Patents by Inventor Yu-Hsien Wu

Yu-Hsien Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200333542
    Abstract: An optical chip package is provided. The optical chip package includes a first transparent substrate, a second transparent substrate, and a spacer layer. The first and second transparent substrates each has a first surface and a second surface opposite the first surface. The first transparent substrate has a thickness that is different than that of the second transparent substrate. The second transparent substrate is disposed over the first transparent substrate, and the spacer layer is bonded between the second surface of the first transparent substrate and the first surface of the second transparent substrate. The recess region extends from the second surface of the second transparent substrate into the first transparent substrate, so that the first transparent substrate has a step-shaped sidewall. A method of forming an optical chip package is also provided.
    Type: Application
    Filed: April 17, 2020
    Publication date: October 22, 2020
    Inventors: Jiun-Yen LAI, Yu-Ting HUANG, Hsing-Lung SHEN, Tsang-Yu LIU, Hui-Hsien WU
  • Publication number: 20200312278
    Abstract: A video processing method for a video processing circuit includes receiving a first video source corresponding to a first pixel rate and a second video source corresponding to a second pixel rate, wherein a processing data rate of a video processing path is greater than or equal to a sum of the first pixel rate and the second pixel rate, and using the processing data rate to sequentially perform an image processing to a first image of the first video source and a second image of the second video source corresponding to the same display time, to generate a first processed image and a second processed image.
    Type: Application
    Filed: March 6, 2020
    Publication date: October 1, 2020
    Inventors: Po-Hsien Wu, Yu-Pin Lin, Tien-Hung Lin
  • Publication number: 20200303283
    Abstract: A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 24, 2020
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Kuen-Hsien WU, Shih-I LIANG
  • Publication number: 20200295081
    Abstract: A display device is provided. The display device includes a substrate, and a first sub-pixel and a second sub-pixel disposed on the substrate, wherein the first sub-pixel and the second sub-pixel respectively correspond to two different colors. The first sub-pixel includes a first light-emitting element and a first wavelength conversion layer adjacent to the first light-emitting element, wherein a light emitted from the first light-emitting element passes through the first wavelength conversion layer. The second sub-pixel includes a second light-emitting element and a second wavelength conversion layer adjacent to the second light-emitting element, wherein a light emitted from the second light-emitting element passes through the second wavelength conversion layer. An area of the first wavelength conversion layer and an area of the second wavelength conversion layer are different.
    Type: Application
    Filed: June 2, 2020
    Publication date: September 17, 2020
    Inventors: Kuan-Feng LEE, Yuan-Lin WU, Yu-Hsien WU
  • Publication number: 20200294912
    Abstract: A package structure includes a die, a TIV, a first encapsulant, a RDL structure, a thermal dissipation structure and a second encapsulant. The die has a first surface and a second surface opposite to each other. The TIV is laterally aside the die. The first encapsulant encapsulates sidewalls of the die and sidewalls of the TIV. The RDL structure is disposed on the first surface of the die and on the first encapsulant, electrically connected to the die and the TIV. The thermal dissipation structure is disposed over the second surface of die and electrically connected to the die through the TIV and the RDL structure. The second encapsulant encapsulates sidewalls of the thermal dissipation structure.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 17, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20200287155
    Abstract: A display device is provided. The display device includes a substrate, a driving transistor, a first insulation layer, a first electrode and a second insulation layer. The driving transistor is disposed on the substrate and includes a gate electrode, and the gate electrode projects a first projection profile on the substrate. The first insulation layer is disposed on the driving transistor. The first electrode is disposed on the first insulation layer, and projects a second projection profile on the substrate. The second insulation layer is disposed on the first electrode and the first insulation layer. The second insulation layer has an opening, the opening exposes a portion of the first electrode, and the opening projects a third projection profile on the substrate.
