Abstract: A surface antenna formation method to form an antenna on the surface of an antenna carrier economically by means of spraying a conducting paint into a patterned opening of a shield being covered on the antenna carrier and then employing a laser etching technique to remove burrs from the border of the antenna thus formed on the surface of the antenna carrier after removal of the shield.

Abstract: A method of manufacturing antenna by laser carving comprising the following steps: to attach metal material such as copper, silver etc. onto the base plate by a method of conductive coating by spraying; and then to trim the metal material to complete the shape of an antenna by laser carving. Thereby, the size and shape of the antenna are not limited, and the antenna can be manufactured on a non-planar base plate, thus the height of the entire antenna module can be reduced.

Abstract: A micro stacked type chip antenna, wherein a plurality of elementary layers printed with radiation metallic electrodes are stacked up to allow the radiation metallic electrodes on the elementary layers to electrically connect each with its neighboring ones (one) of the radiation metallic electrodes on its upper one and/or lower one of the elementary layers; and then these elementary layers stacked up are packed in a packing process, a plurality of connecting pins are connected respectively with the radiation metallic electrodes on different elementary layers, the tailing end of each connecting pin is extended out of a packing envelop; by various options of connecting of the connecting pins, resonant frequencies of different band widths can be obtained.

Abstract: A micro stacked type chip antenna, wherein a plurality of elementary layers printed with radiation metallic electrodes are stacked up to allow the radiation metallic electrodes on the elementary layers to electrically connect each with its neighboring ones (one) of the radiation metallic electrodes on its upper one and/or lower one of the elementary layers; and then these elementary layers stacked up are packed in a packing process, a plurality of connecting pins are connected respectively with the radiation metallic electrodes on different elementary layers, the tailing end of each connecting pin is extended out of a packing envelop; by various options of connecting of the connecting pins, resonant frequencies of different band widths can be obtained.