Patents by Inventor Yu-Jing Liao

Yu-Jing Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9570843
    Abstract: A conductive structure, including a holder, a first magnetic element, and a conductive terminal, is provided. The holder has a receiving space. The first magnetic element is disposed in the holder. The conductive terminal is disposed in the receiving space corresponding to the first magnetic element. The conductive terminal is attracted to the first magnetic element and is hidden in the receiving space of the holder. When the conductive terminal is moved close to a conductive contact provided with a second magnetic element, the conductive terminal is attracted to the second magnetic element and moves from the receiving space to be in contact with and electrically connected with the conductive contact. An electronic assembly, including a housing and the conductive structure, is also provided.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: February 14, 2017
    Assignee: HTC Corporation
    Inventors: I-Hsuan Lin, Chih-Kai Hu, Yi-Ting Liu, Yu-Jing Liao
  • Publication number: 20170010498
    Abstract: An electronic device including a transparent cover, a transparent film, a display module, a side frame, and a base frame is provided. The transparent film is adhered to the transparent cover. The display module is adhered to the transparent film, such that the transparent film is disposed between the transparent cover and the display module. The transparent film extends to the side frame and is bonded with the side frame. The base frame is connected to the side frame. By extending the transparent film to the side frame and bonding the transparent film with the side frame, the transparent film is capable of stopping liquid, thereby archiving a waterproofing effect. A method for assembling an electronic device is also provided.
    Type: Application
    Filed: July 9, 2015
    Publication date: January 12, 2017
    Inventors: Shih-Po Chien, Chia-Huan Chang, Po-Chin Huang, Yi-Ting Liu, Yu-Jing Liao, I-Hsuan Lin
  • Patent number: 9538655
    Abstract: An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: January 3, 2017
    Assignee: HTC Corporation
    Inventors: Hsin-Chih Liu, Ying-Yen Cheng, Yu-Jing Liao
  • Patent number: 9531853
    Abstract: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: December 27, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu
  • Patent number: 9531932
    Abstract: A camera module is provided. The camera module includes a camera device and a support ring. The camera device includes a substrate, an image sensor device on the substrate, and a holder for covering the image sensor device, wherein the holder includes a side portion placed around the image sensor device. The support ring is fixed to and laterally extends from the side portion of the holder, and is attached onto a wall portion of the chassis. A portable device with the camera module is also disclosed.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 27, 2016
    Assignee: HTC Corporation
    Inventors: Hsin-Chih Liu, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen, I-Cheng Chuang, Chia-Huan Chang
  • Publication number: 20160238747
    Abstract: A panel assembly includes a transparent cover, a display module, a decorative layer, and a Fresnel lens structure. The transparent cover has a lower surface. The display module is disposed under the lower surface. The decorative layer is disposed on the lower surface. The Fresnel lens structure is located above the display module. Besides, an electronic device includes a frame, a housing, and the above panel assembly, and the housing and the panel assembly are installed in the frame.
    Type: Application
    Filed: February 13, 2015
    Publication date: August 18, 2016
    Inventors: Po-Chin Huang, Shih-Po Chien, Yu-Jing Liao, I-Cheng Chuang
  • Publication number: 20160212870
    Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface.
    Type: Application
    Filed: March 31, 2016
    Publication date: July 21, 2016
    Inventors: Chih-Kai Wai Mun Hu, Yu-Jing Liao, I-Cheng Chuang
  • Patent number: 9346198
    Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface, and an equivalence radius of a vertex angle at each intersection line is less than or equal to 0.1 millimeter. A mold assembly and a forming method for fabricating the molded case are also provided.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: May 24, 2016
    Assignee: HTC Corporation
    Inventors: Chih-Kai Hu, Yu-Jing Liao, I-Cheng Chuang
  • Patent number: 9335801
    Abstract: A frame to be assembled to a housing of an electronic device is provided. The frame includes a first material portion and a second material portion. The first material portion has a first thermal conductivity coefficient, and the second material portion has a second thermal conductivity coefficient. The first material portion is connected to the second material portion, and the first thermal conductivity coefficient is greater than the second thermal conductivity coefficient. A stiffness of the second material portion is greater than a stiffness of the first material portion. A heat generating element of the electronic device dissipates heat by the first material portion, and the heat generating element is disposed to be corresponding to the first material portion. An electronic device having said frame is also provided.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: May 10, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Hsin-Chih Liu, Hung-Wen Lin
  • Patent number: 9332329
    Abstract: An electronic apparatus includes the following elements. A housing has at least an opening and an accommodating space. A first circuit board is disposed in the accommodating space. A battery module disposed in the accommodating space is stacked over the first circuit board. A display module disposed in the accommodating space is stacked over the battery module. The display module is visible through the opening. A second circuit board is disposed in the accommodating space and beside the battery module. At least a part of the second circuit board is not disposed below the display module. A first speaker is disposed in the accommodating space and below the part of the second circuit board. The first speaker has a top side with a first sound hole aligned to a slot of the part of the second circuit board.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: May 3, 2016
    Assignee: HTC Corporation
    Inventors: Ying-Yen Cheng, Yu-Jing Liao, Chieh-Sheng Lin
  • Patent number: 9282668
    Abstract: An electronic apparatus including a housing, a first circuit board, a battery module, a display module and a second circuit board is provided. The housing has at least an opening and an accommodating space. The first circuit board is disposed in the accommodating space. The battery module is disposed in the accommodating space and stacked over the first circuit board. The display module is disposed in the accommodating space and stacked over the battery module, wherein the display module is visible through the opening. The second circuit board is disposed in the accommodating space and disposed under the display module, beside the battery module.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: March 8, 2016
    Assignee: HTC Corporation
    Inventors: Ying-Yen Cheng, Yu-Jing Liao
  • Publication number: 20160057326
    Abstract: A camera module is provided. The camera module includes a camera device and a support ring. The camera device includes a substrate, an image sensor device on the substrate, and a holder for covering the image sensor device, wherein the holder includes a side portion placed around the image sensor device. The support ring is fixed to and laterally extends from the side portion of the holder, and is attached onto a wall portion of the chassis. A portable device with the camera module is also disclosed.