    Type: Application
    Filed: May 21, 2020
    Publication date: September 10, 2020
    Inventors: Yu-Hsien WU, Yu-Sheng TSAI, Kuan-Feng LEE, Chandra LIUS
  • Patent number: 10755936
    Abstract: First, second, and third trenches are formed in a layer over a substrate. The third trench is substantially wider than the first and second trenches. The first, second, and third trenches are partially filled with a first conductive material. A first anti-reflective material is coated over the first, second, and third trenches. The first anti-reflective material has a first surface topography variation. A first etch-back process is performed to partially remove the first anti-reflective material. Thereafter, a second anti-reflective material is coated over the first anti-reflective material. The second anti-reflective material has a second surface topography variation that is smaller than the first surface topography variation. A second etch-back process is performed to at least partially remove the second anti-reflective material in the first and second trenches. Thereafter, the first conductive material is partially removed in the first and second trenches.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: August 25, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jin-Dah Chen, Ming-Feng Shieh, Han-Wei Wu, Yu-Hsien Lin, Po-Chun Liu, Stan Chen
  • Patent number: 10750002
    Abstract: A communication device includes a first body, a second body, a first audio module, and a second audio module. The second body is rotatably connected to the first body. The first audio module is disposed on the first body. The second audio module is at least partially disposed on the first body. When the second body rotates relatively to the first body to be in a first state to switch the communication device to be in a first operation mode, at least a portion of the first audio module is turned on, and the second audio module is turned off. When the second body rotates relatively to the first body to be in a second state to switch the communication device to be in a second operation mode, the first audio module is turned off, and the second audio module is turned on.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: August 18, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ching-Hua Li, Li-Fang Chen, Chen-Hsien Cheng, Yi-Chang Wu, Po-Yueh Lan, Yu-Wei Lai, Kun-Chang Chen, Yi-Chun Lin
  • Patent number: 10741569
    Abstract: In a method of manufacturing a semiconductor device, a memory cell structure covered by a protective layer is formed in a memory cell area of a substrate. A mask pattern is formed. The mask pattern has an opening over a first circuit area, while the memory cell area and a second circuit area are covered by the mask pattern. The substrate in the first circuit area is recessed, while the memory cell area and the second circuit area are protected. A first field effect transistor (FET) having a first gate dielectric layer is formed in the first circuit area over the recessed substrate and a second FET having a second gate dielectric layer is formed in the second circuit area over the substrate as viewed in cross section.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: August 11, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Chin Liu, Wei Cheng Wu, Yi Hsien Lu, Yu-Hsiung Wang, Juo-Li Yang
  • Patent number: 10727344
    Abstract: A semiconductor device includes a fin field effect transistor (FinFET). The FinFET includes a channel disposed on a fin, a gate disposed over the channel and a source and drain. The channel includes at least two pairs of a first semiconductor layer and a second semiconductor layer formed on the first semiconductor layer. The first semiconductor layer has a different lattice constant than the second semiconductor layer. A thickness of the first semiconductor layer is three to ten times a thickness of the second semiconductor layer at least in one pair.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: July 28, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Ching Cheng, Chih Chieh Yeh, Cheng-Hsien Wu, Hung-Li Chiang, Jung-Piao Chiu, Tzu-Chiang Chen, Tsung-Lin Lee, Yu-Lin Yang, I-Sheng Chen
  • Patent number: 10707265
    Abstract: A display device is provided. The display device includes a substrate, and a first sub-pixel and a second sub-pixel disposed on the substrate, wherein the first sub-pixel and the second sub-pixel respectively correspond to two different colors. The first sub-pixel includes a first light-emitting element and a first wavelength conversion layer adjacent to the first light-emitting element, wherein a light emitted from the first light-emitting element passes through the first wavelength conversion layer. The second sub-pixel includes a second light-emitting element and a second wavelength conversion layer adjacent to the second light-emitting element, wherein a light emitted from the second light-emitting element passes through the second wavelength conversion layer. An area of the first wavelength conversion layer and an area of the second wavelength conversion layer are different.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: July 7, 2020
    Assignee: IINOLUX CORPORATION
    Inventors: Kuan-Feng Lee, Yuan-Lin Wu, Yu-Hsien Wu
  • Publication number: 20200212019
    Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.
    Type: Application
    Filed: March 12, 2020
    Publication date: July 2, 2020
    Inventors: Chi-Rui Wu, Fu-Tang Huang, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi, Yu-Cheng Pai
  • Patent number: 10700153
    Abstract: A display device including a light-emitting unit is provided. The display device further includes a substrate, a semiconductor layer, and a first sub-pixel unit. The semiconductor layer and the first sub-pixel unit are disposed on the substrate. The first sub-pixel unit includes a storage capacitor. The storage capacitor includes a first electrode and at least part of the semiconductor layer overlapped with the first electrode. In a top view of the display device, an area of the first electrode is greater than an area of the at least part of the semiconductor layer.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: June 30, 2020
    Inventors: Yang-Chen Chen, Yu-Hsien Wu
  • Patent number: 10692908
