Patents by Inventor Yu-Hao Chien
Yu-Hao Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240089607Abstract: An image sensing device and a control device of an illumination device thereof are provided. The control device includes a control circuit, an operation circuit, and multiple driving signal generators. The control circuit generates multiple control signals. The operation circuit performs a logical operation on the control signals and an image capturing signal to generate multiple operation results. The driving signal generator respectively provides multiple driving signals to the illumination device according to the operation results, and the driving signals respectively have multiple different output powers.Type: ApplicationFiled: May 29, 2023Publication date: March 14, 2024Applicant: HTC CorporationInventors: Chao Shuan Huang, Sheng-Long Wu, Yu-Jui Hsu, Shih-Yao Tsai, Tun-Hao Chao, Sen-Lin Chung, Chih Pin Chung, Chih-Yuan Chien, Shih Hong Sun
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Patent number: 11518673Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.Type: GrantFiled: December 11, 2019Date of Patent: December 6, 2022Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTDInventors: Yu-Hao Chien, Li-Tien Tseng, Chih-Liang Kuo
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Patent number: 11312624Abstract: A manufacturing method of microelectromechanical system (MEMS) device includes providing a first, a second and a third substrates, wherein the first substrate includes a first and a second circuit, the second substrate includes second and third connection areas, and the third substrate includes first connection areas. Second grooves and a dividing groove are formed on the fourth surface of the third substrate. The second and third substrates are bonded to make the first and the second connection areas correspondingly connect with each other. The second substrate is divided to form electrically isolating first and second movable elements. The first movable element is spatial separated from the third substrate and corresponding to the second groove. The second movable element is connected to the third substrate. The first and the second substrates are bonded to make the fourth and the third connection areas connect correspondingly.Type: GrantFiled: December 13, 2019Date of Patent: April 26, 2022Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTDInventors: Li-Tien Tseng, Yu-Hao Chien
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Patent number: 11137296Abstract: A force sensor includes a package substrate, a MEMS-based device, a package body and a force touching member. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The force touching member including a rod is disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.Type: GrantFiled: May 30, 2019Date of Patent: October 5, 2021Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTDInventors: Li-Tien Tseng, Yu-Hao Chien, Chih-Liang Kuo, Yu-Te Yeh
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Publication number: 20210215735Abstract: A three-axis accelerometer measures acceleration in three axes by a single movable mass block, so that a more compact design of the three-axis accelerometer can be achieved. In addition, a plurality of detection capacitors, which forms differential capacitor pairs, are arranged in symmetric configuration with respect to a rotation axis of the movable mass block for sensing functions. Therefore, during sensing motion of a target axis direction, the all other unwanted capacitance changes in other axis direction may be cancelled.Type: ApplicationFiled: March 30, 2021Publication date: July 15, 2021Inventors: Li-Tien TSENG, Yu-Hao CHIEN
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Publication number: 20200182903Abstract: A three-axis accelerometer measures acceleration in three axes by a single movable mass element, so that a more compact design of the three-axis accelerometer can be achieved. In addition, a plurality of detection capacitors, which forms differential capacitor pairs, are arranged in symmetric configuration with respect to a rotation axis of the movable mass element. Therefore, when the movable mass element rotates, the differential capacitance value is zero, and the detection error caused by rotation of the movable mass element can be avoided.Type: ApplicationFiled: March 22, 2019Publication date: June 11, 2020Inventors: Li-Tien TSENG, Yu-Hao CHIEN
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Publication number: 20200115226Abstract: A manufacturing method of microelectromechanical system (MEMS) device includes providing a first, a second and a third substrates, wherein the first substrate includes a first and a second circuit, the second substrate includes second and third connection areas, and the third substrate includes first connection areas. Second grooves and a dividing groove are formed on the fourth surface of the third substrate. The second and third substrates are bonded to make the first and the second connection areas correspondingly connect with each other. The second substrate is divided to form electrically isolating first and second movable elements. The first movable element is spatial separated from the third substrate and corresponding to the second groove. The second movable element is connected to the third substrate. The first and the second substrates are bonded to make the fourth and the third connection areas connect correspondingly.Type: ApplicationFiled: December 13, 2019Publication date: April 16, 2020Inventors: LI-TIEN TSENG, YU-HAO CHIEN
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Publication number: 20200115221Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.Type: ApplicationFiled: December 11, 2019Publication date: April 16, 2020Inventors: Yu-Hao CHIEN, Li-Tien TSENG, Chih-Liang KUO
