Patents by Inventor Yuan-Hung Hsu
Yuan-Hung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220080057Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.Type: ApplicationFiled: November 24, 2021Publication date: March 17, 2022Inventors: Wen-Yuan Hsieh, Yuan-Hung Hsu, Chia-Wen Huang, Ming-Cheng Wei, Chih-Lung Chen, Shian-Jy Wang
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Publication number: 20210320076Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate. Therefore, the arrangement of the bump body and the metal auxiliary layer allows complete reaction of the IMCs after reflowing the solder layer, and the volume of the conductive structures will not continue to shrink. As such, the problem of cracking of the conductive structures can be effectively averted.Type: ApplicationFiled: July 7, 2020Publication date: October 14, 2021Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Publication number: 20210287962Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.Type: ApplicationFiled: May 12, 2020Publication date: September 16, 2021Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Patent number: 11102890Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.Type: GrantFiled: November 27, 2018Date of Patent: August 24, 2021Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Ying-Chang Tseng, Yuan-Hung Hsu, Chang-Fu Lin
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Patent number: 11069661Abstract: An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.Type: GrantFiled: June 23, 2020Date of Patent: July 20, 2021Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wei-Jhen Chen, Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Publication number: 20210082837Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.Type: ApplicationFiled: May 6, 2020Publication date: March 18, 2021Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
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Publication number: 20210068260Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.Type: ApplicationFiled: November 2, 2020Publication date: March 4, 2021Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Patent number: 10863626Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.Type: GrantFiled: October 31, 2019Date of Patent: December 8, 2020Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
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Publication number: 20200360287Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.Type: ApplicationFiled: May 16, 2019Publication date: November 19, 2020Inventors: Ming-Cheng Wei, Yuan-Hung Hsu, Wen-Yuan Hsieh, Chia-Wen Huang, Chih-Lung Chen, Jhih-Yun Jian, Shian-Jy Wang
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Publication number: 20200258871Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.Type: ApplicationFiled: April 23, 2020Publication date: August 13, 2020Inventors: Han-Hung Chen, Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang
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Publication number: 20200093006Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.Type: ApplicationFiled: November 27, 2018Publication date: March 19, 2020Inventors: Ying-Chang Tseng, Yuan-Hung Hsu, Chang-Fu Lin
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Publication number: 20190247522Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.Type: ApplicationFiled: November 29, 2018Publication date: August 15, 2019Inventors: Wen-Yuan Hsieh, Yuan-Hung Hsu, Chia-Wen Huang, Ming-Cheng Wei, Chih-Lung Chen, Shian-Jy Wang
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Publication number: 20180288886Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.Type: ApplicationFiled: January 9, 2018Publication date: October 4, 2018Inventors: Han-Hung Chen, Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang
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Patent number: 9492399Abstract: A method of treating a condition related to iron deficiency. The method includes steps of identifying a patient having a condition related to iron deficiency and administering an effective amount of biocompatible iron oxide nanoparticles to the patient. The biocompatible iron oxide nanoparticles each contains an iron oxide core that is covered by one or more biocompatible polymers, each of which has a polyethylene glycol group, a silane group, and a linker linking, via a covalent bond, the polyethylene glycol group and the silane group.Type: GrantFiled: July 10, 2015Date of Patent: November 15, 2016Assignee: MegaPro Biomedical Co., Ltd.Inventors: Chih-Lung Chen, Wen-Yuan Hsieh, Chen-Hsuan Lin, Su-Yo Lin, Shin-Yi Huang, Yuan-Hung Hsu, Shian-Jy Wang, Hsin Jung Huang
