Abstract: A projection exposure apparatus is disclosed, including a focal plane measuring system (8) and an alignment measuring system (9) both disposed between a reticle stage (3) and a substrate stage (4). The alignment measuring system (9) is capable of focusing. The focal plane measuring system (8) measures variation in the surface profile of a substrate (5), and the alignment measuring system (9) effectuates focusing based on data obtained from the measurement performed by the focal plane measuring system (8). After the completion of the focusing, coordinates of various points on the substrate (5) in the alignment measuring system (9) are those of the points that have experienced the profile variation of the substrate (5). A relative positional relationship between the reticle (2) and the substrate (5) that has undergone the profile variation can be computationally derived from the changes in the coordinates of the points, and compensation can be accomplished by moving the substrate stage (4).

Abstract: A projection exposure apparatus is disclosed, including a focal plane measuring system (8) and an alignment measuring system (9) both disposed between a reticle stage (3) and a substrate stage (4). The alignment measuring system (9) is capable of focusing. The focal plane measuring system (8) measures variation in the surface profile of a substrate (5), and the alignment measuring system (9) effectuates focusing based on data obtained from the measurement performed by the focal plane measuring system (8). After the completion of the focusing, coordinates of various points on the substrate (5) in the alignment measuring system (9) are those of the points that have experienced the profile variation of the substrate (5). A relative positional relationship between the reticle (2) and the substrate (5) that has undergone the profile variation can be computationally derived from the changes in the coordinates of the points, and compensation can be accomplished by moving the substrate stage (4).

Abstract: In an exposure apparatus and a method for defocus and tilt error compensation, each of alignment sensors (500a, 500b, 500c, 500d, 500e, 500f) corresponds to and has the same coordinate in the first direction as a respective one of focusing sensors (600a, 600b, 600c, 600d, 600e, 600f), so that each of the alignment sensors (500a, 500b, 500c, 500d, 500e, 500f) is arranged on the same straight line as a respective one of the focusing sensors (600a, 600b, 600c, 600d, 600e, 600f). As such, alignment marks can be characterized with both focusing information and alignment information. This enables the correction of errors in the alignment information and thus achieves defocus and tilt error compensation, resulting in significant improvements in alignment accuracy and the production yield.

Abstract: In an exposure apparatus and a method for defocus and tilt error compensation, each of alignment sensors (500a, 500b, 500c, 500d, 500e, 500f) corresponds to and has the same coordinate in the first direction as a respective one of focusing sensors (600a, 600b, 600c, 600d, 600e, 600f), so that each of the alignment sensors (500a, 500b, 500c, 500d, 500e, 500f) is arranged on the same straight line as a respective one of the focusing sensors (600a, 600b, 600c, 600d, 600e, 600f). As such, alignment marks can be characterized with both focusing information and alignment information. This enables the correction of errors in the alignment information and thus achieves defocus and tilt error compensation, resulting in significant improvements in alignment accuracy and the production yield.

Abstract: A backside alignment apparatus and method for determining a position relationship between a substrate (6) and a workpiece stage (24). The backside alignment apparatus includes: an illumination apparatus (1) for emanating infrared light; a workpiece stage assembly (2) for supporting and moving the substrate (6); an imaging apparatus (3) for detecting alignment marks and calculating positions of the alignment marks, the alignment marks including a reference plate alignment mark (41) and a backside alignment mark (20); and a reference plate assembly (4) for setting up a relationship between position coordinates of the imaging apparatus (3) and the workpiece stage assembly (2). The illumination apparatus (1) and the imaging apparatus (3) are able to illuminate and align different alignment marks using only one set of illumination apparatus.

Abstract: A backside alignment apparatus and method for determining a position relationship between a substrate (6) and a workpiece stage (24). The backside alignment apparatus includes: an illumination apparatus (1) for emanating infrared light; a workpiece stage assembly (2) for supporting and moving the substrate (6); an imaging apparatus (3) for detecting alignment marks and calculating positions of the alignment marks, the alignment marks including a reference plate alignment mark (41) and a backside alignment mark (20); and a reference plate assembly (4) for setting up a relationship between position coordinates of the imaging apparatus (3) and the workpiece stage assembly (2). The illumination apparatus (1) and the imaging apparatus (3) are able to illuminate and align different alignment marks using only one set of illumination apparatus.