Patents by Inventor Yu Yuan

Yu Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210320406
    Abstract: An antenna system and an electronic device are provided. The antenna system includes a first substrate, a first antenna group, and a second antenna group. The first antenna group includes four first antennas that are disposed on a peripheral area of the first substrate. The second antenna group includes four second antennas that are disposed in an array on a second substrate. The four second antennas of the second antenna group are disposed above a central area of the first substrate. The central area of the first substrate has a recess. The second substrate is disposed above the recess. A first predetermined distance is defined between a bottom of the second substrate and the recess of the first substrate. A second predetermined distance is defined between the second substrate and the first substrate. The first predetermined distance is greater than the second predetermined distance.
    Type: Application
    Filed: August 11, 2020
    Publication date: October 14, 2021
    Inventors: CHIEN-HUNG CHEN, CHIH-HSIN WU, YU-YUAN GUO
  • Patent number: 11134707
    Abstract: The invention is directed to a nanostructured composite material comprising a mixture of at least one metal particle such as iron and a carbon material from biomass such as D-glucose, D-glucosamine hydrochloride or a-cyclodextrin. The invention is also directed to a composition comprising the composite material comprising the composite material and an inorganic salt, and a method for synthesizing the composite material comprising immersing the carbon material into a solution of metal ions, drying the impregnated carbon particle and subjecting the impregnated carbon particle to a carbothermal reduction process. The nanostructured composite material is useful as an oxygen scavenging layer in a multi-layer film which comprises the oxygen scavenging layer and an oxygen barrier layer that retards the permeation of oxygen from an external environment.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: October 5, 2021
    Assignees: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH, NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Xu Li, Yu Yuan Chieng, Siew Yee Wong, Suxi Wang, Jen-Yi Huang, Weibiao Zhou
  • Patent number: 11117917
    Abstract: Disclosed herein is a modular composition comprising 1) an oligonucleotide; 2) one or more tetraGalNAc ligands of Formula (I), which may be the same or different; optionally, 3) one or more linkers, which may be the same or different; 4) one or more peptides independently selected from Table 3, which may be the same or different; and optionally, 5) one or more targeting ligands, solubilizing agents, pharmacokinetics enhancing agents, lipids, and/or masking agents.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: September 14, 2021
    Assignee: Sirna Therapeutics, Inc.
    Inventors: David Tellers, Steven L. Colletti, Vadim Dudkin, Jeffrey Aaronson, Aaron Momose, Thomas Joseph Tucker, Yu Yuan, Kathleen B. Calati, Lu Tian, Rubina G. Parmar, Anthony W. Shaw, Weimin Wang, Rachel Anne Storr, Marina Busuek, Robert A. Kowtoniuk
  • Patent number: 11107791
    Abstract: A semiconductor package structure includes a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant and an upper semiconductor chip. The first semiconductor chip is electrically connected to the conductive structure. The first semiconductor chip includes at least one first conductive element disposed adjacent to a second surface thereof. The second semiconductor chip is electrically connected to the conductive structure and disposed next to the first semiconductor chip. The second semiconductor chip includes at least one second conductive element disposed adjacent to a second surface thereof. The first encapsulant is disposed on the conductive structure to cover the first semiconductor chip and the second semiconductor chip. The first conductive element and the second conductive element are exposed from the first encapsulant.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: August 31, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Fan-Yu Min, Chao-Hung Weng, Wei-Hang Tai, Chen-Hung Lee, Yu-Yuan Yeh
  • Patent number: 11070527
    Abstract: A protected link between a first computing device and a second computing device is set up, wherein communication over the protected link is to comply with a communication protocol that allows packets to be reordered during transit. A plurality of packets are generated according to a packet format that ensures the plurality of packets will not be reordered during transmission over the protected link, the plurality of packets comprising a first packet and a second packet. Data of the plurality of packets are encrypted for transmission over the protected link, wherein data of the first packet is encrypted based on the cryptographic key and a first value of a counter and data of the second packet is encrypted based on the cryptographic key and a second value of the counter.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: July 20, 2021
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Raghunandan Makaram, Ioannis T. Schoinas, Kapil Sood, Yu-Yuan Chen, Vedvyas Shanbhogue, Siddhartha Chhabra, Reshma Lal, Reouven Elbaz
  • Publication number: 20210202340
    Abstract: A semiconductor device package structure includes a substrate. The substrate has a circuit structure formed in a die region. The die region is defined by a plurality of scribe lines configured on the substrate. A seal ring is disposed in the substrate and located at a periphery region of the die region, and surrounds at least a portion of the circuit structure. A trench ring is disposed in the substrate between the seal ring and the scribe lines. A packaging passivation cap layer covers over the circuit structure and the seal ring, and covers at least the trench ring.
