Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.

Abstract: A gene editing system of Candida viswanathii includes a Candida viswanathii, a first gene editing fragment and a second gene editing fragment. The first gene editing fragment successively includes a first homology arm and a screening gene. The second gene editing fragment is connected to a C-terminus of the first gene editing fragment and includes a second homology arm, a Cas9 expression cassette and a sgRNA cassette. The Cas9 expression cassette successively includes a Cas9 promoter, a Cas9 gene and three nuclear localization sequences. The sgRNA cassette successively includes a sgRNA promoter, a first ribozyme, a targeting sequence, a scaffold and a second ribozyme. The first gene editing fragment and the second gene editing fragment are constructed as a linear fragment for gene editing of a chromosome of the Candida viswanathii.

Abstract: A package structure includes a first RDL, an adhesive layer and a first electronic component. Upper bumps and conductive pads are provided on a first upper surface and a first lower surface of the first RDL, respectively. The adhesive layer is located on the first upper surface of the first RDL and surrounds the upper bumps. The first electronic component is mounted on the adhesive layer and includes conductors which are visible from an active surface of the first electronic component and joined to the upper bumps, the active surface of the first electronic component faces toward the first upper surface of the first RDL. Two adhesive surfaces of the adhesive layer are adhered to the first upper surface of the first RDL and the active surface of the first electronic component, respectively.

Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes an insulation layer. A bottom electrode via is disposed in the insulation layer. The bottom electrode via includes a conductive portion and a capping layer over the conductive portion. A barrier layer surrounds the bottom electrode via. A magnetic tunneling junction (MTJ) is disposed over the bottom electrode via.

Abstract: A method includes forming Magnetic Tunnel Junction (MTJ) stack layers, which includes depositing a bottom electrode layer; depositing a bottom magnetic electrode layer over the bottom electrode layer; depositing a tunnel barrier layer over the bottom magnetic electrode layer; depositing a top magnetic electrode layer over the tunnel barrier layer; and depositing a top electrode layer over the top magnetic electrode layer. The method further includes patterning the MTJ stack layers to form a MTJ; and performing a passivation process on a sidewall of the MTJ to form a protection layer. The passivation process includes reacting sidewall surface portions of the MTJ with a process gas comprising elements selected from the group consisting of oxygen, nitrogen, carbon, and combinations thereof.

Abstract: A layout of a semiconductor memory device includes a substrate and a ternary content addressable memory (TCAM). The TCAM is disposed on the substrate and includes a plurality of TCAM bit cells, where at least two of the TCAM bit cells are mirror-symmetrical along an axis of symmetry, and each of the TCAM bit cells includes two storage units electrically connected to two word lines respectively, and a logic circuit electrically connected to the storage units. The logic circuit includes two first reading transistors, and two second reading transistors, where each of the second reading transistors includes a gate and source and drain regions, the source and drain regions of the second reading transistors are electrically connected to two matching lines and the first reading transistors, respectively, where the word lines are disposed parallel to and between the matching lines.

Abstract: Herein disclosed is an optoelectronic unit measuring device comprising an objective lens, an imaging lens, a photographing lens, and a focus adjustment module disposed in a first light path. The objective lens receives a first testing light and converts the first testing into a second testing light. The imaging lens receives the second testing light and converts the second testing light into a third testing light. The photographing lens receives the third testing light and measures beam characteristic. The focus adjustment module selectively provides a first light transmitting member in the first light path, and adjusts the third testing light to focus at a first focus position or a second focus position. Wherein the focus adjustment module comprises a first carrier plate having a first area with the first light transmitting member, and moves the first carrier plate to selectively align the first area with the first light path.

Abstract: An optical lens assembly is adapted for receiving a light beam that is emitted by an object, and includes a lens unit and a sleeve unit. The lens unit includes a casing that has a light-incident side adapted for receiving the light beam. The sleeve unit surrounds the light-incident side of the casing, and defines a light-receiving space that is adapted for the light beam to pass through so that propagation of the light beam is unaffected by disturbance caused by movement of air. An optical measurement method includes steps of: a) providing a lens unit, a sleeve unit, and an object that is for emitting a light beam; and b) operating the lens unit so that the light beam is received by the lens unit.

Abstract: Herein disclosed is an optoelectronic measuring device. The optoelectronic measuring device comprises an objective lens, an imaging lens, a camera, and an optical path adjusting module which are disposed at the first light path. The objective lens receives a first testing light, and transforms the first testing light into a second testing light. The imaging lens receives the second testing light, and transforms the second testing light into a third testing light. The camera measures a beam characteristic of the third testing light. The optical path adjusting module, disposed between the imaging lens and the camera, comprises a mirror, the mirror moves relatively to the imaging lens according to a test command, and adjusts the distance between the imaging lens and the camera at the first light path to be a first optical distance or a second optical distance. Wherein the mirror reflects the third testing light vertically.

Abstract: This invention provides an air disinfecting device for disinfecting or decontaminate air, which comprises a first metal plate and a second metal plate opposite to the first metal plate, a UVC LED mounted on the first metal plate, and a power supply providing power to the UVC LED. The second metal plate has an area large enough such that lights emitted from the UVC LED will be enclosed inside the air disinfection device.

Abstract: This invention provides an air disinfecting device for disinfecting or decontaminate air, which comprises a first metal plate and a second metal plate opposite to the first metal plate, a UVC LED mounted on the first metal plate, and a power supply providing power to the UVC LED. The second metal plate has an area large enough such that lights emitted from the UVC LED will be enclosed inside the air disinfection device.