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Publication number: 20160008292Abstract: A method of treating a condition related to iron deficiency. The method includes steps of identifying a patient having a condition related to iron deficiency and administering an effective amount of biocompatible iron oxide nanoparticles to the patient. The biocompatible iron oxide nanoparticles each contains an iron oxide core that is covered by one or more biocompatible polymers, each of which has a polyethylene glycol group, a silane group, and a linker linking, via a covalent bond, the polyethylene glycol group and the silane group.Type: ApplicationFiled: July 10, 2015Publication date: January 14, 2016Inventors: Chih-Lung Chen, Wen-Yuan Hsieh, Chen-Hsuan Lin, Su-Yo Lin, Shin-Yi Huang, Yuan-Hung Hsu, Shian-Jy Wang, Hsin Jung Huang
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Patent number: 8420119Abstract: This present disclosure relates to pharmaceutical compositions for treating tumors using a polymeric micelle encapsulating an anti-tumor drug. The polymeric micelle comprises block copolymers comprising at least one hydrophilic block, at least one hydrophobic block, and at least one zwitterion. The present disclosure also relates to methods of enhancing the solubility of such drugs, methods of increasing the blood circulating time of such drugs, and methods of delivering such drugs to one or more solid tumors.Type: GrantFiled: August 20, 2009Date of Patent: April 16, 2013Assignee: Industrial Technology Research InstituteInventors: Yuan-Hung Hsu, Chu-Chun Hsueh, Yuan-Chia Chang, Jui-Mei Lu, Pei Kan
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Publication number: 20120100220Abstract: This present disclosure relates to pharmaceutical compositions for treating tumors using a polymeric micelle encapsulating an anti-tumor drug. The polymeric micelle comprises block copolymers comprising at least one hydrophilic block, at least one hydrophobic block, and at least one zwitterion. The present disclosure also relates to methods of enhancing the solubility of such drugs, methods of increasing the blood circulating time of such drugs, and methods of delivering such drugs to one or more solid tumors.Type: ApplicationFiled: August 20, 2009Publication date: April 26, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yuan-Hung Hsu, Chu-Chun Hsueh, Yuan-Chia Chang, Jui-Mei Lu, Pei Kan
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Patent number: 8124128Abstract: An amphiphilic block copolymer. The amphiphilic block copolymer includes one or more hydrophilic polymers, one or more hydrophobic polymer, and one or more zwitterions. The invention also provides a nano particle and carrier comprising the amhpiphilic block copolymer for delivery of water-insoluble drugs, growth factors, genes, or cosmetic substances.Type: GrantFiled: November 8, 2005Date of Patent: February 28, 2012Assignee: Industrial Technology Research InstituteInventors: Ming-Fa Hsieh, Hsuen-Tseng Chang, Chin-Fu Chen, Yuan-Chia Chang, Pei Kan, Tsai-Yu Lin, Yuan-Hung Hsu
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Patent number: 7917565Abstract: A high-speed radix-4 butterfly module and the method of performing Viterbi decoding using the same. The high-speed radix-4 butterfly module includes first to fourth add-compare-select (ACS) circuits. The first and the second ACS circuits receive first to fourth branch metric values and first to fourth previous-stage path metric values, and accordingly produces a first and a second path metric values. The third and the fourth ACS circuits receive fifth to eighth branch metric values and the first to the fourth previous-stage path metric values, and accordingly produces a third and a fourth path metric values. The radix-4 butterfly unit of the invention uses the symmetric relation to reduce an amount of branch computation required for each radix-4 butterfly unit to a half. Thus, the circuit complexity of the typical radix-4 butterfly module and the hardware cost of the Viterbi decoder are reduced.Type: GrantFiled: May 8, 2007Date of Patent: March 29, 2011Assignee: Tatung CompanyInventors: Tsung-Sheng Kuo, Chau-Yun Hsu, Yuan-Hung Hsu
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Publication number: 20080162617Abstract: A high-speed radix-4 butterfly module and the method of performing Viterbi decoding using the same. The high-speed radix-4 butterfly module includes first to fourth add-compare-select (ACS) circuits. The first and the second ACS circuits receive first to fourth branch metric values and first to fourth previous-stage path metric values, and accordingly produces a first and a second path metric values. The third and the fourth ACS circuits receive fifth to eighth branch metric values and the first to the fourth previous-stage path metric values, and accordingly produces a third and a fourth path metric values. The radix-4 butterfly unit of the invention uses the symmetric relation to reduce an amount of branch computation required for each radix-4 butterfly unit to a half. Thus, the circuit complexity of the typical radix-4 butterfly module and the hardware cost of the Viterbi decoder are reduced.Type: ApplicationFiled: May 8, 2007Publication date: July 3, 2008Applicant: Tatung CompanyInventors: Tsung-Sheng Kuo, Chau-Yun Hsu, Yuan-Hung Hsu