Patents by Inventor Yuhei MATSUMOTO
Yuhei MATSUMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12077522Abstract: The present invention provides a heterocyclic compound having an orexin type 2 receptor agonist activity. A compound represented by the formula (I): wherein each symbol is as described in the specification, or a salt thereof has an orexin type 2 receptor agonist activity, and is useful as an agent for the prophylaxis or treatment of narcolepsy.Type: GrantFiled: June 27, 2019Date of Patent: September 3, 2024Assignee: Takeda Pharmaceutical Company LimitedInventors: Tatsuhiko Fujimoto, Koichiro Fukuda, Hiromichi Sugimoto, Kentaro Rikimaru, Yoshihiro Banno, Takahiro Matsumoto, Norihito Tokunaga, Yoshihide Tomata, Yuji Ishichi, Shogo Marui, Tsuneo Oda, Tohru Miyazaki, Yasutaka Hoashi, Yasushi Hattori, Yuichi Kajita, Yuhei Miyanohana, Tatsuki Koike
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Publication number: 20240251505Abstract: The electrical element-mounting substrate includes a first substrate including a ceramic as a first base member, and a second substrate including an organic resin as a second base member. The first substrate has a first surface and a second surface opposite to the first surface. The first surface includes a first mounting region where an electrical element is mounted and an installation portion where a lens holder or a window material is installed. The installation portion is located around the first mounting region in a plan view. The second substrate is located on the second surface of the first substrate.Type: ApplicationFiled: July 29, 2022Publication date: July 25, 2024Applicant: KYOCERA CorporationInventors: Kazuhiro OKAMOTO, Masamitsu SHIBATA, Sentaro YAMAMOTO, Yuhei MATSUMOTO
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Publication number: 20230282791Abstract: A wiring board includes a metal substrate, an insulating resin layer positioned on the metal substrate, the insulating resin layer including: a first surface facing the metal substrate, a second surface positioned opposite to the first surface, third surfaces positioned between the first surface and the second surface, first ridge portions where the first surface meets the third surfaces, second ridge portions where the second surface meets the third surfaces; and a first closed pore group closer to the first ridge portions than to the second ridge portions. The first closed pore group includes a plurality of closed pores densely contained.Type: ApplicationFiled: July 21, 2021Publication date: September 7, 2023Applicant: KYOCERA CorporationInventors: Kazuhiro OKAMOTO, Sentarou YAMAMOTO, Yuhei MATSUMOTO, Yoshihide OKAWA
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Publication number: 20230160560Abstract: A substrate support body includes a support plate, an enclosure member, and a bonding material. The enclosure member is arranged on the support plate. The bonding material is arranged on an entire surface of an inner region of the enclosure member and is bonded to the support plate.Type: ApplicationFiled: April 23, 2021Publication date: May 25, 2023Applicant: KYOCERA CorporationInventors: Yuhei MATSUMOTO, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yoshihide OKAWA
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Publication number: 20220367759Abstract: A light emitting element mounting package includes a substrate and an insulating layer, the insulating layer is provided on a first surface of the substrate and has a through hole that penetrates in a direction perpendicular to the first surface, and a wall surface facing the through hole has a stepped portion, in which a diameter of the through hole is small on the side closer to the substrate and is large on the side far from the substrate.Type: ApplicationFiled: October 28, 2020Publication date: November 17, 2022Applicant: KYOCERA CorporationInventors: Yuhei MATSUMOTO, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yoshihide OKAWA
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Patent number: 11483067Abstract: An optical detection unit detects a return light and outputs a detection signal. An optical multiplexer/demultiplexer outputs the monitoring light to the optical transmission line, and outputs the return light to the optical detection unit. A processing unit detects a first timing at which the detection signal becomes less than a first threshold value, detects a second timing at which the detection signal becomes less than a second threshold value, and calculates a first change rate of the detection signal in a period between the first and second timings. The processing unit changes the first and second threshold values to calculate the first change rate for a plurality of periods, and, when a second change rate between the first change rates in two adjacent periods is greater than a threshold value, either of the first and second timings in one period is detected as the breakage position.Type: GrantFiled: April 25, 2019Date of Patent: October 25, 2022Assignee: NEC CORPORATIONInventors: Yuhei Matsumoto, Takefumi Oguma, Kazunori Shinya
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Patent number: 11476930Abstract: An object is to automatically detect a failure of an optical transmission line. A light source outputs a monitoring light. An optical detection unit detects a return light from an optical transmission line and outputs a detection signal indicating an intensity of the return light. An optical multiplexer/demultiplexer outputs the monitoring light input from the light source to the optical transmission line, and outputs the return light input from the optical transmission line to the optical detection unit. A comparator compares the detection signal with a threshold voltage and outputs a comparison signal indicating the comparison result. A processing unit detects a first timing at which the comparison signal changes, and detects a failure of the optical transmission line when the first timing is earlier than a reference timing.Type: GrantFiled: April 25, 2019Date of Patent: October 18, 2022Assignee: NEC CORPORATIONInventors: Yuhei Matsumoto, Takefumi Oguma, Kazunori Shinya
