Patents by Inventor Yuhei MATSUMOTO

Yuhei MATSUMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12077522
    Abstract: The present invention provides a heterocyclic compound having an orexin type 2 receptor agonist activity. A compound represented by the formula (I): wherein each symbol is as described in the specification, or a salt thereof has an orexin type 2 receptor agonist activity, and is useful as an agent for the prophylaxis or treatment of narcolepsy.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: September 3, 2024
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Tatsuhiko Fujimoto, Koichiro Fukuda, Hiromichi Sugimoto, Kentaro Rikimaru, Yoshihiro Banno, Takahiro Matsumoto, Norihito Tokunaga, Yoshihide Tomata, Yuji Ishichi, Shogo Marui, Tsuneo Oda, Tohru Miyazaki, Yasutaka Hoashi, Yasushi Hattori, Yuichi Kajita, Yuhei Miyanohana, Tatsuki Koike
  • Publication number: 20240251505
    Abstract: The electrical element-mounting substrate includes a first substrate including a ceramic as a first base member, and a second substrate including an organic resin as a second base member. The first substrate has a first surface and a second surface opposite to the first surface. The first surface includes a first mounting region where an electrical element is mounted and an installation portion where a lens holder or a window material is installed. The installation portion is located around the first mounting region in a plan view. The second substrate is located on the second surface of the first substrate.
    Type: Application
    Filed: July 29, 2022
    Publication date: July 25, 2024
    Applicant: KYOCERA Corporation
    Inventors: Kazuhiro OKAMOTO, Masamitsu SHIBATA, Sentaro YAMAMOTO, Yuhei MATSUMOTO
  • Publication number: 20230282791
    Abstract: A wiring board includes a metal substrate, an insulating resin layer positioned on the metal substrate, the insulating resin layer including: a first surface facing the metal substrate, a second surface positioned opposite to the first surface, third surfaces positioned between the first surface and the second surface, first ridge portions where the first surface meets the third surfaces, second ridge portions where the second surface meets the third surfaces; and a first closed pore group closer to the first ridge portions than to the second ridge portions. The first closed pore group includes a plurality of closed pores densely contained.
    Type: Application
    Filed: July 21, 2021
    Publication date: September 7, 2023
    Applicant: KYOCERA Corporation
    Inventors: Kazuhiro OKAMOTO, Sentarou YAMAMOTO, Yuhei MATSUMOTO, Yoshihide OKAWA
  • Publication number: 20230160560
    Abstract: A substrate support body includes a support plate, an enclosure member, and a bonding material. The enclosure member is arranged on the support plate. The bonding material is arranged on an entire surface of an inner region of the enclosure member and is bonded to the support plate.
    Type: Application
    Filed: April 23, 2021
    Publication date: May 25, 2023
    Applicant: KYOCERA Corporation
    Inventors: Yuhei MATSUMOTO, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yoshihide OKAWA
  • Publication number: 20220367759
    Abstract: A light emitting element mounting package includes a substrate and an insulating layer, the insulating layer is provided on a first surface of the substrate and has a through hole that penetrates in a direction perpendicular to the first surface, and a wall surface facing the through hole has a stepped portion, in which a diameter of the through hole is small on the side closer to the substrate and is large on the side far from the substrate.
    Type: Application
    Filed: October 28, 2020
    Publication date: November 17, 2022
    Applicant: KYOCERA Corporation
    Inventors: Yuhei MATSUMOTO, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yoshihide OKAWA
  • Patent number: 11483067
    Abstract: An optical detection unit detects a return light and outputs a detection signal. An optical multiplexer/demultiplexer outputs the monitoring light to the optical transmission line, and outputs the return light to the optical detection unit. A processing unit detects a first timing at which the detection signal becomes less than a first threshold value, detects a second timing at which the detection signal becomes less than a second threshold value, and calculates a first change rate of the detection signal in a period between the first and second timings. The processing unit changes the first and second threshold values to calculate the first change rate for a plurality of periods, and, when a second change rate between the first change rates in two adjacent periods is greater than a threshold value, either of the first and second timings in one period is detected as the breakage position.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: October 25, 2022
    Assignee: NEC CORPORATION
    Inventors: Yuhei Matsumoto, Takefumi Oguma, Kazunori Shinya
  • Patent number: 11476930
    Abstract: An object is to automatically detect a failure of an optical transmission line. A light source outputs a monitoring light. An optical detection unit detects a return light from an optical transmission line and outputs a detection signal indicating an intensity of the return light. An optical multiplexer/demultiplexer outputs the monitoring light input from the light source to the optical transmission line, and outputs the return light input from the optical transmission line to the optical detection unit. A comparator compares the detection signal with a threshold voltage and outputs a comparison signal indicating the comparison result. A processing unit detects a first timing at which the comparison signal changes, and detects a failure of the optical transmission line when the first timing is earlier than a reference timing.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: October 18, 2022
    Assignee: NEC CORPORATION
    Inventors: Yuhei Matsumoto, Takefumi Oguma, Kazunori Shinya
  • Publication number: 20220328718
    Abstract: A light emitting element mounting package includes a substrate, an insulating layer, and a metal layer. The insulating layer includes a through hole penetrating in a thickness direction and is provided on the substrate. The metal layer is disposed on the substrate in at least the through hole, and includes a protruding portion extending from the substrate along an inner wall of the through hole. The protruding portion has the shape of a connected body in which metal particles are connected together. The inner wall of the insulating layer includes, closer to the substrate, an inclined surface where the through hole becomes wider, and the protruding portion contacts the inclined surface.
