Patents by Inventor Yuehong Fan

Yuehong Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210345519
    Abstract: Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.
    Type: Application
    Filed: June 25, 2021
    Publication date: November 4, 2021
    Applicant: Intel Corporation
    Inventors: Wenbin Tian, Yingqiong Bu, Yanbing Sun, Yang Yao, Yuehong Fan, Ming Zhang, Casey Robert Winkel, Jin Yang, David Shia, Mohanraj Prabhugoud
  • Publication number: 20210289659
    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
    Type: Application
    Filed: April 27, 2020
    Publication date: September 16, 2021
    Applicant: Intel Corporation
    Inventors: Prabhakar SUBRAHMANYAM, Casey WINKEL, Yingqiong BU, Ming ZHANG, Yuehong FAN, Yi XIA, Ying-Feng PANG
  • Publication number: 20200260613
    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
    Type: Application
    Filed: April 27, 2020
    Publication date: August 13, 2020
    Applicant: Intel Corporation
    Inventors: Casey Winkel, Yingqiong Bu, Ming Zhang, Yuehong Fan