Abstract: A separate microscopy system, applied to observe a specimen positioned on a stage and further to image the specimen on an imaging device, includes an ocular-lens unit, an adjustment unit and an objective-lens unit. The ocular-lens unit has an ocular-lens optical axis, and is manipulated to make the ocular-lens optical axis perpendicular to the stage. The adjustment unit is assembled to a side of the ocular-lens unit close to the stage. The objective-lens unit has an objective-lens optical axis, and is assembled to a side of the adjustment unit close to the stage. The objective-lens unit is manipulated to be adjusted by the adjustment unit to make the ocular-lens optical axis, the objective-lens optical axis and the imaging device co-axially and perpendicular to the stage, such that the specimen can be imaged at an imaging center position of the imaging device. In addition, an adjusting method thereof is also provided.

Abstract: An optical system includes a collimated light source, a beam splitter, two mirrors and two lenses, a focus lens, and a detector. An initial light beam is generated by the light source and then separated by the beam splitter into a first light beam and a second light beam. The two mirrors respectively direct the first and second light beams on a sample with symmetrical paths and the two lenses focus the first and second light beam on the sample respectively. The first and second light beams are reflected from the sample and along the counterpart paths to the beam splitter. An interfered light beam is then generated by combining the reflected first and second light beams, and focused by a focus lens on a detector. A Dove prism can be configured between one mirror and one lens of the two for contrast enhancement. It can produce the photon combination with same of direction in this setup to enhance contrast.

Abstract: An optical system includes a collimated light source, a beam splitter, two mirrors and two lenses, a focus lens, and a detector. An initial light beam is generated by the light source and then separated by the beam splitter into a first light beam and a second light beam. The two mirrors respectively direct the first and second light beams on a sample with symmetrical paths and the two lenses focus the first and second light beam on the sample respectively. The first and second light beams are reflected from the sample and along the counterpart paths to the beam splitter. An interfered light beam is then generated by combining the reflected first and second light beams, and focused by a focus lens on a detector. A Dove prism can be configured between one mirror and one lens of the two for contrast enhancement. It can produce the photon combination with same of direction in this setup to enhance contrast.

Abstract: Herein disclosed is an optoelectronic unit measuring device comprising an objective lens, an imaging lens, a photographing lens, and a focus adjustment module disposed in a first light path. The objective lens receives a first testing light and converts the first testing into a second testing light. The imaging lens receives the second testing light and converts the second testing light into a third testing light. The photographing lens receives the third testing light and measures beam characteristic. The focus adjustment module selectively provides a first light transmitting member in the first light path, and adjusts the third testing light to focus at a first focus position or a second focus position. Wherein the focus adjustment module comprises a first carrier plate having a first area with the first light transmitting member, and moves the first carrier plate to selectively align the first area with the first light path.

Abstract: Herein disclosed is an optoelectronic measuring device. The optoelectronic measuring device comprises an objective lens, an imaging lens, a camera, and an optical path adjusting module which are disposed at the first light path. The objective lens receives a first testing light, and transforms the first testing light into a second testing light. The imaging lens receives the second testing light, and transforms the second testing light into a third testing light. The camera measures a beam characteristic of the third testing light. The optical path adjusting module, disposed between the imaging lens and the camera, comprises a mirror, the mirror moves relatively to the imaging lens according to a test command, and adjusts the distance between the imaging lens and the camera at the first light path to be a first optical distance or a second optical distance. Wherein the mirror reflects the third testing light vertically.

Abstract: A probe pin alignment apparatus includes a beam-splitting element, an image-sensing device and a light-reflecting element. The beam-splitting element has a first illuminating surface facing a probe element, a second illuminating surface facing an object, and a light incident surface. The beam-splitting element has a semi-reflective surface for reflecting a light beam from the light incident surface to the probe element. The image-sensing device is disposed externally to the light incident surface of the beam-splitting element. The light-reflecting element, disposed oppositely to the light incident surface, allows a light beam to pass through the semi-reflective surface to be reflected back to the semi-reflective surface to be further projected onto the object. The beam-splitting element outputs a probe image and an object image from the first and second illuminating surfaces through the light incident surface.

Abstract: A separate microscopy system, applied to observe a specimen positioned on a stage and further to image the specimen on an imaging device, includes an ocular-lens unit, an adjustment unit and an objective-lens unit. The ocular-lens unit has an ocular-lens optical axis, and is manipulated to make the ocular-lens optical axis perpendicular to the stage. The adjustment unit is assembled to a side of the ocular-lens unit close to the stage. The objective-lens unit has an objective-lens optical axis, and is assembled to a side of the adjustment unit close to the stage. The objective-lens unit is manipulated to be adjusted by the adjustment unit to make the ocular-lens optical axis, the objective-lens optical axis and the imaging device co-axially and perpendicular to the stage, such that the specimen can be imaged at an imaging center position of the imaging device. In addition, an adjusting method thereof is also provided.

Abstract: A probe pin alignment apparatus includes a beam-splitting element, an image-sensing device and a light-reflecting element. The beam-splitting element has a first illuminating surface facing a probe element, a second illuminating surface facing an object, and a light incident surface. The beam-splitting element has a semi-reflective surface for reflecting a light beam from the light incident surface to the probe element. The image-sensing device is disposed externally to the light incident surface of the beam-splitting element. The light-reflecting element, disposed oppositely to the light incident surface, allows a light beam to pass through the semi-reflective surface to be reflected back to the semi-reflective surface to be further projected onto the object. The beam-splitting element outputs a probe image and an object image from the first and second illuminating surfaces through the light incident surface.