    Type: Application
    Filed: February 3, 2020
    Publication date: July 1, 2021
    Applicant: United Microelectronics Corp.
    Inventors: YU-YUAN HUANG, Tsung-Kai Yu, Chen-Hsiao Wang, Kai-Kuang Ho, Kuang-Hui Tang
  • Patent number: 11048800
    Abstract: In one embodiment, an apparatus comprises a processor to: receive a request to configure a secure execution environment for a first workload; configure a first set of secure execution enclaves for execution of the first workload, wherein the first set of secure execution enclaves is configured on a first set of processing resources, wherein the first set of processing resources comprises one or more central processing units and one or more accelerators; configure a first set of secure datapaths for communication among the first set of secure execution enclaves during execution of the first workload, wherein the first set of secure datapaths is configured over a first set of interconnect resources; configure the secure execution environment for the first workload, wherein the secure execution environment comprises the first set of secure execution enclaves and the first set of secure datapaths.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: June 29, 2021
    Assignee: Intel Corporation
    Inventors: Kapil Sood, Ioannis T. Schoinas, Yu-Yuan Chen, Raghunandan Makaram, David J. Harriman, Baiju Patel, Ronald Perez, Matthew E. Hoekstra, Reshma Lal
  • Patent number: 11020447
    Abstract: Disclosed herein are methods for treating type II diabetes mellitus. In particular, the present invention relates to methods of using an extract of Hedychium coronarium Koenig and a blood glucose reduction agent, to synergistically reduce the blood glucose level of the subject having type II diabetes mellitus.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: June 1, 2021
    Assignee: VITNOVO, INC.
    Inventors: Pei-Ran Wang, Rey-Yuh Wu, Yu-Yuan Wu, Lung-Yu Kuan, Klim King
  • Patent number: 11009534
    Abstract: Embodiments of the present invention relate to water leakage detection. Data obtained by a smart electricity meter during a predefined time period is collected, where the smart electricity meter is associated with a water-consuming unit. Usages of certain electric appliances in the water-consuming unit during the predefined time period are determined based on the collected data. The electricity consumption of those appliances is correlated to water consumption. The legitimate water consumption of the water-consuming unit during the predefined time period is then determined based on the usages of the electric appliances.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: May 18, 2021
    Assignee: International Business Machines Corporation
    Inventors: Xing Xing Di, Kai Guo, Peng Tang, Chen Tian, Jian Wang, Chi Xu, Yu Yuan
  • Publication number: 20210139537
    Abstract: The present invention discloses a polypeptide compound, a pharmaceutical composition, and a preparation method and use thereof. The structural formula of the polypeptide compound is shown in general formula (I): Such polypeptide compounds as ?-opioid receptor agonists have the advantages of better activity and the potential to become clinical candidate compounds.
    Type: Application
    Filed: November 9, 2020
    Publication date: May 13, 2021
    Applicant: CHENGDU SINTANOVO BIOTECHNOLOGY CO., LTD.