    Type: Application
    Filed: August 26, 2020
    Publication date: October 13, 2022
    Applicant: KYOCERA Corporation
    Inventors: Yoshihide OKAWA, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yuhei MATSUMOTO, Kazuki NISHIMOTO, Kouichirou SUGAI
  • Publication number: 20220158053
    Abstract: A joint body of the present disclosure includes a substrate including a base member having insulating properties and a metal layer positioned on a first main surface of the base member, a metal joint layer, and a metal member. The metal joint layer is positioned between the metal layer and the metal member of the substrate. The metal joint layer includes a nickel layer, a solder layer, and a composite layer containing a mix of nickel and solder. The nickel layer, the composite layer, and the solder layer are positioned in this order from the metal layer side to the metal member side. The nickel in the composite layer extends from the nickel layer in the thickness direction and forms protrusions and recesses.
    Type: Application
    Filed: March 5, 2020
    Publication date: May 19, 2022
    Applicant: KYOCERA Corporation
    Inventors: Sentarou YAMAMOTO, Youji FURUKUBO, Kazuhiro OKAMOTO, Yuhei MATSUMOTO, Kouichirou SUGAI, Kazuki NISHIMOTO
  • Publication number: 20220037250
    Abstract: A wiring board including: a frame base material; and a metal member, wherein the frame base material is formed in plate-shaped, and includes a through hole in a central region of the frame base material, the metal member includes a stage part and at least one bridge part, a width of the bridge part is equal to or narrower than a width of the stage part, the bridge part extending toward an outer side from the stage part, the stage part is arranged to be fit to the through hole, and the bridge part is arranged to be disposed facing the frame base material.
    Type: Application
    Filed: September 12, 2019
    Publication date: February 3, 2022
    Applicant: KYOCERA Corporation
    Inventors: Yuhei MATSUMOTO, Kazuhiro OKAMOTO, Aki KITABAYASHI, Sentarou YAMAMOTO, Youji FURUKUBO
  • Publication number: 20210328667
    Abstract: An object is to automatically detect a failure of an optical transmission line. A light source outputs a monitoring light. An optical detection unit detects a return light from an optical transmission line and outputs a detection signal indicating an intensity of the return light. An optical multiplexer/demultiplexer outputs the monitoring light input from the light source to the optical transmission line, and outputs the return light input from the optical transmission line to the optical detection unit. A comparator compares the detection signal with a threshold voltage and outputs a comparison signal indicating the comparison result. A processing unit detects a first timing at which the comparison signal changes, and detects a failure of the optical transmission line when the first timing is earlier than a reference timing.
    Type: Application
    Filed: April 25, 2019
    Publication date: October 21, 2021
    Applicant: NEC Corporation
    Inventors: Yuhei MATSUMOTO, Takefumi OGUMA, Kazunori SHINYA
  • Publication number: 20210194577
    Abstract: An optical detection unit detects a return light and outputs a detection signal. An optical multiplexer/demultiplexer outputs the monitoring light to the optical transmission line, and outputs the return light to the optical detection unit. A processing unit detects a first timing at which the detection signal becomes less than a first threshold value, detects a second timing at which the detection signal becomes less than a second threshold value, and calculates a first change rate of the detection signal in a period between the first and second timings. The processing unit changes the first and second threshold values to calculate the first change rate for a plurality of periods, and, when a second change rate between the first change rates in two adjacent periods is greater than a threshold value, either of the first and second timings in one period is detected as the breakage position.
    Type: Application
    Filed: April 25, 2019
    Publication date: June 24, 2021
    Applicant: NEC Corporation
    Inventors: Yuhei MATSUMOTO, Takefumi OGUMA, Kazunori SHINYA
  • Publication number: 20210159972
    Abstract: To provide a monitoring device capable of specifying an abnormality occurrence point without requiring much time, the monitoring device is provided with a reception means 1 for acquiring information about variation of the optical power level of a control signal transmitted to a transmission path and a monitoring means 2, when the variation of the optical power level of the control signal does not satisfy a prescribed condition, for monitoring the transmission path on the basis of back-scattered light of an optical pulse outputted to the transmission path.
    Type: Application
    Filed: July 23, 2019
    Publication date: May 27, 2021
    Applicant: NEC Corporation
    Inventor: Yuhei MATSUMOTO
  • Patent number: 10396002
    Abstract: The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: August 27, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Sentaro Yamamoto, Youji Furukubo, Masanori Okamoto, Yuhei Matsumoto
  • Publication number: 20180090405
    Abstract: The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.
    Type: Application
    Filed: March 17, 2016
    Publication date: March 29, 2018
    Inventors: Sentaro YAMAMOTO, Youji FURUKUBO, Masanori OKAMOTO, Yuhei MATSUMOTO