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Publication number: 20200048074Abstract: A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.Type: ApplicationFiled: October 21, 2019Publication date: February 13, 2020Inventors: LI-TIEN TSENG, YU-HAO CHIEN, CHIH-LIANG KUO, YU-TE YEH
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Patent number: 10538428Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.Type: GrantFiled: May 16, 2018Date of Patent: January 21, 2020Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTDInventors: Yu-Hao Chien, Li-Tien Tseng, Chih-Liang Kuo
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Publication number: 20190368951Abstract: A force sensor includes a package substrate, a MEMS-based device, a package body and a protruding element. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The protruding element includes a bump, disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.Type: ApplicationFiled: May 30, 2019Publication date: December 5, 2019Inventors: LI-TIEN TSENG, YU-HAO CHIEN, CHIH-LIANG KUO, YU-TE YEH
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Patent number: 10486962Abstract: A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.Type: GrantFiled: May 30, 2018Date of Patent: November 26, 2019Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTDInventors: Li-Tien Tseng, Yu-Hao Chien, Chih-Liang Kuo, Yu-Te Yeh
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Publication number: 20190330053Abstract: A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.Type: ApplicationFiled: May 30, 2018Publication date: October 31, 2019Inventors: Li-Tien TSENG, Yu-Hao CHIEN, Chih-Liang KUO, Yu-Te YEH
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Publication number: 20190225486Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.Type: ApplicationFiled: May 16, 2018Publication date: July 25, 2019Inventors: Yu-Hao CHIEN, Li-Tien TSENG, Chih-Liang KUO
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Patent number: 10040681Abstract: A micro electro-mechanical (MEMS) device assembly is provided. The MEMS device assembly includes a first substrate that has a plurality of electronic devices, a plurality of first bonding regions, and a plurality of second bonding regions. The MEMS device assembly also includes a second substrate that is bonded to the first substrate at the plurality of first bonding regions. A third substrate having a recessed region and a plurality of standoff structures is disposed over the second substrate and bonded to the first substrate at the plurality of second bonding regions. The plurality of first bonding regions provide a conductive path between the first substrate and the second substrate and the plurality of the second bonding regions provide a conductive path between the first substrate and the third substrate.Type: GrantFiled: August 20, 2010Date of Patent: August 7, 2018Assignee: Miradia Inc.Inventors: Hua-Shu Wu, Yu-Hao Chien, Shih-Yung Chung, Li-Tien Tseng, Yu-Te Yeh
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Publication number: 20170336435Abstract: A microelectromechanical system (MEMS) device includes a first movable element and a second movable element, wherein the second movable element is connected with a movable membrane for sensing pressure to make the second movable element move with the movable membrane to sense the pressure variation of the external environment, and other portion of the substrate forming the movable membrane can form a cap to protect the first movable element for sensing other physical quantity. Accordingly, the pressure sensor and the MEMS structure for sensing other physical quantity can be integrated in the foregoing MEMS device by a single process.Type: ApplicationFiled: May 19, 2017Publication date: November 23, 2017Inventors: LI-TIEN TSENG, YU-HAO CHIEN
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Patent number: 9809447Abstract: A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the interface between the first substrate and the second substrate and further breaks out the interface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber.Type: GrantFiled: January 24, 2017Date of Patent: November 7, 2017Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD.Inventors: Yu-Hao Chien, Li-Tien Tseng
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Publication number: 20170129774Abstract: A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the interface between the first substrate and the second substrate and further breaks out the interface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber.Type: ApplicationFiled: January 24, 2017Publication date: May 11, 2017Inventors: Yu-Hao CHIEN, Li-Tien TSENG
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Patent number: 9598275Abstract: A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the surface between the first substrate and the second substrate and further breaks out the surface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber. The manufacture method of the pressure sensor is also disclosed.Type: GrantFiled: January 14, 2015Date of Patent: March 21, 2017Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTDInventors: Yu-Hao Chien, Li-Tien Tseng
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Patent number: 9278853Abstract: A manufacturing process of a MEMS device divides a substrate for fabricating a MEMS component into two electrically isolated regions, so that the MEMS component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A MEMS device manufactured by using the aforementioned process is also disclosed herein.Type: GrantFiled: April 18, 2014Date of Patent: March 8, 2016Assignee: MiraMEMS Sensing Technology Co., Ltd.Inventors: Yu-Hao Chien, Hua-Shu Wu, Shih-Yung Chung, Li-Tien Tseng, Yu-Te Yeh