    Abstract: A CMOS image sensor encapsulation structure and its manufacturing method, including: forming a blind hole in a combined layer formed by a first insulating layer and a wafer, a surface of the first insulating layer facing away from the wafer having a micro convex lens; forming a second insulating layer on a hole wall of the blind hole, then filling an electrically conductive material in the blind hole having the second insulating layer, and making a conductor in the combined layer in signal connection with the micro convex lens and an IC extend to a surface of the first insulating layer and electrically connecting the conductor to the electrically conductive material; fixing the transparent substrate material on a surface of the first insulating layer having the micro convex lens, forming a dummy wafer on a surface of the transparent substrate material, and then thinning the wafer by grinding.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 23, 2020
    Assignee: Pioneer Materials Inc. Chengdu
    Inventors: Chen-Hsin Wu, Ti-Hsien Tai, Yu-Hsiang Pan, Liu-Yuh Lin, Liang-Chih Weng, Tzu-Huan Cheng, Hao-Che Liu, Chien-Chun Liu, Chien-Yao Huang, Leon A Chiu, Sau-Mou Wu
  • Patent number: 10692907
    Abstract: Disclosed are a CMOS image sensor encapsulation structure and a method for manufacturing the same, including the steps of: firstly, a transparent substrate material is fixed to a surface of a first insulating layer having a micro convex lens, a dummy wafer is fixed on a surface of the transparent substrate material, and then a wafer is thinned by grinding, and in this process, the transparent substrate material provides more mechanical support force for the wafer, therefore, the wafer can become thinner by grinding, thus the CMOS image sensor encapsulation structure is characterized by being formed in a thin shape. Besides, a second installation area has a protection glue layer which can prevent oxygen and moisture from entering internal elements and absorb scattered light.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 23, 2020
    Assignee: Pioneer Materials inc. Chengdu
    Inventors: Chen-Hsin Wu, Liu-Yuh Lin, Liang-Chih Weng, Tzu-Huan Cheng, Hao-Che Liu, Chien-Chun Liu, Chien-Yao Huang, Leon A. Chiu, Sau-Mou Wu, Ti-Hsien Tai, Yu-Hsiang Pan
  • Patent number: 10693100
    Abstract: A display device is provided. The display device includes a substrate, a driving transistor, a first electrode and an insulation layer. The driving transistor is disposed on the substrate, wherein the driving transistor comprises a gate electrode. The first electrode is disposed on the gate electrode. The insulation layer is disposed on the first electrode, wherein the insulation layer has an opening, and the opening exposes a portion of the first electrode. In view of a first direction perpendicular to the substrate, the first electrode partially overlaps the gate electrode to form a first portion, and the first portion is separated from the opening.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: June 23, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Yu-Hsien Wu, Yu-Sheng Tsai, Kuan-Feng Lee, Chandra Lius
  • Publication number: 20200192110
    Abstract: A display device includes an imaging element, a flat surface light source and a polarization beam splitter. The flat surface light source is used for providing plural illumination beams. A normal line of the flat surface light source and a normal line of the imaging element are not perpendicular to each other. The polarization beam splitter is arranged between the flat surface light source and the imaging element, and has a geometric surface. When the illumination beams from the flat surface light source are projected on the geometric surface, the illumination beams are reflected to the imaging element. The imaging beams from the imaging element are transmitted through the geometric surface. Consequently, an image is outputted. An imaging surface of the imaging surface can be irradiated uniformly by the illumination beams on within a specified viewing angle.
    Type: Application
    Filed: March 28, 2019
    Publication date: June 18, 2020
    Inventors: SHIH-PING WU, YU-SHENG LIU, CHI-WEI CHEN, MING-HSIEN TSAI
  • Publication number: 20200194321
    Abstract: The invention provides a testkey detection circuit, including a plurality of oscillators and a driving circuit. Each of the oscillators has an enable terminal, a voltage terminal and an output terminal, wherein the enable terminals are connected to a common enable terminal. The driving circuit receives the output terminals of the oscillators and increases a driving level of a selected one of the output terminals as a frequency output.
    Type: Application
    Filed: January 16, 2019
    Publication date: June 18, 2020
    Applicant: United Microelectronics Corp.
    Inventors: KUN-YUAN WU, Wei-Jen Wang, Chien-Fu Chen, Chen-Hsien Hsu, Yuan-Hui Chen, Ruei-Yau Chen, Cheng-Tsung Ku, Zhi-Hong Huang, Cheng-Yang Tsai, Yu-Lin Chen
  • Patent number: 10680050
    Abstract: A display device is provided. The display device includes a substrate and an insulating layer disposed on the substrate and having a recess. The display device also includes an organic layer disposed on the insulating layer. The display device also includes at least one light emitting unit disposed in the recess and a conductive layer disposed on the light emitting unit.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: June 9, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Tsung-Han Tsai, Kuan-Feng Lee, Yu-Hsien Wu, Yuan-Lin Wu
  • Publication number: 20200176430
    Abstract: A display device is provided. The display device includes a supporting film and a flexible substrate disposed on the supporting film. The display device also includes a driving layer disposed on the flexible substrate, and a conductive pad disposed on the driving layer. The display device further includes a light-emitting diode disposed on the conductive pad and electrically connected to the conductive pad, wherein the supporting film has a first hardness, the flexible substrate has a second hardness, and the first hardness is greater than or equal to the second hardness.
    Type: Application
    Filed: February 5, 2020
    Publication date: June 4, 2020
    Inventors: Yuan-Lin WU, Yu-Hsien WU, Kuan-Feng LEE, Tsung-Han TSAI