    Type: Application
    Filed: October 30, 2015
    Publication date: February 25, 2016
    Applicant: HTC CORPORATION
    Inventors: Hsin-Chih LIU, Yu-Jing LIAO, Ying-Yen CHENG, Yin-Chou CHEN, I-Cheng CHUANG, Chia-Huan CHANG
  • Publication number: 20160057899
    Abstract: A cover plate used for an electronic device is provided. The cover plate includes a plate and a conductive layer. The plate has two surfaces opposite to each other and a lateral surface connected between the two surfaces. The lateral surface of the plate is framed by the conductive layer which is electrically connected to a ground end of the electronic device. The disclosure further provides an electronic device including the cover plate and a main body. The main body is disposed within the electronic device and electrically connected to the conductive layer.
    Type: Application
    Filed: August 19, 2014
    Publication date: February 25, 2016
    Inventors: Shih-Po Chien, Yi-Ting Liu, Yu-Jing Liao, I-Cheng Chuang, Chia-Huan Chang
  • Publication number: 20160050745
    Abstract: An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.
    Type: Application
    Filed: August 15, 2014
    Publication date: February 18, 2016
    Inventors: Hsin-Chih Liu, Ying-Yen Cheng, Yu-Jing Liao
  • Publication number: 20160018862
    Abstract: A frame to be assembled to a housing of an electronic device is provided. The frame includes a first material portion and a second material portion. The first material portion has a first thermal conductivity coefficient, and the second material portion has a second thermal conductivity coefficient. The first material portion is connected to the second material portion, and the first thermal conductivity coefficient is greater than the second thermal conductivity coefficient. A stiffness of the second material portion is greater than a stiffness of the first material portion. A heat generating element of the electronic device dissipates heat by the first material portion, and the heat generating element is disposed to be corresponding to the first material portion. An electronic device having said frame is also provided.
    Type: Application
    Filed: July 17, 2014
    Publication date: January 21, 2016
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Hsin-Chih Liu, Hung-Wen Lin
  • Publication number: 20150364862
    Abstract: A conductive structure, including a holder, a first magnetic element, and a conductive terminal, is provided. The holder has a receiving space. The first magnetic element is disposed in the holder. The conductive terminal is disposed in the receiving space corresponding to the first magnetic element. The conductive terminal is attracted to the first magnetic element and is hidden in the receiving space of the holder. When the conductive terminal is moved close to a conductive contact provided with a second magnetic element, the conductive terminal is attracted to the second magnetic element and moves from the receiving space to be in contact with and electrically connected with the conductive contact. An electronic assembly, including a housing and the conductive structure, is also provided.
    Type: Application
    Filed: June 13, 2014
    Publication date: December 17, 2015
    Inventors: I-Hsuan Lin, Chih-Kai Hu, Yi-Ting Liu, Yu-Jing Liao
  • Patent number: 9210311
    Abstract: A camera module is provided. The camera module includes a camera device and a support ring. The camera device includes a substrate, an image sensor device on the substrate, and a holder for covering the image sensor device, wherein the holder includes a side portion placed around the image sensor device. The support ring is fixed to and laterally extends from the side portion of the holder, and is attached onto a wall portion of the chassis. A portable device with the camera module is also disclosed.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: December 8, 2015
    Assignee: HTC CORPORATION
    Inventors: Hsin-Chih Liu, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen, I-Cheng Chuang, Chia-Huan Chang
  • Publication number: 20150327413
    Abstract: An electronic apparatus including a housing, a motherboard, a battery and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery. The display module is disposed in the accommodating space and stacked over the battery. The battery is located between the motherboard and the display module. At least one edge of the battery in a width direction of the battery is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen
  • Patent number: 9184521
    Abstract: A connector assembly adapted to be disposed in a casing of an electronic device is provided. The connector assembly includes a connector and a locking member. The locking member includes a supporting portion and a holding portion connected to the supporting portion. The connector is disposed on the supporting portion. The locking member is adapted to clamp at an end of a substrate disposed in the casing, and the supporting portion and the holding portion lean against an upper side and a lower side of the end of the substrate respectively. An electronic device including the connector assembly aforementioned is also provided.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: November 10, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu
  • Patent number: 9137918
    Abstract: An electronic apparatus including a housing, a motherboard, a battery module and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery module is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery module. The display module is disposed in the accommodating space and stacked over the battery module. The battery module is located between the motherboard and the display module. At least one edge of the battery module in a width direction of the battery module is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: September 15, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen