Patents by Inventor Yu Muronoi

Yu Muronoi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11202373
    Abstract: A connector device that includes a circuit board; a connector attached to the circuit board; and a molded resin that covers the entire circuit board and part of the connector, wherein: a housing of the connector contains a resin material and fibrous inorganic fillers, a groove is formed in a region of a surface of the housing that is covered with the molded resin, the groove being formed by removing the resin material with the inorganic fillers remaining, and extending in a direction that intersects a mounting direction in which a counterpart connector is to be mounted to the connector, the groove has a depth and a width in a range from 50 ?m to 150 ?m inclusive, and the groove is filled with the molded resin.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: December 14, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yu Muronoi, Naomichi Kawashima, Tatsuo Hirabayashi, Seiji Hashimoto, Iori Kobayashi, Yoshiaki Kado
  • Patent number: 11153974
    Abstract: A connector device that includes a circuit board; a connector attached to the circuit board; a plurality of collars for external attachment; a first molded resin that is made of a first resin material whose melting point or softening point is 230° C. or less, and covers the entire circuit board and part of the connector; and a second molded resin that is welded to the first molded resin, is made of a second resin material whose melting point or softening point is higher than that of the first resin material for the first molded resin, and covers outer circumferences of the collars.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: October 19, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yu Muronoi, Naomichi Kawashima, Masayuki Kato, Takeo Uchino, Akihiko Matsuoka, Tatsuo Hirabayashi
  • Publication number: 20200315027
    Abstract: A connector device that includes a circuit board; a connector attached to the circuit board; a plurality of collars for external attachment; a first molded resin that is made of a first resin material whose melting point or softening point is 230° C. or less, and covers the entire circuit board and part of the connector; and a second molded resin that is welded to the first molded resin, is made of a second resin material whose melting point or softening point is higher than that of the first resin material for the first molded resin, and covers outer circumferences of the collars.
    Type: Application
    Filed: March 13, 2020
    Publication date: October 1, 2020
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yu MURONOI, Naomichi KAWASHIMA, Masayuki KATO, Takeo UCHINO, Akihiko MATSUOKA, Tatsuo HIRABAYASHI
  • Publication number: 20200315026
    Abstract: A connector device that includes a circuit board; a connector attached to the circuit board; and a molded resin that covers the entire circuit board and part of the connector, wherein: a housing of the connector contains a resin material and fibrous inorganic fillers, a groove is formed in a region of a surface of the housing that is covered with the molded resin, the groove being formed by removing the resin material with the inorganic fillers remaining, and extending in a direction that intersects a mounting direction in which a counterpart connector is to be mounted to the connector, the groove has a depth and a width in a range from 50 ?m to 150 ?m inclusive, and the groove is filled with the molded resin.
    Type: Application
    Filed: March 12, 2020
    Publication date: October 1, 2020
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yu MURONOI, Naomichi KAWASHIMA, Tatsuo HIRABAYASHI, Seiji HASHIMOTO, Iori KOBAYASHI, Yoshiaki KADO
  • Publication number: 20200313345
    Abstract: A connector device that includes: a circuit board; a connector attached to the circuit board; and a molded resin that covers the entire circuit board and part of the connector, wherein: a housing of the connector is made of a liquid crystal polymer or a poly phenylene sulfide resin, and the molded resin is made of a polyamide resin or a polyester resin whose melting point or softening point is 230° C. or less.
    Type: Application
    Filed: March 12, 2020
    Publication date: October 1, 2020
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yu MURONOI, Naomichi KAWASHIMA, Tatsuo HIRABAYASHI, Seiji HASHIMOTO, Iori KOBAYASHI, Yoshiaki KADO
  • Publication number: 20190352539
    Abstract: Provided is an connection structure (1) with which the adhesive power between an adhesive agent layer (2) and a connector (3) can be increased, and which maintains high waterproof reliability over a long period of use. The connection structure (1) comprises an adhesive agent layer (2), and a connector (3) including an adhesive surface (30) in contact with a layer surface of the adhesive agent layer (2). The adhesive surface (30) includes a surface irregularity portion (31) having a recess (311) and a protrusion (312). A part of the adhesive agent layer (2) is disposed in the recess (311). The connection structure (1) may be configured to include a fibrous material (5) traversing the recess (311). The connector (3) may be configured from an engineering plastic.
    Type: Application
    Filed: January 10, 2018
    Publication date: November 21, 2019
    Inventors: Yu Muronoi, Takashi Takada, Kazumasa Kobayashi
  • Patent number: 10154590
    Abstract: Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: December 11, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tou Chin, Yu Muronoi
  • Publication number: 20180049316
    Abstract: A circuit structure that has a high rigidity, has high cooling performance for an electronic component, and can reduce electrical resistance between the electronic component and a bus bar. The circuit structure has a circuit board, bus bars, a binding material, metal chips, and electronic components. The circuit board has opening portions that penetrate in the thickness direction. The bus bars are overlaid on the circuit board. The binding material is interposed between the circuit board and the bus bars and binds them. The metal chips are arranged inside the opening portions and also placed on the bus bars. The metal chips each have a top face, which is located in approximately the same plane as an opening end face of an opening portion, and a bottom face, approximately the entire surface of which is joined to a bus bar. The electronic components are soldered to the circuit board and the top faces of the metal chips.
    Type: Application
    Filed: March 15, 2016
    Publication date: February 15, 2018
    Inventors: Yu MURONOI, Tou CHIN
  • Publication number: 20170354037
    Abstract: Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.
    Type: Application
    Filed: December 8, 2015
    Publication date: December 7, 2017
    Inventors: Tou Chin, Yu Muronoi