Abstract: The present invention provides a negative-type photosensitive resin composition capable of obtaining a cured film suppressing generation of development residues caused by a pigment and having high sensitivity and excellent heat resistance and light blocking capability. A negative-type photosensitive resin composition contains an alkali-soluble resin (A), a radical-polymerizable compound (B), a photopolymerization initiator (C1), and a pigment (D1).

Abstract: The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof.

Abstract: To provide a negative-type photosensitive resin composition that is highly sensitive and capable of formation of a low-taper pattern shape and that is capable of providing a cured film that is excellent in heat resistance. A negative-type photosensitive resin composition contains an (A) alkali-soluble resin, a (B) radical polymerizable compound, and a (C) photo initiator, the negative-type photosensitive resin composition being characterized in that the (A) alkali-soluble resin contains one or more species of resins selected from a (A-1) polyimide, a (A-2) polybenzoxazole, a (A-3) polyimide precursor, a (A-4) polybenzoxazole precursor, a (A-5) polysiloxane, and a (A-6) cardo based resin, and that the (B) radical polymerizable compound contains a compound having five ethylenic unsaturated bond groups in a (B-1) molecule, in an amount within the range of 51 to 99 mass %.

Abstract: An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape after development, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a negative photosensitive resin composition that forms the film. The negative photosensitive resin composition contains an (A) alkali-soluble resin, a (C1) photo initiator, and a (Da) black colorant, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of a (A1-1) polyimide, a (A1-2) polyimide precursor, a (A1-3) polybenzoxazole, and a (A1-4) polybenzoxazole precursor, and has a structural unit having a fluorine atom at a specific ratio, and the (C1) photo initiator contains an (C1-1) oxime ester-based photo initiator that has a specific structure.

Abstract: The present invention provides a negative type photosensitive resin composition having high sensitivity, excellent halftone characteristics, capability to form a small tapered pattern shape, and alkali-developability. The negative type photosensitive resin composition includes, as an alkali-soluble resin (A), at least a weakly acidic group-containing resin (A1) and an unsaturated group-containing resin (A2), the weakly acidic group-containing resin (A1) containing an acidic group having an acid dissociation constant in the range of 13.0 to 23.0 in dimethyl sulfoxide, and the unsaturated group-containing resin (A2) containing an ethylenically unsaturated double bond group.

Abstract: To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

Abstract: A problem to be addressed by the present invention is to obtain: a cured film that has high sensitivity, makes it possible to prevent generation of a development residue arising from a pigment, and has excellent heat resistance and light-blocking ability; and a negative photosensitive resin composition that is formed into the cured film.

Abstract: To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

Abstract: An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a photosensitive resin composition that forms the film. The photosensitive resin composition contains an (A) alkali-soluble resin, a (C) photosensitive agent, a (Da) black colorant, and a (F) a cross-linking agent, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of: a specific (A1-1) polyimide; a (A1-2) polyimide precursor; a (A1-3) polybenzoxazole; and a (A1-4) polybenzoxazole precursor, and contains a structural unit having a fluorine atom at a specific ratio, the content ratio of the (Da) black colorant is a specific ratio, and the (F) cross-linking agent contains an epoxy compound that has a specific structure, and/or an epoxy resin that has a specific structural unit.

Abstract: Provided is a black pigment that enables pattern formation of pixel division layer while suppressing generation of development residue. The black pigment comprises (a) a core containing at least one organic black pigment selected from the group consisting of benzodifuranone-based black pigments, perylene-based black pigments, azo-based black pigments, and isomers thereof and (b) a coating layer containing silica and/or a metal oxide and/or a metal hydroxide.

Abstract: The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof.

Abstract: The present invention provides a photosensitive resin composition which has a light-blocking property, and at the same time, a high sensitivity, and has excellent half-tone characteristics. The present invention provides a photosensitive resin composition including an (A) alkali-soluble resin, a (B) radically polymerizable compound, a (C) photo initiator, and a (D) colorant, where the (A) alkali-soluble resin contains a polyimide, a polyimide precursor, a polybenzoxazole precursor, and/or a copolymer thereof, and the (B) radically polymerizable compound contains a (B-1) bifunctional or higher (meth)acrylic compound that has a glass transition temperature of 150° C. or higher as a homopolymer, and a (B-2) tetrafunctional or higher (meth)acrylic compound other than the (B-1).

Abstract: Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).

Abstract: The present invention provides a negative photosensitive resin composition that has high pigment dispersibility and stability and can reduce residues of unexposed portions during development. The present invention provides a negative photosensitive resin composition containing an (A) alkali-soluble resin, a (B) dispersant having an amine value exceeding 0, a (C) benzofuranone based organic pigment having an amide structure, a (D) radical polymerizable compound, and a (E) photoinitiator.

Abstract: To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).

Abstract: The present invention provides a negative-type photosensitive resin composition capable of obtaining a cured film suppressing generation of development residues caused by a pigment and having high sensitivity and excellent heat resistance and light blocking capability. A negative-type photosensitive resin composition contains an alkali-soluble resin (A), a radical-polymerizable compound (B), a photopolymerization initiator (C1), and a pigment (D1).

Abstract: Provided is a black pigment that enables pattern formation of pixel division layer while suppressing generation of development residue. The black pigment comprises (a) a core containing at least one organic black pigment selected from the group consisting of benzodifuranone-based black pigments, perylene-based black pigments, azo-based black pigments, and isomers thereof and (b) a coating layer containing silica and/or a metal oxide and/or a metal hydroxide.

Abstract: The present invention provides a negative type colored photosensitive resin composition that serves to produce a cured film having a forward tapered shape. This negative type colored photosensitive resin composition includes an alkali-soluble resin (A), a photo initiator (B), a photo polymerizable compound (C), and a coloring agent (D), the alkali-soluble resin (A) containing a polyimide precursor, polybenzoxazole precursor, and/or a copolymer thereof (A-1), each resin (A-1) having a trifluoromethyl group in the backbone chain.

Abstract: The present invention provides a negative type photosensitive resin composition having high sensitivity, excellent halftone characteristics, capability to form a small tapered pattern shape, and alkali-developability. The negative type photosensitive resin composition includes, as an alkali-soluble resin (A), at least a weakly acidic group-containing resin (A1) and an unsaturated group-containing resin (A2), the weakly acidic group-containing resin (A1) containing an acidic group having an acid dissociation constant in the range of 13.0 to 23.0 in dimethyl sulfoxide, and the unsaturated group-containing resin (A2) containing an ethylenically unsaturated double bond group.

Abstract: To provide a negative-type photosensitive resin composition that is highly sensitive and capable of formation of a low-taper pattern shape and that is capable of providing a cured film that is excellent in heat resistance. A negative-type photosensitive resin composition contains an (A) alkali-soluble resin, a (B) radical polymerizable compound, and a (C) photo initiator, the negative-type photosensitive resin composition being characterized in that the (A) alkali-soluble resin contains one or more species of resins selected from a (A-1) polyimide, a (A-2) polybenzoxazole, a (A-3) polyimide precursor, a (A-4) polybenzoxazole precursor, a (A-5) polysiloxane, and a (A-6) cardo based resin, and that the (B) radical polymerizable compound contains a compound having five ethylenic unsaturated bond groups in a (B-1) molecule, in an amount within the range of 51 to 99 mass %.