Abstract: The present invention provides a method for integrated utilization of a calcium chloride solution and CO2. In this method, with the calcium chloride solution and the CO2 being taken as raw materials, a water-soluble amine is added as an auxiliary agent to promote the occurrence of a mineralization reaction. As a result of crystallization following the reaction, calcium carbonate and a solution of a hydrochloride of the water-soluble amine are obtained. After the reaction is completed, the water-soluble amine is regenerated by subjecting a liquid phase resulting from separation to bipolar membrane electrodialysis, and dilute hydrochloric acid is obtained as a by-product at the same time. The method provides a novel perspective and approach to integrated utilization of calcium chloride-containing liquid waste and flue gas CO2. The water-soluble amine allows excellent mineralization, and the bipolar membrane electrodialysis enables excellent regeneration of the amine.

Abstract: The invention discloses a blockchain-based intrusion detection system for railway signal, which is built on a blockchain's distributed chain structure, without a central, trusted control center. This design mitigates the vulnerabilities associated with centralized intrusion detection centers. Additionally, by utilizing a blockchain-based distributed structure, it also eliminates the risk of a single point of failure for the intrusion detection center. Moreover, the data within the blockchain-based intrusion detection system is highly resistant to malicious tampering. This is achieved by leveraging the consensus mechanism inherent in the blockchain, which can achieve consensus among intrusion detection nodes. The current invention solves the internal evil attacks and avoid the inability to reach consensus between nodes due to internal evil, thereby affecting the intrusion detection performance; at the same time, the intrusion detection model can resist external network attacks.

Abstract: A system for providing tactile feedback to a user includes a device comprising a touch surface to be touched by the user, one or more thermal elements distributed across the touch surface of the device and configured to heat the touch surface and thereby modulate the friction between the user's skin and the touch surface, and a controller connected to the one or more thermal elements and configured to control the operation of the one or more thermal elements to provide a plurality of predefined temperature distributions across the touch surface.

Abstract: A mark for overlay error measurement and overlay error measurement is provided. The mark includes a first pattern and a second pattern. The first pattern is disposed on a first surface of a substrate. The second pattern is disposed on a second surface of the substrate. The second surface of the substrate is opposite to the first surface of the substrate. The first pattern overlaps at least a portion of the second pattern, and the first pattern and the second pattern collaboratively define a first overlay error.

Abstract: The present disclosure provides a radiation inspection system, including a container respectively provided with an entrance and an exit on opposite side walls thereof; and a radiation scanning imaging device disposed in the container and having an inspection channel. The radiation scanning imaging device includes a ray source, the ray source includes ray generators, and ray generators are configured to emit ray beams at different angles, so that the radiation scanning imaging device performs radiation scanning inspection on an object to be inspected passing through the inspection channel from the entrance to the exit.

Abstract: The present disclosure provides a radiation inspection device, which has a transportation state and a working state, and includes a container with an adjustable width, and the width of the container in the transportation state is smaller than that in the working state; a radiation inspection apparatus arranged in the container and including a radiation source and a detector, and in the transportation state, the length of the radiation inspection apparatus is arranged along the length direction of the container, and in the working state, the length of the radiation inspection apparatus is arranged along the width direction of the container to perform radiation scanning inspection on vehicles passing through the container along the length direction; a rotating apparatus arranged in the container and configured to rotate the radiation inspection apparatus when the radiation inspection device is switched between the transportation state and the working state.

Abstract: An object detection device is provided, including: a support structure, a ray source assembly, and a detector assembly. The support structure is configured to form a passageway for a passage of a detected object; the ray source assembly is configured to emit a ray; and the detector assembly includes a detector mounting frame connected to the support structure and a plurality of detection units arranged on the detector mounting frame, the detection unit being configured to receive a transmission ray penetrating the detected object and obtain a detection information based on the transmission ray; the support structure includes a vertical support arm having an adjustable height, and a vertical distance from the ray source assembly to a bottom portion of the support structure varies with a height of the vertical support arm. Another object detection device is further provided, including a ray source assembly, a detector assembly and a controller.

Abstract: Embodiments are described for placing a watermark over application windows in a desktop. For each application window that is opened in the desktop, the system can determine whether the application requires a watermark, for example, based on a predefined list that specifies which applications require watermarks. For each application window that requires a watermark, a uncovered watermark region can be calculated where the watermark will appear. An overlay can be placed over the application windows, for example in a top-level window that does not receive mouse and keyboard inputs, and the watermark can be drawn in the overlay over the location of the uncovered watermark region of each application. As a result, watermarks can be placed over a plurality of specified application windows in an efficient and convenient manner.