    Inventors: Jian GAO, Xiaoping FU, Guoqing ZHONG, Haibo ZHOU, Hai HU, Xi HU, Yu YUAN, Yuanbo LI
  • Publication number: 20210111201
    Abstract: An image sensor structure including: a substrate, having a first conductive type; a first well region and a second well region disposed in the substrate and spaced apart; an isolation region disposed in the first well region; a gate disposed on the substrate and between the first well region and the second well region; and a pinned photodiode disposed in the substrate and between the first well region and the second well region is provided. The pinned photodiode includes: a first doping region disposed in the substrate and having a first doping concentration and the first conductive type; and a second doping region disposed on the first doping region and having a second doping concentration opposite to the first conductive type. One or both of the first doping region and the second doping region is non-uniform and the first doping concentration is greater than the second doping concentration.
    Type: Application
    Filed: May 14, 2020
    Publication date: April 15, 2021
    Inventors: Ming-Xiang LI, Bo-Ray LEE, Yu-Yuan YAO
  • Patent number: 10934442
    Abstract: The present invention provides a coating composition comprising a) a metal complex comprising an organic acid or anion thereof coordinated to a metal ion; and b) a polymer, wherein there is no covalent bond between said metal complex and the polymer.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: March 2, 2021
    Assignee: Agency for Science, Technology and Research
    Inventors: Yun Zong, Xu Li, T.S. Andy Hor, Regina Lum, Yu Yuan Chieng
  • Publication number: 20200365826
    Abstract: The present disclosure provides a flexible display panel, a method for packaging the same, and a display device. The flexible display panel includes: a flexible substrate; a display element arranged on the flexible substrate; and a packaging layer covering the display element, the packaging layer including an inorganic thin film and an organic thin film that are stacked alternately, in which two protrusion structures that are engaged with each other are arranged between at least two adjacent thin films of the packaging layer.
    Type: Application
    Filed: October 12, 2019
    Publication date: November 19, 2020
    Applicants: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xiaodong MENG, Lingling MA, Zihua LI, Zhibo WEN, Hengbo LIU, Yu YUAN, Lu CAI, Dong XU, Guofang XU, Xinpeng GAO, Qiang WANG, Ruiqing ZHANG, Qiang GUO, Wenqiang JIN, Xudong WANG
  • Patent number: 10838758
    Abstract: Disclosed is a system comprising a physical memory, a processor and a software component. The software component includes a policy/domain handler for receiving data and a policy associated with the data; a hypervisor; and a file management module. The file management module receives a request from a third-party application to interact with a data file containing the data; sends an authorization and tag request to the policy/domain handler to check if the user and application are permitted to access the data, and if permitted, to generate hardware tags for the data file; and sends a secure data request to the hypervisor to create a secure data compartment for the data file and the hardware tags. Based on the authorization and tag request, and the security policy associated with the data, the policy/domain handler generates the hardware tags for the data file.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: November 17, 2020
    Assignee: Teleputers, LLC
    Inventors: Ruby B. Lee, Pramod A. Jamkhedkar, Yu-Yuan Chen
  • Publication number: 20200341489
    Abstract: Disclosed is a self-driving-golf-cart driving path central controlling device comprising a self-driving-golf-cart driving path determining module, a self-driving-golf-cart driving path excluding module and a central controlling module, the self-driving-golf-cart driving path central controlling device determines, from a plurality of self-driving-golf-cart driving paths, an individual self-driving-golf-cart driving path for each self-driving-golf-cart and controls each self-driving-golf-cart to drive, in a self-driving manner, on the individual self-driving-golf-cart driving path which is determined for said each self-driving golf-cart.
    Type: Application
    Filed: August 8, 2019
    Publication date: October 29, 2020
    Applicant: SUNRISE RESORT, INC.
    Inventors: Tien-Ya HSU, You-Peng JHANG, Yu-Yuan HSIEH, Yu-Jun HUANG
  • Patent number: 10804761
    Abstract: The present disclosure provides a rotor mechanism includes a rotor core and a plurality of rotor bars. The rotor core has a plurality of insertion slots arranged along an edge of the rotor core. Each of the plurality of rotor bars has an insertion portion and two protruding portions. The insertion portions are respectively located in the plurality of insertion slots, wherein in each of the plurality of rotor bars, the two protruding portions are respectively connected to two opposite ends of the insertion portion and respectively protrude from two opposite sides of the rotor core, and the two protruding portions each has an extension direction, that has an angle with respect to an extension direction of the insertion portion, in order to clamp and fix the rotor core therebetween. In addition, the present disclosure also provides a method for manufacturing the rotor mechanism.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: October 13, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Hsun Wu, Ming-Mao Hsu, Yu-Yuan Chen
  • Publication number: 20200299477
    Abstract: This invention relates to a one-step process for making a polymer composite suspension for coating plastic films characterized in that a first polymer is synthesized in-situ optionally in the presence of other polymers and in the presence of clay. Preferably the polymer composite suspension comprises a) 1.0 to 11.0 wt % of clay or silane modified clay, b) 0.1 to 10.0) wt % of poly (acrylic acid), which is a copolymer of acrylic acid (AA) with at least one other monomer selected from 2-ethylhexyl acrylate (EHA), ?-carboxyethyl acrylate (?-CEA), methacrylamidoethyl ethylene urea (WAM II) and ethoxylated behenyl methacrylate (?-FM), c) 1.0 to 15.0 wt % of other polymers, preferably poly (vinyl alcohol) and d) 70 to 97 wt % of water or mixture of water with 2-propanol. The coating films made from the suspensions show good barrier capabilities against water vapor and oxygen can be used to make barrier layers on or within plastic films for packaging applications.
    Type: Application
    Filed: June 3, 2020
    Publication date: September 24, 2020
    Inventors: Xu LI, Yu Yuan Chieng, Siew Yee Wong, Xikui Zhang
  • Publication number: 20200294964
    Abstract: A semiconductor package structure includes a conductive structure, a first semiconductor chip, a second semiconductor chip, a first encapsulant and an upper semiconductor chip. The first semiconductor chip is electrically connected to the conductive structure. The first semiconductor chip includes at least one first conductive element disposed adjacent to a second surface thereof. The second semiconductor chip is electrically connected to the conductive structure and disposed next to the first semiconductor chip. The second semiconductor chip includes at least one second conductive element disposed adjacent to a second surface thereof. The first encapsulant is disposed on the conductive structure to cover the first semiconductor chip and the second semiconductor chip. The first conductive element and the second conductive element are exposed from the first encapsulant.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 17, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Fan-Yu MIN, Chao-Hung WENG, Wei-Hang TAI, Chen-Hung LEE, Yu-Yuan YEH
  • Patent number: 10726805
    Abstract: A display driving apparatus applied to a panel is disclosed. The panel displays a first image with a first refresh rate. A first refresh cycle corresponding to the first refresh rate includes a refresh period and at least one non-refresh period. The display driving apparatus includes a real-time determination module and a data processing module. The real-time determination module is coupled to the panel and used to immediately determine whether the panel wants to replace the originally displayed first image with a second image during the first refresh cycle. The data processing module is coupled to the real-time determination module and the panel. If a determination result of the real-time determination module is yes, the data processing module immediately controls the panel to start to display the second image at a first time during the first refresh cycle.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: July 28, 2020
    Assignee: Raydium Semiconductor Corporation
    Inventors: Chih Chuan Huang, Yu-Yuan Chang, Wen-Fa Hsu
  • Publication number: 20200231424
    Abstract: A cold brew coffee extraction device includes a container having a first chamber for receiving cold water. A filtering cup is mounted in the first chamber and includes a second chamber intercommunicating with the first chamber. The second chamber receives coffee powders and includes a second opening. The filtering cup further includes a third opening at a lower end thereof and receiving a filter. A first guiding tube includes a first end intercommunicating with the second chamber and a second end located outside of the container. A pump is disposed outside of the container and is connected to the second end of the first guiding tube. A controller is electrically connected to the pump to control operation of the pump to thereby supply air into or suck air out of the first guiding tube, thereby controlling a water level of the cold water in the first chamber.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 23, 2020
    Inventor: Yu-Yuan Lin