Patents by Inventor Yuan-Hung Hsu

Yuan-Hung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220080057
    Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.
    Type: Application
    Filed: November 24, 2021
    Publication date: March 17, 2022
    Inventors: Wen-Yuan Hsieh, Yuan-Hung Hsu, Chia-Wen Huang, Ming-Cheng Wei, Chih-Lung Chen, Shian-Jy Wang
  • Publication number: 20210320076
    Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate. Therefore, the arrangement of the bump body and the metal auxiliary layer allows complete reaction of the IMCs after reflowing the solder layer, and the volume of the conductive structures will not continue to shrink. As such, the problem of cracking of the conductive structures can be effectively averted.
    Type: Application
    Filed: July 7, 2020
    Publication date: October 14, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Publication number: 20210287962
    Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.
    Type: Application
    Filed: May 12, 2020
    Publication date: September 16, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Patent number: 11102890
    Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: August 24, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ying-Chang Tseng, Yuan-Hung Hsu, Chang-Fu Lin
  • Patent number: 11069661
    Abstract: An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: July 20, 2021
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wei-Jhen Chen, Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Publication number: 20210082837
    Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.
    Type: Application
    Filed: May 6, 2020
    Publication date: March 18, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
  • Publication number: 20210068260
    Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.
    Type: Application
    Filed: November 2, 2020
    Publication date: March 4, 2021
    Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Patent number: 10863626
    Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: December 8, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Publication number: 20200360287
    Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 19, 2020
    Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
  • Publication number: 20200258871
    Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.
    Type: Application
    Filed: April 23, 2020
    Publication date: August 13, 2020
    Inventors: Han-Hung Chen, Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang
  • Publication number: 20200093006
    Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.
    Type: Application
    Filed: November 27, 2018
    Publication date: March 19, 2020
    Inventors: Ying-Chang Tseng, Yuan-Hung Hsu, Chang-Fu Lin
  • Publication number: 20190247522
    Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.
    Type: Application
    Filed: November 29, 2018
    Publication date: August 15, 2019
    Inventors: Wen-Yuan Hsieh, Yuan-Hung Hsu, Chia-Wen Huang, Ming-Cheng Wei, Chih-Lung Chen, Shian-Jy Wang
  • Publication number: 20180288886
    Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.
    Type: Application
    Filed: January 9, 2018
    Publication date: October 4, 2018
    Inventors: Han-Hung Chen, Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang
  • Patent number: 9492399
    Abstract: A method of treating a condition related to iron deficiency. The method includes steps of identifying a patient having a condition related to iron deficiency and administering an effective amount of biocompatible iron oxide nanoparticles to the patient. The biocompatible iron oxide nanoparticles each contains an iron oxide core that is covered by one or more biocompatible polymers, each of which has a polyethylene glycol group, a silane group, and a linker linking, via a covalent bond, the polyethylene glycol group and the silane group.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: November 15, 2016
    Assignee: MegaPro Biomedical Co., Ltd.
    Inventors: Chih-Lung Chen, Wen-Yuan Hsieh, Chen-Hsuan Lin, Su-Yo Lin, Shin-Yi Huang, Yuan-Hung Hsu, Shian-Jy Wang, Hsin Jung Huang
  • Publication number: 20160008292
    Abstract: A method of treating a condition related to iron deficiency. The method includes steps of identifying a patient having a condition related to iron deficiency and administering an effective amount of biocompatible iron oxide nanoparticles to the patient. The biocompatible iron oxide nanoparticles each contains an iron oxide core that is covered by one or more biocompatible polymers, each of which has a polyethylene glycol group, a silane group, and a linker linking, via a covalent bond, the polyethylene glycol group and the silane group.
