selling item on a display; and displaying, on the analysis screen, a first object indicating a sales activity on a livestreamer side and a second object indicating reactions on viewers side together along a same time axis.

Abstract: A feature point integration positioning system includes a moving object, an image input source, an analyzing module and a positioning module. The image input source is disposed at the moving object to shoot an environment for obtaining a sequential image dataset. The analyzing module includes a machine vision detecting unit configured to generate a plurality of first feature points in each of the images based on each of the images, a deep learning detecting unit configured to generate a plurality of second feature points in each of the images based on each of the images, and an integrating unit configured to integrate the first feature points and the second feature points in each of the images into a plurality of integrated feature points in each of the images. The positioning module confirms a position of the moving object relative to the environment at each of the time points.

Abstract: A method of simultaneous localization and mapping (SLAM) is provided to position a target object. Each of detected tracked objects in a surrounding environment of the target object is classified into a moving object or a static object based on data detected at different time points. The target object is then positioned without considering any of the tracked objects that are classified into a moving object.

Abstract: A feature point integration positioning system includes a moving object, an image input source, an analyzing module and a positioning module. The image input source is disposed at the moving object to shoot an environment for obtaining a sequential image dataset. The analyzing module includes a machine vision detecting unit configured to generate a plurality of first feature points in each of the images based on each of the images, a deep learning detecting unit configured to generate a plurality of second feature points in each of the images based on each of the images, and an integrating unit configured to integrate the first feature points and the second feature points in each of the images into a plurality of integrated feature points in each of the images. The positioning module confirms a position of the moving object relative to the environment at each of the time points.

Abstract: A lane stripe detecting method based on a three-dimensional LIDAR is for detecting a lane stripe of a road surface around a vehicle. A data acquisition transforming step is for obtaining a plurality of vehicle scan point coordinates. The vehicle scan point coordinates are divided into a plurality of scan lines, and each of the scan lines has a plurality of scan points. A horizontal layer lane stripe judging step is judging whether each of the scan points is a horizontal stripe point or a non-horizontal stripe point according to a threshold value of each of the scan lines. At least two of the threshold values of the scan lines are different from each other. A vertical layer lane stripe judging step is for judging whether each of the horizontal stripe points is a same lane stripe point or a different lane stripe point.

Abstract: A method of simultaneous localization and mapping (SLAM) is provided to position a target object. Each of detected tracked objects in a surrounding environment of the target object is classified into a moving object or a static object based on data detected at different time points. The target object is then positioned without considering any of the tracked objects that are classified into a moving object.

Abstract: A dynamic road surface detecting method based on a three-dimensional sensor is provided. The three-dimensional sensor receives a plurality of laser-emitting points reflected from a road surface to generate a plurality of three-dimensional sensor scan point coordinates which is transmitted to a point cloud processing module. The point cloud processing module transforms the three-dimensional sensor scan point coordinates to a plurality of vehicle scan point coordinates according to a coordinate translation equation, and then transforms a plurality of vehicle coordinate height values of the vehicle scan point coordinates to a road surface height reference line according to a folding line fitting algorithm. An absolute difference of two scan point height values of any two adjacent scan points on each of the scan lines is analyzed to generate a discontinuous point. The point cloud processing module links the discontinuous points to form a road boundary.

Abstract: A lane stripe detecting method based on a three-dimensional LIDAR is for detecting a lane stripe of a road surface around a vehicle. A data acquisition transforming step is for obtaining a plurality of vehicle scan point coordinates. The vehicle scan point coordinates are divided into a plurality of scan lines, and each of the scan lines has a plurality of scan points. A horizontal layer lane stripe judging step is judging whether each of the scan points is a horizontal stripe point or a non-horizontal stripe point according to a threshold value of each of the scan lines. At least two of the threshold values of the scan lines are different from each other. A vertical layer lane stripe judging step is for judging whether each of the horizontal stripe points is a same lane stripe point or a different lane stripe point.

Abstract: A liquid crystal display (LCD) panel adapted to alleviate the separation issue between the pixel array substrate and the opposite substrate is provided. The LCD panel includes a pixel array substrate, a first sealant pattern, a liquid crystal layer, a second sealant pattern and an opposite substrate. The pixel array substrate has an active region and a peripheral region surrounding the active region. The first sealant pattern surrounds the active region. The liquid crystal layer is located on the active region and is located inside the first sealant pattern. The second sealant pattern is located outside the first sealant pattern, and the second sealant pattern includes at least one two-dimensional extending structure. The at least one two-dimensional extending structure is located outside a sidewall corresponding to the first sealant pattern, and includes a plurality of turning structures. The opposite substrate faces the pixel array substrate.

Abstract: A dynamic road surface detecting method based on a three-dimensional sensor is provided. The three-dimensional sensor receives a plurality of laser-emitting points reflected from a road surface to generate a plurality of three-dimensional sensor scan point coordinates which is transmitted to a point cloud processing module. The point cloud processing module transforms the three-dimensional sensor scan point coordinates to a plurality of vehicle scan point coordinates according to a coordinate translation equation, and then transforms a plurality of vehicle coordinate height values of the vehicle scan point coordinates to a road surface height reference line according to a folding line fitting algorithm. An absolute difference of two scan point height values of any two adjacent scan points on each of the scan lines is analyzed to generate a discontinuous point. The point cloud processing module links the discontinuous points to form a road boundary.

Abstract: A manufacturing method of asymmetric bumps is provided. First, a substrate is provided. A film layer is then formed on the substrate. Next, a complex photomask including at least one transparent region, a number of opaque regions, and a number of semi-transparent regions is provided. Each of the semi-transparent regions is disposed between two adjacent opaque regions, and at least one light-shielding pattern is randomly disposed in each of the semi-transparent regions. The film layer is then patterned with use of the complex photomask, and multiple asymmetric bumps are formed on the substrate. By using the complex photomask, manufacturing steps of the asymmetric bumps can be reduced. Besides, a manufacturing method of a pixel structure having the above-mentioned asymmetric bumps is also provided.

Abstract: A liquid crystal display panel includes a first transparent substrate, a second transparent substrate opposite to the first transparent substrate, and a sealant disposed therebetween. The first transparent substrate includes a peripheral region, and a plurality of conductive lines disposed in the peripheral region. The conductive lines include a plurality of transparent conductive lines and non-transparent conductive lines. The sealant is disposed in the peripheral region.

Abstract: A method of manufacturing thin film transistor is provided, in which the method of manufacturing includes a new etching process of island semiconductor. The new etching process of island semiconductor is controlled by a flow rate of etching gas and a regulation of etching power. When etching the island semiconductor, a part of gate insulation layer exposed out of the island semiconductor is etched at the same time. Consequently, the thickness of gate insulation layer over the storage capacitance electrode is reduced, the distance between the pixel electrode and the storage capacitance electrode is decreased, and the storage capacitance of pixel is increased. Finally, the width of storage capacitance electrode is reduced appropriately and the aperture ratio of product is increased.

Abstract: A method of manufacturing thin film transistor is provided, in which the method of manufacturing includes a new etching process of island semiconductor. The new etching process of island semiconductor is controlled by a flow rate of etching gas and a regulation of etching power. When etching the island semiconductor, a part of gate insulation layer exposed out of the island semiconductor is etched at the same time. Consequently, the thickness of gate insulation layer over the storage capacitance electrode is reduced, the distance between the pixel electrode and the storage capacitance electrode is decreased, and the storage capacitance of pixel is increased. Finally, the width of storage capacitance electrode is reduced appropriately and the aperture ratio of product is increased.

Abstract: A peripheral circuit disposed on a substrate having an active device array is provided. The peripheral circuit includes first test pads, second test pads, first lines, and second lines. The first and the second lines are electrically connected to the active device array. Each first test pad includes a first conductive layer and a second conductive layer electrically connected to the first conductive layer. The first conductive layer electrically connects at least two of the adjacent first lines. The second test pads are interposed between the first test pads and the active device array. Each second test pad includes third conductive layers and a fourth conductive layer electrically connected to the third conductive layers. The first lines pass through the third conductive layers and are insulated from the fourth conductive layer. Each third conductive layer is electrically connected to one of the adjacent second lines respectively.

Abstract: A method of utilizing dual-layer photoresist to form black matrixes and spacers on a control circuit substrate is provided. The dual-layer photoresist includes a layer of black resin and a layer of transparent photoresist. The black resin, having an optical density greater than three, is mainly used to achieve the effect of black matrix. The transparent photoresist is mainly used to satisfy the needed cell gap between two transparent substrates.

Abstract: A manufacturing method of asymmetric bumps is provided. First, a substrate is provided. A film layer is then formed on the substrate. Next, a complex photomask including at least one transparent region, a number of opaque regions, and a number of semi-transparent regions is provided. Each of the semi-transparent regions is disposed between two adjacent opaque regions, and at least one light-shielding pattern is randomly disposed in each of the semi-transparent regions. The film layer is then patterned with use of the complex photomask, and multiple asymmetric bumps are formed on the substrate. By using the complex photomask, manufacturing steps of the asymmetric bumps can be reduced. Besides, a manufacturing method of a pixel structure having the above-mentioned asymmetric bumps is also provided.

Abstract: A liquid crystal display panel includes a first transparent substrate, a second transparent substrate opposite to the first transparent substrate, and a sealant disposed therebetween. The first transparent substrate includes a peripheral region, and a plurality of conductive lines disposed in the peripheral region. The conductive lines include a plurality of transparent conductive lines and non-transparent conductive lines. The sealant is disposed in the peripheral region.

Abstract: A peripheral circuit disposed on a substrate having an active device array is provided. The peripheral circuit includes first test pads, second test pads, first lines, and second lines. The first and the second lines are electrically connected to the active device array. Each first test pad includes a first conductive layer and a second conductive layer electrically connected to the first conductive layer. The first conductive layer electrically connects at least two of the adjacent first lines. The second test pads are interposed between the first test pads and the active device array. Each second test pad includes third conductive layers and a fourth conductive layer electrically connected to the third conductive layers. The first lines pass through the third conductive layers and are insulated from the fourth conductive layer. Each third conductive layer is electrically connected to one of the adjacent second lines respectively.