Patents by Inventor Yu Min Sun

Yu Min Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11156639
    Abstract: A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: October 26, 2021
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Publication number: 20210281846
    Abstract: A method and apparatus for processing transform blocks of video data performed by a video encoder or a video decoder are disclosed. A plurality of quantization matrix sets are determined, where each quantization matrix set includes one or more quantization matrices corresponding to different block types. For a transform block corresponding to a current block in a current picture, a selected quantization matrix set is determined from the plurality of quantization matrix sets for the transform block. Quantization process or de-quantization process is applied to the transform block using a corresponding quantization matrix from the selected quantization matrix set.
    Type: Application
    Filed: September 13, 2016
    Publication date: September 9, 2021
    Inventors: Shih-Ta HSIANG, Shaw-Min LEI, Yu-Wen HUANG, Yu-Chen SUN
  • Publication number: 20210223290
    Abstract: A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.
    Type: Application
    Filed: February 18, 2020
    Publication date: July 22, 2021
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Patent number: 10598724
    Abstract: A testing system for semiconductor package components includes a testing circuit board, a test socket, at least one probe pin and a thermal barrier layer element. The testing circuit board has at least one electrical contact. The test socket is used to receive a DUT. The probe pin is located on the test socket for contacting with the DUT. The thermal barrier layer element is located between the testing circuit board and the test socket, electrically connected to the probe pin and the electrical contact, and thermally isolated the electrical contact from the probe pin.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: March 24, 2020
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Patent number: 10566217
    Abstract: A drying apparatus includes an oven body, a magnetic field generating device, a chamber pressure controlling device and a baking device. The oven body is provided with a chamber which is air-hermetic for receiving a semiconductor package element. The chamber pressure controlling device reduces a chamber pressure of the chamber. The magnetic field generating device polarizes liquid on the semiconductor package element in the chamber. The baking device evaporates the liquid on the semiconductor package in the chamber.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: February 18, 2020
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTORING CO., LTD.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Patent number: 10502775
    Abstract: A carrying device includes a main body, a grasping portion, a heat-exchanging module and a gas chamber device. The grasping portion is connected to the main body for grasping a semiconductor element. The heat-exchanging module is disposed on the main body. The gas chamber device includes a case body and a gas. The case body is disposed between the grasping portion and the heat-exchanging module, and has a closed chamber therein. The gas fills the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, in which a specific heat capacity of the gas is about between 5000 J/(kg·K)-15000 J/(kg·K).
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: December 10, 2019
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Publication number: 20190304810
    Abstract: A drying apparatus includes an oven body, a magnetic field generating device, a chamber pressure controlling device and a baking device. The oven body is provided with a chamber which is air-hermetic for receiving a semiconductor package element. The chamber pressure controlling device reduces a chamber pressure of the chamber. The magnetic field generating device polarizes liquid on the semiconductor package element in the chamber. The baking device evaporates the liquid on the semiconductor package in the chamber.
    Type: Application
    Filed: June 21, 2018
    Publication date: October 3, 2019
    Inventors: Chih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG
  • Patent number: 10274516
    Abstract: A probe loader device includes a carrier board, a three-dimensional stepped structure and a probe module having a plurality of probe pin layers separately stacked together in three-dimensional stepped structure. The three-dimensional stepped structure is connected to the carrier board. Each of the probe pin layers includes a plurality of cantilever probes. The cantilever probes respectively extend outwards from different steps of the three-dimensional stepped structure, and physical touch a plurality of electrical contacts of a DUT. A portion of each of the cantilever probes extending outwards from the three-dimensional stepped structure has a moment length, and the moment lengths of the cantilever probes of the different probe pin layers are the same.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: April 30, 2019
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Publication number: 20190064247
    Abstract: A carrying device includes a main body, a grasping portion, a heat-exchanging module and a gas chamber device. The grasping portion is connected to the main body for grasping a semiconductor element. The heat-exchanging module is disposed on the main body. The gas chamber device includes a case body and a gas. The case body is disposed between the grasping portion and the heat-exchanging module, and has a closed chamber therein. The gas fills the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, in which a specific heat capacity of the gas is about between 5000 J/(kg·K)-15000 J/(kg·K).
    Type: Application
    Filed: November 16, 2017
    Publication date: February 28, 2019
    Inventors: Chih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG
  • Publication number: 20190064258
    Abstract: A testing system for semiconductor package components includes a testing circuit board, a test socket, at least one probe pin and a thermal barrier layer element. The testing circuit board has at least one electrical contact. The test socket is used to receive a DUT. The probe pin is located on the test socket for contacting with the DUT. The thermal barrier layer element is located between the testing circuit board and the test socket, electrically connected to the probe pin and the electrical contact, and thermally isolated the electrical contact from the probe pin.