    Type: Application
    Filed: July 10, 2015
    Publication date: January 14, 2016
    Inventors: Chih-Lung Chen, Wen-Yuan Hsieh, Chen-Hsuan Lin, Su-Yo Lin, Shin-Yi Huang, Yuan-Hung Hsu, Shian-Jy Wang, Hsin Jung Huang
  • Patent number: 8420119
    Abstract: This present disclosure relates to pharmaceutical compositions for treating tumors using a polymeric micelle encapsulating an anti-tumor drug. The polymeric micelle comprises block copolymers comprising at least one hydrophilic block, at least one hydrophobic block, and at least one zwitterion. The present disclosure also relates to methods of enhancing the solubility of such drugs, methods of increasing the blood circulating time of such drugs, and methods of delivering such drugs to one or more solid tumors.
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: April 16, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Hung Hsu, Chu-Chun Hsueh, Yuan-Chia Chang, Jui-Mei Lu, Pei Kan
  • Publication number: 20120100220
    Abstract: This present disclosure relates to pharmaceutical compositions for treating tumors using a polymeric micelle encapsulating an anti-tumor drug. The polymeric micelle comprises block copolymers comprising at least one hydrophilic block, at least one hydrophobic block, and at least one zwitterion. The present disclosure also relates to methods of enhancing the solubility of such drugs, methods of increasing the blood circulating time of such drugs, and methods of delivering such drugs to one or more solid tumors.
    Type: Application
    Filed: August 20, 2009
    Publication date: April 26, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Hung Hsu, Chu-Chun Hsueh, Yuan-Chia Chang, Jui-Mei Lu, Pei Kan
  • Patent number: 8124128
    Abstract: An amphiphilic block copolymer. The amphiphilic block copolymer includes one or more hydrophilic polymers, one or more hydrophobic polymer, and one or more zwitterions. The invention also provides a nano particle and carrier comprising the amhpiphilic block copolymer for delivery of water-insoluble drugs, growth factors, genes, or cosmetic substances.
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: February 28, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Fa Hsieh, Hsuen-Tseng Chang, Chin-Fu Chen, Yuan-Chia Chang, Pei Kan, Tsai-Yu Lin, Yuan-Hung Hsu
  • Patent number: 7917565
    Abstract: A high-speed radix-4 butterfly module and the method of performing Viterbi decoding using the same. The high-speed radix-4 butterfly module includes first to fourth add-compare-select (ACS) circuits. The first and the second ACS circuits receive first to fourth branch metric values and first to fourth previous-stage path metric values, and accordingly produces a first and a second path metric values. The third and the fourth ACS circuits receive fifth to eighth branch metric values and the first to the fourth previous-stage path metric values, and accordingly produces a third and a fourth path metric values. The radix-4 butterfly unit of the invention uses the symmetric relation to reduce an amount of branch computation required for each radix-4 butterfly unit to a half. Thus, the circuit complexity of the typical radix-4 butterfly module and the hardware cost of the Viterbi decoder are reduced.
    Type: Grant
    Filed: May 8, 2007
    Date of Patent: March 29, 2011
    Assignee: Tatung Company
    Inventors: Tsung-Sheng Kuo, Chau-Yun Hsu, Yuan-Hung Hsu
  • Publication number: 20080162617
    Abstract: A high-speed radix-4 butterfly module and the method of performing Viterbi decoding using the same. The high-speed radix-4 butterfly module includes first to fourth add-compare-select (ACS) circuits. The first and the second ACS circuits receive first to fourth branch metric values and first to fourth previous-stage path metric values, and accordingly produces a first and a second path metric values. The third and the fourth ACS circuits receive fifth to eighth branch metric values and the first to the fourth previous-stage path metric values, and accordingly produces a third and a fourth path metric values. The radix-4 butterfly unit of the invention uses the symmetric relation to reduce an amount of branch computation required for each radix-4 butterfly unit to a half. Thus, the circuit complexity of the typical radix-4 butterfly module and the hardware cost of the Viterbi decoder are reduced.
    Type: Application
    Filed: May 8, 2007
    Publication date: July 3, 2008
    Applicant: Tatung Company
    Inventors: Tsung-Sheng Kuo, Chau-Yun Hsu, Yuan-Hung Hsu