Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.

Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.

Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.