    Type: Application
    Filed: October 31, 2017
    Publication date: February 28, 2019
    Inventors: Chih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG
  • Patent number: 10154612
    Abstract: An electronic device having active heat dissipation includes a wiring board, a semiconductor package unit, a surrounding unit, a fan module and a tube member. The semiconductor package unit is soldered to the wiring board through three-dimensional contacts. The surrounding unit is connected to the wiring board and the semiconductor package unit, and surrounds the three-dimensional contacts, such that a heat exchange space is collectively defined by the surrounding unit, the wiring board and the semiconductor package unit. The surrounding unit is provided with two openings which are in communication with the heat exchange space. The fan module is located outside the heat exchange space, and is connected to one of the openings.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: December 11, 2018
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Min Sun, Chih-Feng Cheng, Chih-Chieh Liao
  • Patent number: 10132835
    Abstract: A probe connector includes a probe body, a flexible sleeve body, a slit and a conductive fluid. The flexible sleeve body is connected to the probe body. The conductive fluid is received in the flexible sleeve body and electrically connected to the slit and the probe body. The slit is formed on one end of the flexible sleeve body opposite to the probe body, so as to define petal portions which are configured to be tightly closed together. When the slit is pressed to separate the petal portions, a portion of the conductive fluid seeps up from the flexible sleeve body via the slit.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: November 20, 2018
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Publication number: 20180321278
    Abstract: A probe loader device includes a carrier board, a three-dimensional stepped structure and a probe module having a plurality of probe pin layers separately stacked together in three-dimensional stepped structure. The three-dimensional stepped structure is connected to the carrier board. Each of the probe pin layers includes a plurality of cantilever probes. The cantilever probes respectively extend outwards from different steps of the three-dimensional stepped structure, and physical touch a plurality of electrical contacts of a DUT. A portion of each of the cantilever probes extending outwards from the three-dimensional stepped structure has a moment length, and the moment lengths of the cantilever probes of the different probe pin layers are the same.
    Type: Application
    Filed: July 10, 2017
    Publication date: November 8, 2018
    Inventors: Chih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG
  • Patent number: 10048290
    Abstract: A probe card device includes a testing circuitry board, a flexible probe needle, a first solder portion, a second solder portion and an interconnected holder electrically connected to the testing circuitry board and the flexible probe needle in which one end of the interconnected holder is coupled to the flexible probe needle with the first solder portion, and the other end of the interconnected holder is coupled to a conductive pad of the testing circuitry board with the second solder portion. A first desoldering melting point of the first solder portion is higher than a second desoldering melting point of the second solder portion.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: August 14, 2018
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Patent number: 10041817
    Abstract: An embodiment of the present disclosure provides a damping component. The damping component includes a housing, at least one sliding piece, a fluid, and at least one damping elastomer. The housing may have at least one opening. The sliding piece slidably seals the opening, and partially protrudes outside the opening, to form an accommodation space within the housing. The fluid can fill up the accommodation space. The damping elastomer can be disposed inside the accommodation space.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: August 7, 2018
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Publication number: 20180087936
    Abstract: A damping component includes a housing, at least one sliding piece, a fluid, and at least one damping elastomer. The housing may have at least one opening. The sliding piece is slidably sealed the opening, and partially protruded outside the opening, to form an accommodation space within the housing. The fluid can fill up the accommodation space. The damping elastomer can be disposed inside the accommodation space.
    Type: Application
    Filed: January 4, 2017
    Publication date: March 29, 2018
    Inventors: Chih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG
  • Publication number: 20180038892
    Abstract: A probe connector includes a probe body, a flexible sleeve body, a slit and a conductive fluid. The flexible sleeve body is connected to the probe body. The conductive fluid is received in the flexible sleeve body and electrically connected to the slit and the probe body. The slit is formed on one end of the flexible sleeve body opposite to the probe body, so as to define petal portions which are configured to be tightly closed together. When the slit is pressed to separate the petal portions, a portion of the conductive fluid seeps up from the flexible sleeve body via the slit.
    Type: Application
    Filed: October 19, 2016
    Publication date: February 8, 2018
    Inventors: Chih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG
  • Publication number: 20170269126
    Abstract: A probe card device includes a testing circuitry board, a flexible probe needle, a first solder portion, a second solder portion and an interconnected holder electrically connected to the testing circuitry board and the flexible probe needle in which one end of the interconnected holder is coupled to the flexible probe needle with the first solder portion, and the other end of the interconnected holder is coupled to a conductive pad of the testing circuitry board with the second solder portion. A first desoldering melting point of the first solder portion is higher than a second desoldering melting point of the second solder portion.
    Type: Application
    Filed: July 12, 2016
    Publication date: September 21, 2017
    Inventors: Chih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG
  • Patent number: 9678110
    Abstract: A probe card includes a circuit board, a plurality of probes, and at least one deviation-compensating member. An end of each of the probes is connected to the circuit board. The deviation-compensating member is fixed to the circuit board and connected to the probes. The probes have a first thermal expansion characteristic, the deviation-compensating member has a second thermal expansion characteristic, and the first thermal expansion characteristic and the second thermal expansion characteristic are different.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: June 13, 2017
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
  • Publication number: 20170052218
    Abstract: A testing apparatus includes a substrate and a testing unit. The testing unit includes a testing pin, in which the testing pin is strip-shaped and has a connecting portion, a first end, and a second end. The first end and the second end of the testing pin are opposite to each other. The first end and the second end are connected to the substrate. The connecting portion is located between the first end and the second end, and the connecting portion protrudes from the substrate to become arc-shaped.
    Type: Application
    Filed: January 7, 2016
    Publication date: February 23, 2017
    Inventors: Chih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG