Patents by Inventor Yuh-Sen Chang
Yuh-Sen Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11000923Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.Type: GrantFiled: October 31, 2017Date of Patent: May 11, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shih-Yen Chen, Tzi-Yi Shieh, Yuh-Sen Chang, Chung-Li Lee
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Patent number: 10312118Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.Type: GrantFiled: January 16, 2014Date of Patent: June 4, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pei-Shan Wu, Yi-Ting Hu, Ming-Tan Lee, Yu-Lin Wang, Yuh-Sen Chang, Pin-Yi Shin, Wen-Ming Chen, Wei-Chih Chen, Chih-Yuan Chiu
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Patent number: 10163842Abstract: A semiconductor structure includes an interconnect structure, at least one first metal pad, at least one second metal pad, at least one first bump, at least one second bump, at least one photosensitive material, and a bonding layer. The first metal pad and the second metal pad are disposed on and electrically connected to the interconnect structure. The first bump is disposed on the first metal pad. The second bump is disposed on the second metal pad. The photosensitive material is disposed on the first bump. The bonding layer is in contact with the photosensitive material and the second bump. The photosensitive material is disposed between the first bump and the bonding layer.Type: GrantFiled: April 18, 2017Date of Patent: December 25, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chien-Hung Kuo, Chin-Yu Ku, Yuh-Sen Chang, Hon-Lin Huang, Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji Lii
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Publication number: 20180301430Abstract: A semiconductor structure includes an interconnect structure, at least one first metal pad, at least one second metal pad, at least one first bump, at least one second bump, at least one photosensitive material, and a bonding layer. The first metal pad and the second metal pad are disposed on and electrically connected to the interconnect structure. The first bump is disposed on the first metal pad. The second bump is disposed on the second metal pad. The photosensitive material is disposed on the first bump. The bonding layer is in contact with the photosensitive material and the second bump. The photosensitive material is disposed between the first bump and the bonding layer.Type: ApplicationFiled: April 18, 2017Publication date: October 18, 2018Inventors: Chien-Hung Kuo, Chin-Yu Ku, Yuh-Sen Chang, Hon-Lin Huang, Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji LII
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Publication number: 20180050425Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.Type: ApplicationFiled: October 31, 2017Publication date: February 22, 2018Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shih-Yen CHEN, Tzi-Yi SHIEH, Yuh-Sen CHANG, Chung-Li LEE
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Patent number: 9808891Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.Type: GrantFiled: January 16, 2014Date of Patent: November 7, 2017Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shih-Yen Chen, Tzi-Yi Shieh, Yuh-Sen Chang, Chung-Li Lee
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Patent number: 9761468Abstract: In accordance with some embodiments, a wafer taping device is provided. The wafer taping device includes a tape delivering along a first direction. The wafer taping device also includes a wafer mount unit disposed below the tape. The wafer mount unit has an upper surface for supporting a wafer and having a notch for allowing a cut mark of the wafer to align with it. The notch is staggered with a second direction in the upper surface, and the second direction is substantially perpendicular to the first direction. In addition, the wafer taping device includes a laminating roller disposed above the wafer mount unit and having a long axis elongated in the second direction. The laminating roller is configured to reciprocate along the first direction for pressing the tape to the wafer.Type: GrantFiled: February 17, 2014Date of Patent: September 12, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yuh-Sen Chang, Shang-Hsien Lin, Chih-Yang Chan, Szu-Hsien Lee, Chia-Haw Yeh
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Publication number: 20150235879Abstract: In accordance with some embodiments, a wafer taping device is provided. The wafer taping device includes a tape delivering along a first direction. The wafer taping device also includes a wafer mount unit disposed below the tape. The wafer mount unit has an upper surface for supporting a wafer and having a notch for allowing a cut mark of the wafer to align with it. The notch is staggered with a second direction in the upper surface, and the second direction is substantially perpendicular to the first direction. In addition, the wafer taping device includes a laminating roller disposed above the wafer mount unit and having a long axis elongated in the second direction. The laminating roller is configured to reciprocate along the first direction for pressing the tape to the wafer.Type: ApplicationFiled: February 17, 2014Publication date: August 20, 2015Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yuh-Sen CHANG, Shang-Hsien LIN, Chih-Yang CHAN, Szu-Hsien LEE, Chia-Haw YEH
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Publication number: 20150201502Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit.Type: ApplicationFiled: January 16, 2014Publication date: July 16, 2015Applicant: Taiwan Semiconductor Manufacturing CO., LTD.Inventors: Shih-Yen Chen, Tzi-Yi Shieh, Yuh-Sen Chang, Chung-Li Lee
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Publication number: 20150200118Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first transporting device, a second stage and a second transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second transporting device is used for transporting the second chip from the second chip stage onto the wafer.Type: ApplicationFiled: January 16, 2014Publication date: July 16, 2015Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pei-Shan WU, Yi-Ting HU, Ming-Tan LEE, Yu-Lin WANG, Yuh-Sen CHANG, Pin-Yi SHIN, Wen-Ming CHEN, Wei-Chih CHEN, Chih-Yuan CHIU
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Patent number: 7601466Abstract: A method for photolithography in semiconductor manufacturing includes providing a mask with first and second focus planes for a wafer. The wafer includes corresponding first and second wafer regions. The first wafer region receives a first image during a first exposure utilizing the first focus plane. The second wafer region receives a second image during a second exposure utilizing the second focus plane.Type: GrantFiled: February 9, 2005Date of Patent: October 13, 2009Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Sung Yen, Kuei Shun Chen, Chia-Sui Hsu, Yuh-Sen Chang, Hsiao-Tzu Lu
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Publication number: 20060177778Abstract: A method for photolithography in semiconductor manufacturing includes providing a mask with first and second focus planes for a wafer. The wafer includes corresponding first and second wafer regions. The first wafer region receives a first image during a first exposure utilizing the first focus plane. The second wafer region receives a second image during a second exposure utilizing the second focus plane.Type: ApplicationFiled: February 9, 2005Publication date: August 10, 2006Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Sung Yen, Kuei Chen, Chia-Sui Hsu, Yuh-Sen Chang, Hsiao-Tzu Lu