Abstract: Method of fabricating package substrates includes providing a substrate including a capacitance layer sandwiched between first patterned circuits and second patterned circuit, in which a gap is formed between adjacent two of the first patterned circuits, and exposed a first region of the capacitance layer, and the second patterned circuit is overlapped with the first region; removing a part of the capacitance layer within the first region, to form an opening communicated with the gap; forming a dielectric layer from a side of the capacitance layer disposed with the first patterned circuits to fill up the gap and the opening; and removing a part of the dielectric layer within the gap and the opening to form a through hole to expose a part of the second patterned circuit, the remaining part of the first dielectric layer covers the capacitance layer and the first patterned circuits.

Abstract: A method for fabricating a carrier is disclosed, wherein the carrier is applied for a microelectromechanical sensing device. The method includes the steps of: providing a first substrate, wherein the first substrate includes a first metal layer, a first dielectric layer, and a first opening; providing a second substrate, wherein the second substrate includes a second metal layer, a second dielectric layer, and a second opening; providing a reticular element; pressing the first substrate, the reticular element, and the second substrate to form a composite substrate, wherein the first opening and the second opening form a hole, and the reticular element is positioned in the hole; and forming at least one conductive via in the composite substrate.