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Publication number: 20220328718Abstract: A light emitting element mounting package includes a substrate, an insulating layer, and a metal layer. The insulating layer includes a through hole penetrating in a thickness direction and is provided on the substrate. The metal layer is disposed on the substrate in at least the through hole, and includes a protruding portion extending from the substrate along an inner wall of the through hole. The protruding portion has the shape of a connected body in which metal particles are connected together. The inner wall of the insulating layer includes, closer to the substrate, an inclined surface where the through hole becomes wider, and the protruding portion contacts the inclined surface.Type: ApplicationFiled: August 26, 2020Publication date: October 13, 2022Applicant: KYOCERA CorporationInventors: Yoshihide OKAWA, Sentarou YAMAMOTO, Kazuhiro OKAMOTO, Yuhei MATSUMOTO, Kazuki NISHIMOTO, Kouichirou SUGAI
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Publication number: 20220158053Abstract: A joint body of the present disclosure includes a substrate including a base member having insulating properties and a metal layer positioned on a first main surface of the base member, a metal joint layer, and a metal member. The metal joint layer is positioned between the metal layer and the metal member of the substrate. The metal joint layer includes a nickel layer, a solder layer, and a composite layer containing a mix of nickel and solder. The nickel layer, the composite layer, and the solder layer are positioned in this order from the metal layer side to the metal member side. The nickel in the composite layer extends from the nickel layer in the thickness direction and forms protrusions and recesses.Type: ApplicationFiled: March 5, 2020Publication date: May 19, 2022Applicant: KYOCERA CorporationInventors: Sentarou YAMAMOTO, Youji FURUKUBO, Kazuhiro OKAMOTO, Yuhei MATSUMOTO, Kouichirou SUGAI, Kazuki NISHIMOTO
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Publication number: 20220037250Abstract: A wiring board including: a frame base material; and a metal member, wherein the frame base material is formed in plate-shaped, and includes a through hole in a central region of the frame base material, the metal member includes a stage part and at least one bridge part, a width of the bridge part is equal to or narrower than a width of the stage part, the bridge part extending toward an outer side from the stage part, the stage part is arranged to be fit to the through hole, and the bridge part is arranged to be disposed facing the frame base material.Type: ApplicationFiled: September 12, 2019Publication date: February 3, 2022Applicant: KYOCERA CorporationInventors: Yuhei MATSUMOTO, Kazuhiro OKAMOTO, Aki KITABAYASHI, Sentarou YAMAMOTO, Youji FURUKUBO
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Publication number: 20210328667Abstract: An object is to automatically detect a failure of an optical transmission line. A light source outputs a monitoring light. An optical detection unit detects a return light from an optical transmission line and outputs a detection signal indicating an intensity of the return light. An optical multiplexer/demultiplexer outputs the monitoring light input from the light source to the optical transmission line, and outputs the return light input from the optical transmission line to the optical detection unit. A comparator compares the detection signal with a threshold voltage and outputs a comparison signal indicating the comparison result. A processing unit detects a first timing at which the comparison signal changes, and detects a failure of the optical transmission line when the first timing is earlier than a reference timing.Type: ApplicationFiled: April 25, 2019Publication date: October 21, 2021Applicant: NEC CorporationInventors: Yuhei MATSUMOTO, Takefumi OGUMA, Kazunori SHINYA
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Publication number: 20210194577Abstract: An optical detection unit detects a return light and outputs a detection signal. An optical multiplexer/demultiplexer outputs the monitoring light to the optical transmission line, and outputs the return light to the optical detection unit. A processing unit detects a first timing at which the detection signal becomes less than a first threshold value, detects a second timing at which the detection signal becomes less than a second threshold value, and calculates a first change rate of the detection signal in a period between the first and second timings. The processing unit changes the first and second threshold values to calculate the first change rate for a plurality of periods, and, when a second change rate between the first change rates in two adjacent periods is greater than a threshold value, either of the first and second timings in one period is detected as the breakage position.Type: ApplicationFiled: April 25, 2019Publication date: June 24, 2021Applicant: NEC CorporationInventors: Yuhei MATSUMOTO, Takefumi OGUMA, Kazunori SHINYA
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Publication number: 20210159972Abstract: To provide a monitoring device capable of specifying an abnormality occurrence point without requiring much time, the monitoring device is provided with a reception means 1 for acquiring information about variation of the optical power level of a control signal transmitted to a transmission path and a monitoring means 2, when the variation of the optical power level of the control signal does not satisfy a prescribed condition, for monitoring the transmission path on the basis of back-scattered light of an optical pulse outputted to the transmission path.Type: ApplicationFiled: July 23, 2019Publication date: May 27, 2021Applicant: NEC CorporationInventor: Yuhei MATSUMOTO
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Patent number: 10396002Abstract: The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.Type: GrantFiled: March 17, 2016Date of Patent: August 27, 2019Assignee: KYOCERA CORPORATIONInventors: Sentaro Yamamoto, Youji Furukubo, Masanori Okamoto, Yuhei Matsumoto
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Publication number: 20180090405Abstract: The present invention includes: a substrate 3, a rectangular frame-shaped substrate bank section 5 provided on the substrate 3 and including four corner portions 5A, and a metal layer 9 provided on a top surface 5Aa of the substrate bank section 5. A top surface 5Aa of the corner portions 5A of the substrate bank section 5 may have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layer 9 provided on the substrate bank section 5 of the electronic component storage substrate.Type: ApplicationFiled: March 17, 2016Publication date: March 29, 2018Inventors: Sentaro YAMAMOTO, Youji FURUKUBO, Masanori OKAMOTO, Yuhei MATSUMOTO