Abstract: A flip-chip LED module fabrication method includes the steps of (a) growing an epitaxial layer consisting of a N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer on a wafer substrate, (b) dividing the wafer into individual light-emitting chips, (c) selecting qualified light-emitting chips, (d) coating an UV-curable adhesive on o a film and then bonding the selected light-emitting chips to the film by means of the UV-curable adhesive, (e) curing the UV-curable adhesive with ultraviolet rays, and (f) operating push-up needles of an equipment to knock the opposite side of the film to let the light-emitting chips be separated from the film without causing damage.

Abstract: A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality of lead-mounting holes. Each of the first and second insert legs has a connecting end connected to the lead-mounting plate, and a free end opposite to the connecting end. Each of the first and second insert legs is reduced in width from the connecting end to the free end.

Abstract: A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality of lead-mounting holes. Each of the first and second insert legs has a connecting end connected to the lead-mounting plate, and a free end opposite to the connecting end. Each of the first and second insert legs is reduced in width from the connecting end to the free end.

Abstract: A head lamp assembly includes a reflection member with a lamp located at a focus of the reflection member and a fixed board is fixed to the reflection member. A recess is defined in a top edge of the fixed board a high beam reflected from the reflection member passes through the recess. An electromagnetic valve is connected to a connection portion perpendicularly extending from the fixed board and located beside the reflection member. A barrier plate is pivotably connected to the fixed board by a pivot and normally blocks the recess of the fixed board. The barrier plate is pivoted away from the recess when the electromagnetic valve is operated. The electromagnetic valve is affected by the high temperature by the fixed board.

Abstract: An illuminating device includes an illuminating unit including a light source that is mounted on a base board and that has a first number of first light emitting diodes and a second number of second light emitting diodes. Each of the first and second light emitting diodes of the light source has a light-emitting area. The light-emitting area of each first light emitting diode has a maximum horizontal width, and a maximum vertical width smaller than the maximum horizontal width of the light-emitting area of a corresponding first light emitting diode. The light-emitting area of each second light emitting diode has a maximum vertical width, and a maximum horizontal width not greater than the maximum vertical width of the light-emitting area of a corresponding second light emitting diode.

Abstract: A light-emitting gallium nitride-based III-V group compound semiconductor device with enhanced brightness includes a substrate, a first-type conductive semiconductor layer, a light-emitting layer, a second-type conductive semiconductor layer, a transparent conductive layer, and two electrodes. During the manufacturing process of chips, a single or a pair of diamond scribing tool inclined in a certain angle is/are used, in combination with following breaking procedures, to make four sides of the chips of light emitting diode are trapezoid or parallelogram in the side view. Therefore, the external quantum efficiency of the light-emitting device is increased.