Abstract: A method of making an integrated circuit includes dividing, in a first layer of an integrated circuit layout, a first arrangement of metal lines into a first set of metal lines and a second set of metal lines, wherein the first set of metal lines is between the second set of metal lines and a periphery of the integrated circuit layout, wherein the first arrangement of metal lines is configured to electrically connect to a plurality of contacts connected to a second layer of the integrated circuit layout after a manufacturing process. The method further includes adjusting a metal line perimeter of at least one metal line in the second set of metal lines to make a second arrangement of metal lines, wherein each adjusted metal line perimeter is separated from contacts in the second layer of the integrated circuit layout by at least a check distance.

Abstract: A method for overlay error correction includes generating a first overlay error based on a first overlay mark, wherein the first overlay error is indicative of a misalignment between a lower pattern and an upper pattern of the first overlay mark. The method also includes generating a second overlay error based on a second overlay mark, in response to an abnormal of the first overlay error is detected. The method further includes determining whether the abnormal of the first overlay error is caused by the misalignment between the lower pattern and the upper pattern depending on the second overlay error.

Abstract: A method includes steps of dividing a first arrangement of metal lines in a circuit layout into two sets of metal lines, a first set of metal lines in a peripheral area, and a second set of metal lines in a center area. The arrangement of metal lines is configured to electrically connect to contacts of a second layer of the circuit layout. The method includes adjusting a metal line perimeter of at least one metal line in the center area to make a second arrangement of metal lines, where each adjusted metal line perimeter is separated from contacts in the second layer of the integrated circuit layout by at least a check distance.

Abstract: A light-emitting diode (LED) display device, including a substrate, a de-mura region, a plurality of mounting blocks, a first LED chip array and a second LED chip array, is disclosed. The substrate includes a first region and a second region adjacent to each other. The de-mura region includes part of the first region and part of the second region. The mounting blocks are arranged in the first and the second region as an array, each mounting block including a first and a second mounting part. The first and the second mounting part are connected in parallel. The first LED chip array includes multiple first LED chips. The second LED chip array includes multiple second LED chips. Each first mounting part is arranged on the first side of the corresponding mounting block, and each second mounting part is arranged on the second side of the corresponding mounting block.

Abstract: A method for overlay error correction includes generating a first overlay error based on a first overlay mark, wherein the first overlay error is indicative of a misalignment between a lower pattern and an upper pattern of the first overlay mark. The method also includes generating a second overlay error based on a second overlay mark, in response to an abnormal of the first overlay error is detected. The method further includes determining whether the abnormal of the first overlay error is caused by the misalignment between the lower pattern and the upper pattern depending on the second overlay error.

Abstract: The present disclosure provides a method for overlay error correction. The method includes: obtaining an overlay error based on a lower-layer pattern and an upper-layer pattern of a wafer, wherein the lower-layer pattern is obtained by first fabrication equipment through which the wafer passes, and the upper-layer pattern is obtained by exposure equipment; generating a corrected overlay error based on the overlay error and fabrication processes performed on the wafer after the first fabrication equipment and prior to the exposure equipment; and adjusting the exposure equipment based on the corrected overlay error.

Abstract: The present disclosure provides a mark for overlay error measurement. The mark includes a first pattern and a second pattern. The first pattern is disposed on a substrate and at a first horizontal level. The first pattern includes a plurality of first sub-patterns and a plurality of second sub-patterns. The first sub-patterns extend along a first direction and are arranged along a second direction different from the first direction. The second sub-patterns are arranged along the second direction, wherein a profile of each of the plurality of first sub-patterns is different from a profile of each of the plurality of second sub-patterns. The second pattern is disposed at a second horizontal level different from the first horizontal level.

Abstract: A mark for overlay error measurement and overlay error measurement is provided. The mark includes a first pattern and a second pattern. The first pattern is disposed on a first surface of a substrate. The second pattern is disposed on a second surface of the substrate. The second surface of the substrate is opposite to the first surface of the substrate. The first pattern overlaps at least a portion of the second pattern, and the first pattern and the second pattern collaboratively define a first overlay error.

Abstract: A method of manufacturing a semiconductor device structure is provided. The method includes: providing a substrate; forming a photoresist layer on the substrate; patterning the photoresist layer to form a patterned photoresist layer; forming a pitch adjustment layer on the patterned photoresist layer to define a mask pattern; and determining whether the mask pattern meets a specification of semiconductor fabrication processes; when it is determined that the mask does not meet the specification of semiconductor fabrication processes, performing a rework operation to remove the pitch adjustment layer.

Abstract: A light-emitting diode display panel includes a driving substrate, and a first light-emitting region and a second light-emitting region disposed on the driving substrate. The first light-emitting region has a first region and a second region adjacent to the first region in the first direction. The second light-emitting region is adjacent to the first light-emitting region and has a first corresponding region. The second region is between the first region and the first corresponding region. The light-emitting diode display panel further includes pixels disposed in the first region, the second region, and the first corresponding region. Each pixel includes a first light-emitting unit. The first pitch is between the first light-emitting units in the first region and in the second region. The second pitch is between the first light-emitting units in the second region and the first corresponding region. The first pitch is shorter than the second pitch.